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Compact ultrasound transducer with direct coax attachment

一种同轴电缆、换能器的技术，应用在制造其领域，能够解决空间利用率低、制造复杂等问题

Inactive Publication Date: 2017-08-29
KONINKLIJKE PHILIPS NV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] As stated in the literature, multi-level interconnection is sufficient but has many adverse consequences
These consequences include manufacturing complexity, inefficient space utilization and product cost
These consequences are particularly detrimental in catheter designs which would benefit from minimizing the space required to accommodate transducer arrays and would further benefit from reduced cost of disposable products

Method used

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  • Compact ultrasound transducer with direct coax attachment
  • Compact ultrasound transducer with direct coax attachment
  • Compact ultrasound transducer with direct coax attachment

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Embodiment Construction

[0020] In accordance with the principles of the present invention there is provided an ultrasonic transducer, transducer assembly and method for manufacture. The principles of the present invention provide an array of transducers on a substrate in which vias, especially through silicon vias (TSVs), can be employed. The vias are formed through the substrate on which the transducer elements are formed or mounted. The vias can then be connected by a coaxial cable. In this way, an easily manufacturable design is provided, with more compact dimensions, more efficient use of space, and thus a significant reduction in costs.

[0021] In one embodiment, a capacitive micromachined ultrasound transducer (CMUT) is employed. CMUT substrates provide a smaller form factor and are useful for compact designs. Additionally, the CMUT substrate allows for the formation of vias to connect coaxial cables to the transducer elements. In another embodiment, a one-dimensional array of transducer e...

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Abstract

An ultrasound device includes a transducer array (404) formed on a first side of a substrate (402). A through via (406) passes through a thickness of the substrate between the first side and a second side, opposite the first side. A conductor (410) is electrically coupled to the through via on the second side to provide signals to and from the transducer array.

Description

technical field [0001] The present disclosure relates to ultrasound transducers, and more particularly to transducers with simplified electrical interconnection between coaxial cables and transducer arrays and methods for manufacturing the same. Background technique [0002] In currently manufacturing transducer assemblies, flexible terminations are used to connect the printed circuit board (PCB) to the ultrasound transducer array. The PCB serves as a termination for the signal-carrying coaxial cable, which is connected to the PCB by solder. The flexible termination is also connected to the same side of the PCB as the coaxial cable and is also soldered. The PCB bridges the electrical connection between the coaxial cable and the transducer elements of the transducer array, the transducer elements being mounted on separate substrates and connected to the other of the flexible terminations. one end. In some assemblies there may be more than one PCB or other intermediate subs...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B06B1/02G01N29/24
CPCB06B1/0292G01N29/2406G01N2291/106H01R4/023H01R43/0207H03H3/0072
Inventor W·苏多尔
Owner KONINKLIJKE PHILIPS NV
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