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A thin chip flexible fan-out packaging method and the prepared packaging structure

A packaging method and thin chip technology, applied in semiconductor/solid-state device manufacturing, semiconductor devices, electrical components, etc., can solve problems such as low production efficiency, photolithographic alignment, high cost, etc., and achieve long life and good bending resistance Effect

Active Publication Date: 2020-04-10
TSINGHUA UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] In addition, with the improvement of integration, fan-out packaging has increasingly become the only way for packaging technology. As a branch of it, flexible packaging also faces the same problems, such as warpage caused by packaging molding compound curing and Potential lithography alignment issues due to positional accuracy of chip placement, and resulting low productivity and high costs

Method used

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  • A thin chip flexible fan-out packaging method and the prepared packaging structure
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  • A thin chip flexible fan-out packaging method and the prepared packaging structure

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Embodiment Construction

[0034] Specific embodiments of the present disclosure will be described in detail below in conjunction with the accompanying drawings. It should be understood that the specific embodiments described here are only used to illustrate and explain the present disclosure, and are not intended to limit the present disclosure.

[0035] In this disclosure, unless otherwise stated, the used orientation words such as "up, down, left, right" usually refer to the packaging structure defined during normal packaging, and the specific positions refer to up, down, left, and right in the drawings; The packaging structure refers to the semi-finished and finished products obtained in the chip packaging process, such as post-wiring products and packages.

[0036] In the existing flexible packaging process, the wiring on the flexible circuit board and the transition connection between the board and the chip package are prone to problems of fragility and low life in the thermomechanical cycle test....

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Abstract

The present disclosure relates to a thin chip flexible fan-out packaging method and a prepared packaging structure. The method includes: embedding a chip in a flexible material layer and making a pad on a functional surface of the chip fan-out to connect to a wiring layer. The encapsulation structure prepared by the encapsulation method of the present disclosure has good bending resistance and long service life.

Description

technical field [0001] The present disclosure relates to the technical field of semiconductors, and in particular, to a thin chip flexible fan-out packaging method and a prepared packaging structure. Background technique [0002] With the development of integrated circuits and wireless communication technologies, flexible and wearable electronics are developing rapidly. Flexible wearable electronic products include electronic skin for human health data collection, disease monitoring and body movement intention recognition, electronic retina and cochlear implants for partial function repair and replacement in the human body. In the development of flexible electronic technology, the biggest obstacle is not the electronic technology itself, but how to improve the mechanical properties of materials and structures. In the past few decades, flexible organic electronic technology has developed vigorously, but the mobility of organic semiconductor materials is several orders of mag...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/60
CPCH01L24/19H01L24/82H01L2224/0231H01L2224/82005H01L2924/3511H01L2924/18162H01L2224/04105
Inventor 张雪松王谦陈瑜蔡坚
Owner TSINGHUA UNIV