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Simulation-supported defect evaluation using ultrasound

An ultrasonic and simulation model technology, applied in material analysis using sonic/ultrasonic/infrasonic waves, solids analysis using sonic/ultrasonic/infrasonic waves, and re-radiation of sonic waves, etc. question

Inactive Publication Date: 2017-02-22
SIEMENS AG
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] Additional problems arise when there are multiple defects in the workpiece rather than individual defects and thus multiple scattering centers or nuclei for the ultrasonic waves
Interactions due to multiple scattering between adjacent defects often lead to incorrect evaluations
In addition, the superimposition of adjacent inhomogeneous defect echoes or of defect echoes with structural scattering often leads to false or inaccurate evaluations

Method used

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  • Simulation-supported defect evaluation using ultrasound
  • Simulation-supported defect evaluation using ultrasound
  • Simulation-supported defect evaluation using ultrasound

Examples

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Embodiment Construction

[0027] figure 1 An inspection device 10 is shown in FIG. 2 , with which an internal structure 14 of a workpiece 12 can be inspected non-invasively or non-destructively. The testing device 10 can have an ultrasonic measuring device (or measuring device 16 for short) and an evaluation device 18 .

[0028]Measuring device 16 can be configured in a manner known per se and is designed to emit or transmit ultrasonic signals or ultrasonic waves 20 into workpiece 12 . The measuring device can also have a separate ultrasonic transmitter and receiver unit. Via structural element 22 , which may be inside workpiece 12 and represents inner structure 14 , ultrasonic waves may be reflected or scattered at structural element 22 , ie echoes 24 of ultrasonic waves 20 are generated. For this purpose, the measuring device 16 can be configured to detect echoes 24 and to generate ultrasonic measured values, or measured values ​​M for short, for the detected echoes 24 in a manner known per se. ex...

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Abstract

The invention relates to an ultrasound device (10) for examining a component (12), wherein the ultrasound device (10) has a measuring device (16) for carrying out an ultrasonic measurement of the component (12) and an analysis device (18). The problem addressed by the invention is to quantify structural elements (22), such as defects, in the component (12). For this purpose, the analysis device (18) is designed according to the invention to ascertain a number (N) and a respective position (X1, X2) of at least one internal structural element (22) of the component (12) as a function of the ultrasonic measurement data (M) from the measuring device (16) by means of a reconstruction method, and, by using a simulator (30), to determine at least one character of each structural element (22) by simulating the ultrasound measurement and adapting each model (28) as a function of each ascertained position (X1, X2) using a respective model (28) for the at least one structural element (22).

Description

technical field [0001] The invention relates to a method for inspecting workpieces. To this end, non-destructive testing is implemented by sending ultrasonic waves into the workpiece and measuring the ultrasonic echo signals. The invention also relates to an examination device for carrying out the method according to the invention. Background technique [0002] In the non-destructive testing of safety-relevant workpieces by means of ultrasound, besides the detection of defects, the quantification of said defects with regard to at least one property is also of great importance. For example, knowledge of the location, size and / or shape of existing defects is required for fracture mechanics inspections, monitoring crack growth and assessing workpiece life. [0003] The defect size can only be assessed by means of direct ultrasonic measurements if the defect is sufficiently large with respect to the wavelength and beamwidth of the ultrasonic waves used. Subsequently, a visual...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01N29/06G01N29/11G01N29/26G01N29/44G01S7/52
CPCG01N29/0672G01N29/069G01N29/11G01N29/262G01N29/4418G01N29/4472G01S7/52036G01S7/52052G01S15/8997G01N2291/015G01N2291/2693
Inventor K.芬特H.穆肖弗S.J.鲁皮奇
Owner SIEMENS AG
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