Semiconductor chip qualification inspection method and device
A semiconductor and qualification technology, which is applied in the direction of instruments, calculations, electrical digital data processing, etc., can solve the problem of low efficiency of semiconductor chip qualification inspection
Active Publication Date: 2018-12-21
INTEL PROD CHENGDU CO LTD +1
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Problems solved by technology
These image acquisition conditions are usually fixed, even if there is a certain compatibility between these image acquisition conditions, so that the efficiency of semiconductor chip qualification inspection is not high
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[0029] specific implementation plan
[0030] The subject matter described herein will now be discussed with reference to example embodiments. It should be understood that these embodiments are discussed only to enable those skilled in the art to better understand and implement the subject matter described herein, rather than to limit the protection scope, applicability or examples set forth in the claims. Changes may be made in the function and arrangement of elements discussed without departing from the scope of the disclosure. Various examples may omit, substitute, or add various procedures or components as needed. For example, the methods described may be performed in an order different from that described, and various steps may be added, omitted, or combined. Additionally, features described with respect to some examples may also be combined in other examples.
[0031] As used herein, the term "comprising" and its variants represent open terms meaning "including but not...
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The present application provides a method for checking the qualification of a semiconductor chip, including: for the semiconductor chip to be checked, identifying the number of semiconductor chip pictures that need to be obtained from the semiconductor chip inspection template, the picture acquisition conditions of each semiconductor chip picture, and The picture inspection scheme of the semiconductor chip pictures; and for the obtained semiconductor chip pictures of the number, the conformity check is carried out by using the identified corresponding picture inspection scheme, wherein the said number of semiconductor chip pictures are obtained through the picture acquisition device acquired under the identified image acquisition conditions, and the semiconductor chip inspection template is generated by integrating the image acquisition conditions and image inspection schemes of all standard reference images used to check the eligibility of the semiconductor chip to be inspected of. By using the method, the inspection efficiency of the semiconductor chip can be improved, and the inspection cost of the semiconductor chip can be saved.
Description
technical field [0001] The present application generally relates to the field of semiconductor chip manufacturing, and more particularly, to methods and devices for checking the qualification of semiconductor chips. Background technique [0002] In the field of semiconductor chip manufacturing, since semiconductor chips may have defects due to problems such as manufacturing processes during semiconductor chip manufacturing, it is necessary to check the qualification of the semiconductor chip after the semiconductor chip is manufactured. [0003] In the existing semiconductor chip qualification inspection scheme, it is usually carried out by using a method of comparing images of semiconductor chips. For example, first, a set of standard reference pictures is determined according to the semiconductor chip qualification inspection standard, for example, 13 pictures are required for the bare die of a desktop semiconductor chip. Next, a semiconductor chip picture of the manufact...
Claims
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IPC IPC(8): G06F17/50G06K9/62
CPCG06F30/392G06F18/23
Inventor 何丽娟张达彬林羽中
Owner INTEL PROD CHENGDU CO LTD