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Dry film resist, manufacturing method of circuit wiring, circuit wiring, input device, and display device

A technology of resist and resist layer is applied in the fields of dry film resist, manufacture of circuit wiring, circuit wiring, input device and display device, and can solve the problems of reduced solubility of developer solution, residues in exposed parts and the like, To achieve the effect of high pattern linearity

Active Publication Date: 2021-11-16
FUJIFILM CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

For a negative-type resist layer, if it is exposed, the solubility to the developer solution will decrease, and the exposed part will remain after development.

Method used

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  • Dry film resist, manufacturing method of circuit wiring, circuit wiring, input device, and display device
  • Dry film resist, manufacturing method of circuit wiring, circuit wiring, input device, and display device
  • Dry film resist, manufacturing method of circuit wiring, circuit wiring, input device, and display device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0723] A positive photosensitive resin composition was prepared according to the following formula.

[0724] ・Novolak resin (m-cresol:p-cresol=30:70, molecular weight 5,500): 79.9 parts

[0725] Sensitizer: Naphthoquinone diazide (hereinafter also referred to as NQD) compound (1) described in JP-A-4-22955, page 4: 20 parts

[0726] ・Surfactant (surfactant 1 below): 0.1 part

[0727] PGMEA: 900 copies

[0728] Surfactant 1: F-554, a perfluoroalkyl-containing nonionic surfactant represented by the following structural formula (manufactured by DIC)

[0729] 【Chemical 33】

[0730]

[0731] Weight average molecular weight 1500

[0732] This photosensitive resin composition was coated on a polyethylene terephthalate film (hereinafter referred to as PET ( A)) on. Then, it was dried in a convection oven at 100° C. for 2 minutes, and finally, a polyethylene film (manufactured by Tredegar Corporation, OSM-N) was crimped as a protective film to prepare a dry film resist. The ob...

Embodiment 2

[0740] The dry film resist of Example 2 was produced in the same manner as in Example 1 except that the temporary support used was PET with a film thickness of 75 μm and a total light haze of 0.16% (hereinafter referred to as PET (B)). . Furthermore, except having used the dry film resist of Example 2 as a dry film resist, it carried out similarly to Example 1, and obtained the copper wiring board which is the circuit wiring of Example 2.

Embodiment 3

[0742] The temporary support used was made into a polypropylene film (hereinafter referred to as PP (a)) with a film thickness of 25 μm and a total light haze of 0.20%, and the dry film anti-corrosion film of Example 3 was produced in the same manner as in Example 1. etchant. Furthermore, except having used the dry film resist of Example 3 as a dry film resist, it carried out similarly to Example 1, and obtained the copper wiring board which is the circuit wiring of Example 3.

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Abstract

The invention relates to a dry film resist, a method for manufacturing circuit wiring, circuit wiring, an input device, and a display device. Provides dry film resists capable of producing circuit wiring with high pattern linearity. A dry film resist, a method for manufacturing circuit wiring, circuit wiring, an input device, and a display device, wherein the dry film resist is a positive dry film resist having a resist layer on a temporary support, The total light haze of the temporary support is 0.3% or less.

Description

technical field [0001] The present invention relates to a dry film resist, a method for manufacturing circuit wiring, circuit wiring, an input device, and a display device. Background technique [0002] In a display device (organic Electro Luminescence (EL) display device, liquid crystal display device, etc.) equipped with a touch panel such as a capacitive input device, the electrode pattern of the sensor corresponding to the identification part, the peripheral wiring part, Take out the conductive pattern such as the wiring of the wiring part. [0003] Generally, in order to form a patterned conductive layer, the following method is widely used for the reason that the number of steps required to obtain the necessary pattern shape is small: For the use of dry film resist as a photosensitive transfer material, the following methods are widely used. The resist layer (layer of the photosensitive resin composition) is exposed through a mask with a desired pattern, so that the r...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G03F7/039G03F7/004G06F3/041
CPCG03F7/004G03F7/039G03F7/0392G06F3/0412
Inventor 片山晃男长田崇一郎
Owner FUJIFILM CORP