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Integrated microelectromechanical switches and related methods

A kind of micro-electromechanical switch, micro-electromechanical technology, applied in this field

Active Publication Date: 2019-08-13
GENERAL ELECTRIC CO
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] Another disadvantage associated with MEMS RF switches is the "hot switching" voltage generated based on the residual energy generated at the contact electrodes

Method used

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  • Integrated microelectromechanical switches and related methods
  • Integrated microelectromechanical switches and related methods
  • Integrated microelectromechanical switches and related methods

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0020] According to some embodiments of the invention, a system includes a plurality of microelectromechanical switches having a plurality of gates coupled to each other. Each microelectromechanical switch includes beam electrodes disposed on a substrate. The microelectromechanical switch further includes a beam having an anchor portion coupled to the beam electrode, a first beam portion extending from the anchor portion in a first direction, and a second beam portion extending from the anchor portion in a second direction opposite to the first direction. Beam section. The microelectromechanical switch further includes a first control electrode and a first contact electrode disposed on the substrate facing the first beam portion, and a second control electrode and a second contact electrode disposed on the substrate facing the second beam portion. The first control electrode and the second control electrode are coupled to form a gate among the plurality of gates. The plurali...

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Abstract

A system includes a plurality of microelectromechanical switches coupled to each other, including a plurality of gates. Each microelectromechanical switch includes beam electrodes disposed on a substrate. The beam includes an anchor portion coupled to the beam electrode. The beam includes a first beam portion extending from the anchor portion in a first direction; and a second beam portion extending from the anchor portion in a second direction opposite the first direction. A first control electrode and a first contact electrode are arranged on the substrate facing the first beam portion. A second control electrode and a second contact electrode are arranged on the substrate facing the second beam portion. The first control electrode and the second control electrode are coupled to form a gate among the plurality of gates. The plurality of microelectromechanical switches are arranged in at least one of a series arrangement, a parallel arrangement.

Description

[0001] Cross References to Related Applications [0002] This application is a continuation-in-part of US Patent Application No. 13 / 307262, filed on November 30, 2011, entitled "A MICRO-ELECTROMECHANICAL SWITCHAND A RELATED METHOD THEREOF". Background technique [0003] The present invention relates generally to microelectromechanical devices, and more particularly, to integrated microelectromechanical switches. [0004] Microelectromechanical systems (MEMS) devices have a wide variety of applications and are ubiquitous in commercial products. One type of MEMS device is a MEMS switch. A typical MEMS switch includes one or more MEMS switches arranged in an array. MEMS switches are well suited for applications including mobile phones, wireless networks, communication systems, and radar systems. In wireless devices, MEMS switches can be used as antenna switches, mode switches, transmit / receive switches, and the like. [0005] A typical MEMS switch uses a cantilever of plated ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01H59/00
CPCH01H59/0009H01H2001/0084H01H2239/004
Inventor M.F.艾米D.K.思朋斯
Owner GENERAL ELECTRIC CO