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Abnormal distribution aluminum hydroxide powder and preparation method and application thereof

A technology of aluminum hydroxide and normal distribution, applied in the direction of epoxy resin glue, polymer adhesive additives, adhesive types, etc., can solve the problems of low viscosity, anti-precipitation and mutual exclusion, and reduce production costs , improved fusion performance, and strong practicability

Active Publication Date: 2018-04-27
SHIJIAZHUANG HUIDE TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] The technical problem to be solved in the present invention is to provide a non-normal distribution aluminum hydroxide powder and its preparation method and application, to solve the problem of mutual exclusion of low viscosity and anti-precipitation in the epoxy resin potting adhesive system; State-distributed aluminum hydroxide powder is added to the epoxy resin potting adhesive system as a filler to obtain a low-viscosity and non-precipitating epoxy resin potting adhesive

Method used

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  • Abnormal distribution aluminum hydroxide powder and preparation method and application thereof
  • Abnormal distribution aluminum hydroxide powder and preparation method and application thereof
  • Abnormal distribution aluminum hydroxide powder and preparation method and application thereof

Examples

Experimental program
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preparation example Construction

[0024] The preparation method of described non-normal distribution aluminum hydroxide powder comprises the following steps:

[0025] A. Pulverization: Use a raw powder pulverizer to pulverize aluminum hydroxide to obtain aluminum hydroxide powders of 2 μm and 18 μm;

[0026] B. Screening: Use a powder classifying vibrating sieve at room temperature to screen aluminum hydroxide powders of 2 μm and 18 μm at 960 times / min to ensure that the particle size of the powder is uniform;

[0027] C. Mixing: Add 2μm and 18μm aluminum hydroxide powders into a 360° rotary mixer according to the mass ratio and mix them. The mixing temperature is 90±2℃, and they are mixed for 2±0.5h. After mixing evenly, aluminum hydroxide with non-normal distribution is obtained. pink.

[0028] The application of the non-normal distribution aluminum hydroxide powder is to use the non-normal distribution aluminum hydroxide powder as a filler for the preparation of two-component epoxy resin electronic potting...

Embodiment 1

[0052] The aluminum hydroxide powder with non-normal distribution is formed by mixing aluminum hydroxide powder with a particle size of 2 μm and aluminum hydroxide powder with a particle size of 18 μm, and the mixing mass ratio of the two is 2:1.

[0053] The specific preparation method is:

[0054] A. Pulverization: Use a raw powder pulverizer to pulverize aluminum hydroxide to obtain aluminum hydroxide powders of 2 μm and 18 μm;

[0055] B. Screening: Use a powder classifying vibrating sieve at room temperature to screen aluminum hydroxide powders of 2 μm and 18 μm at 960 times / min to ensure that the particle size of the powder is uniform;

[0056] C. Mixing: Add 2 μm and 18 μm aluminum hydroxide powders into a 360° rotary mixer in a mass ratio of 2:1 and mix them at a mixing temperature of 90±2°C. After mixing for 2 hours, aluminum hydroxide powders with non-normal distribution can be obtained.

[0057] Use LS-POP (9) laser particle size analyzer to carry out particle size...

Embodiment 2~ Embodiment 5

[0059] The formula of the non-normal distribution aluminum hydroxide powder of embodiment 2~embodiment 5 is shown in Table 1, and its preparation method is identical with the preparation method among the embodiment 1.

[0060] Table 1 Formula and average particle size of aluminum hydroxide powder with non-normal distribution

[0061]

[0062] Note: The particle size distribution chart test instrument and test method, the average particle size calculation method are the same as in Example 1, and the particle size distribution chart shows that the products of Example 2 to Example 5 all contain two high absorption peaks.

[0063] Next, the aluminum hydroxide powder with non-normal distribution prepared in Examples 1 to 5 was used as a filler and mixed with the base resin to prepare a simple version of component A, and to conduct viscosity and settling performance tests.

[0064] 1. Test method

[0065] Take five parts of 50g of commercially available E51 epoxy resin as the ba...

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Abstract

The invention discloses abnormal distribution aluminum hydroxide powder. The abnormal distribution aluminum hydroxide powder is made by mixing of aluminum hydroxide powder in particle size of 2micronand aluminum hydroxide powder in particle size of 18micron, and a mixing mass ratio of the aluminum hydroxide powder in particle size of 2micron and the aluminum hydroxide powder in particle size of 18micron is 11:8-11:4, preferably 11:7-11:5 and most preferably 2:1. Application of the abnormal distribution aluminum hydroxide powder refers to adding of the abnormal distribution aluminum hydroxidepowder serving as filler in preparation of a component A of two-component epoxy resin electronic pouring sealant. The abnormal distribution aluminum hydroxide powder has advantages that problems of anti-settling mutual exclusion and low viscosity in an epoxy resin system can be effectively improved, and the fusion performance of the abnormal distribution aluminum hydroxide powder is effectively improved; by application of the abnormal distribution aluminum hydroxide powder serving as filler to the epoxy resin electronic pouring sealant, low-viscosity non-settling products can be obtained, service time and fluidity of the products can be improved remarkably, and high practicality is realized.

Description

technical field [0001] The invention relates to a non-normal distribution aluminum hydroxide powder and a preparation method and application thereof, belonging to the technical field of electronic potting glue. Background technique [0002] With the rapid development of electronic technology, its operating speed is getting faster and faster, and electronic components and logic circuits tend to be miniaturized and densely developed. Coupled with the increase in operating power, the heat generated per unit area of ​​electronic products continues to increase. The heat dissipation of electronic devices is particularly important; if the heat cannot be dissipated in time, local high temperatures will be formed, which will affect the performance stability and service life of electrical appliances. After encapsulating electronic components with electronic potting glue, it can not only dissipate heat well, but also play the role of moisture-proof, dust-proof and shock-proof, so it is...

Claims

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Application Information

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IPC IPC(8): C09J11/08C09J163/00
CPCC08K2003/2227C08K2201/003C08K2201/014C09J11/08C09J163/00
Inventor 梁彦中李小涛陈剑磊侯建敏王满怀王德坤
Owner SHIJIAZHUANG HUIDE TECH
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