Modified phenol-formaldehyde resin adhesive for wood and preparation method thereof

A phenolic resin glue and modification technology, applied in the field of wood adhesives, can solve the problems of expensive adhesive, hard and brittle glue layer, dark color, etc., and achieve the effect of improving heat resistance, high degree of polymerization, and narrow molecular weight distribution

Inactive Publication Date: 2017-09-19
成都博美实润科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At the same time, phenolic resin has the disadvantages of dark color, hard and brittle adhesive layer after curing, easy to crack, more expensive than some other synthetic resin adhesives, and high toxicity.

Method used

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  • Modified phenol-formaldehyde resin adhesive for wood and preparation method thereof
  • Modified phenol-formaldehyde resin adhesive for wood and preparation method thereof
  • Modified phenol-formaldehyde resin adhesive for wood and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0021] A modified phenolic resin adhesive for wood is prepared from the following components in parts by weight: 100 parts of phenol, 41 to 55 parts of formaldehyde, 5 to 25 parts of cardanol, 3 to 10 parts of sodium hydroxide, 1 to 5 parts of Parts of modified montmorillonite.

[0022] The preparation method of the modified phenolic resin adhesive for wood includes the following steps: adding molten phenol, cardanol, sodium hydroxide and modified montmorillonite into a three-necked flask at 40-50° C., keeping the temperature for 10-30 minutes; adding Formaldehyde (accounting for 60% of the total formaldehyde), heat up to 50-80°C, keep warm for 50-70min; add the remaining formaldehyde, heat up to 75-80°C, keep warm for 50-70min; heat up to 85-90°C and reflux for 40-60min , rapidly cooled to 40 ~ 50 ℃ and discharged.

[0023] Among them, the total amount of formaldehyde added is 40ml, the amount of phenol added is calculated according to the molar ratio of formaldehyde to phen...

Embodiment 2

[0026] A modified phenolic resin adhesive for wood and a preparation method thereof. The preparation method comprises the following steps: melting phenol, cardanol and a part of sodium hydroxide (accounting for 80% of the total amount of sodium hydroxide) at 40-50° C. ), the modified montmorillonite was added into the three-necked flask, and kept for 10 to 30 minutes; add formaldehyde (accounting for 60% of the total formaldehyde), heat up to 50 to 70 ° C, and keep the temperature for 50 to 70 minutes; add the remaining sodium hydroxide, keep the temperature for 5 ~15min; add the remaining formaldehyde, heat up to 75~80°C, keep the temperature for 50~70min; heat up to 85~90°C and reflux for 40~60min, and rapidly cool to 40~50°C for discharging.

[0027] Among them, the total amount of formaldehyde added is 40ml, the amount of phenol added is calculated according to the molar ratio of formaldehyde to phenol as 1.7:1, the amount of sodium hydroxide added is 5% of phenol, configur...

Embodiment 3

[0030] A modified phenolic resin adhesive for wood and a preparation method thereof, the preparation method comprises the following steps: melting phenol, cardanol, a part of sodium hydroxide (accounting for 80% of the total amount of sodium hydroxide), The modified montmorillonite was added to the three-necked flask, and kept for 20 minutes; formaldehyde (accounting for 60% of the total formaldehyde) was added, the temperature was raised to 60 ° C, and the temperature was kept for 60 minutes; the remaining sodium hydroxide was added, and the temperature was kept for 10 minutes; 80°C, hold the temperature for 60min; heat up to 90°C and reflux for 60min, rapidly cool to 45°C for discharging.

[0031] Among them, the total amount of formaldehyde added is 40ml, the amount of phenol added is calculated according to the molar ratio of formaldehyde to phenol as 1.7:1, the amount of sodium hydroxide added is 5% of phenol, configured as a 20% aqueous solution for use, and the amount of...

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Abstract

The invention provides a modified phenol-formaldehyde resin adhesive for wood and a preparation method thereof. The modified phenol-formaldehyde resin adhesive is prepared from the following components in parts by weight: 100 parts of phenol, 41 to 55 parts of formaldehyde, 5 to 25 parts of anacardol, 3 to 10 parts of sodium hydroxide and 1 to 5 parts of modified montmorillonoid. The preparation method of the modified phenol-formaldehyde resin adhesive, provided by the invention, comprises the following steps: adding the fused phenol, formaldehyde, anacardol, sodium hydroxide and modified montmorillonoid into a three-mouth flask at certain temperature; heating, keeping the heat and refluxing at high temperature; rapidly cooling and discharging, wherein the formaldehyde and the sodium hydroxide are added by two times. The anacardol is a phenol-like substance with long-chain hydrocarbonyl at a meta-position; the modified montmorillonoid is Na-montmorillonite which is organically modified by cetyltrimethylammonium bromide. The modified phenol-formaldehyde resin adhesive provided by the invention has lower free phenol content, higher adhesion strength and better heat resistance.

Description

technical field [0001] The invention relates to the field of wood adhesives, in particular to a modified phenolic resin adhesive for wood and a preparation method thereof. Background technique [0002] At present, the wood processing industry is one of the industrial sectors that use the largest number of adhesives and occupies a pivotal position in the adhesive industry. Wood adhesives used in the plywood, particleboard, fibreboard, decorative panels, furniture and woodwork sectors account for about three-quarters of the world's total production of adhesives. Adhesives are classified according to the source of raw materials and can be divided into natural adhesives and synthetic adhesives. Synthetic adhesives include thermosetting resin glue, thermoplastic resin glue and synthetic rubber. Thermosetting resin includes phenolic resin, epoxy resin, furan resin, amino resin (including urea formaldehyde, melamine formaldehyde), thermoplastic resin includes polyvinyl acetate, po...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J161/14C09J11/04C08G8/28C08K9/04C08K3/34
Inventor 邱鸿浩
Owner 成都博美实润科技有限公司
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