Wafer processing machine and processing method thereof

Abstract

A wafer processing machine and a processing method thereof are provided. A sensor in each workstation monitors the working state of the workstation, and generates a normal state signal or an abnormal state signal. A control device receives the normal state signal or the abnormal state signal sent by the sensor in each workstation. Whether the control device receives at least one abnormal state signal is determined. If the control device receives at least one abnormal state signal, the control device generates a recovery signal to make a mechanical arm perform a wafer recovery procedure. Otherwise, the control device generates a drive signal to make the mechanical arm perform a normal working procedure. The wafer recovery procedure recovers a wafer in a workstation issuing a normal state signal, and then recovers a wafer in a workstation issuing an abnormal state signal.

Description

technical field [0001] The present invention relates to a wafer processing machine and a processing method thereof, in particular to a wafer processing machine which preferentially recovers wafers in a workstation in a normal state when an abnormality occurs, and then recovers wafers in a workstation in an abnormal state. Processing method. Background technique [0002] Through continuous processing, the circuit is fabricated on the surface of the wafer to complete various required electronic components. The processing of the wafer depends on the production requirements, but most of them will have multiple steps such as pressing, cooling and heating. . [0003] The current wafer processing machine, according to the job type requirements of each workstation, will be equipped with some sensors to assist the job, such as the pressure sensor to sense whether the pressing force is sufficient, the vacuum sensor to sense whether the workstation chamber is airtight, and the tempera...

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Problems solved by technology

[0004] When any one or more workstations of the above-mentioned wafer processing machine are abnormal, the entire work sequence will be stopped and the wafer will stay in the workstation and wait for relevant personnel to eliminate the abnormality. There is a certain limit to the time that the wafer can stay. When the wafer stays in a certain workstation for too long, the probability of wafer damage will be higher. For example, if the wafer stays in the oven for too long, the wafer will be overbaked and scrapped. Because the wafer is a high-precision and high-value object, any abnormal condition may cause damage to the wafer, and any damage to the wafer is a major loss

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