Supercharge Your Innovation With Domain-Expert AI Agents!

Equipment abnormality evaluation method and abnormality evaluation device

A technology for abnormal evaluation and equipment, applied in the direction of measurement devices, design optimization/simulation, computer-aided design, etc., can solve the problems that cannot clearly reflect the actual state of semiconductor machines, and cannot accurately present the true performance of semiconductor machines. Achieve the effect of precision health trend

Active Publication Date: 2021-01-01
IND TECH RES INST
View PDF5 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The present invention is to provide an abnormality evaluation method and an abnormality evaluation device for equipment, so as to solve the problem that the actual state of the semiconductor machine cannot be clearly reflected in the existing method, and to overcome the problem that the existing method only evaluates through a single feature and cannot The problem of accurately presenting the real performance of semiconductor machines

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Equipment abnormality evaluation method and abnormality evaluation device
  • Equipment abnormality evaluation method and abnormality evaluation device
  • Equipment abnormality evaluation method and abnormality evaluation device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0045] In order to make the object, technical solution and advantages of the present invention clearer, the present invention will be described in further detail below in conjunction with specific embodiments and with reference to the accompanying drawings.

[0046] figure 1 It is a block diagram of an abnormality assessment device 100 of equipment according to an embodiment of the present invention. Such as figure 1 As shown, the abnormality assessment device 100 includes a feature extraction module 110 , a life section analysis module 120 , a trend analysis module 130 and an alert module 140 . The life segment analysis module 120 is coupled to the feature extraction module 110 . The trend analysis module 130 is coupled to the feature extraction module 110 and the life segment analysis module 120 . The alert module 140 is coupled to the trend analysis module 130 . The feature extraction module 110 , the life section analysis module 120 , the trend analysis module 130 and ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention provides an abnormality assessment method of equipment, which includes the following steps. According to a recipe information and a sensing signal, a feature sequence corresponding to a life cycle is obtained, the feature sequence includes a plurality of feature subset sequences, and the life cycle is associated with a plurality of process operations. A life section analysis program is repeatedly executed on the life cycle to obtain a plurality of life sections in the life cycle and a sequence of feature subsets corresponding to each life section. A trend distribution of each life segment is constructed according to the feature subset sequence corresponding to each life segment. Whether to issue a warning message is determined according to a plurality of trend distributions.

Description

technical field [0001] The invention relates to an abnormal evaluation method and an abnormal evaluation device for equipment. Background technique [0002] In the traditional evaluation method of the abnormal state (such as failure or aging) of the semiconductor machine, often only one of the two can be judged as a healthy state or an abnormal state. However, such dichotomies cannot clearly reflect the actual state of semiconductor tools. [0003] In addition, in another traditional evaluation method for the state of abnormality (such as failure or aging) of the semiconductor equipment, the aging trend of the parts of the semiconductor equipment during the entire life cycle is usually measured only by a single feature. However, in fact, as the life state of the parts changes, the characteristics reflecting the aging of the parts will be different, so a single characteristic cannot accurately reflect the actual performance of the semiconductor machine. Contents of the inv...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): G06F30/367G06F30/20
CPCG06F30/367G01R31/2642G01R31/2601G08B21/18Y02P90/30
Inventor 许耀中张森嘉谢宗融
Owner IND TECH RES INST
Features
  • R&D
  • Intellectual Property
  • Life Sciences
  • Materials
  • Tech Scout
Why Patsnap Eureka
  • Unparalleled Data Quality
  • Higher Quality Content
  • 60% Fewer Hallucinations
Social media
Patsnap Eureka Blog
Learn More

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2025 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com