A mobile phone middle frame with high heat dissipation

Abstract

The invention discloses an efficient heat dissipating mobile phone middle frame comprising an inner frame, wherein the inner frame is provided with a rectangular frame composed of two groups of side plates and two groups of connecting plates, heat dissipating holes are equidistantly formed in the two groups of side plates, semiconductor cooling fins are arranged in the heat dissipating holes, heatdissipating windows are arranged on the two groups of connecting plates, an outer frame is connected to the outer side of the inner side in a sliding manner, the outer frame comprises a first frame and a second frame, both of the first frame and the second frame are U-shaped frames, guiding slide blocks are fixed to both ends of the first frame and the second frame via screws, and guiding chutesmatched with the guiding slide blocks are formed in the inner frame. The efficient heat dissipating mobile phone middle frame disclosed by the invention has the advantages of simple structure and novel design, can reduce the impact force of the mobile phone during accidental drop at a non heat dissipating state, when the middle frame is changed, only the outer frame is changed, thereby being convenient to change, the outer frame is dismounted and bent in the heat dissipating state so as to accelerate the heat dissipating of the mobile phone, so that the heat dissipating effect is better, and the service life of the mobile phone is prolonged.

Description

technical field [0001] The invention relates to the field of mobile phone middle frames, in particular to a mobile phone middle frame with high heat dissipation. Background technique [0002] The middle frame of the mobile phone is the skeleton of the mobile phone, which is used to support the entire mobile phone. When the mobile phone is bumped or knocked, the outer edge of the middle frame is easily scratched, which may also affect the use of the internal parts of the mobile phone. All board screen components are fixed on the middle frame, which requires professional maintenance personnel to complete, and replacement is troublesome. At the same time, when the mobile phone is used for a long time, the electronic components inside the mobile phone will dissipate heat, which will increase the temperature of the mobile phone. The heat dissipation of the existing mobile phone middle frame is poor. The service life and performance of parts, for this reason we have designed a mo...

AI Technical Summary

Problems solved by technology

When the mobile phone is bumped or knocked, the outer edge of the middle frame is easily scratched, which may also affect the use of the internal parts of the mobile phone. All board screen components are fixed on the middle frame, which requires professional maintenance personnel to complete, and replacement is troublesome. At the same time, when the mobile phone is used for a long time, the electronic components inside the mobile phone will dissipate heat, which will increase the temperature of the mobile phone. The heat dissipation of the existing mobile phone middle frame is poor. The service life and performance of parts, for this reason we have designed a mobile phone middle frame with high heat dissipation to solve the above problems

Images