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Phase module for a power converter

A technology of phase modules and converters, applied in the field of phase modules, can solve problems such as high cost, and achieve the effects of increasing scrap rate, uniform heating, and easy connection

Active Publication Date: 2018-06-08
SIEMENS AG
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This leads to high costs while increasing the active power only slightly
Through the parallel connection of the converters, although different power ranges can be covered, the different power ranges are associated with high costs

Method used

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  • Phase module for a power converter
  • Phase module for a power converter
  • Phase module for a power converter

Examples

Experimental program
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Effect test

Embodiment Construction

[0047] figure 1 A sectional view through the phase module 1 is shown. In this case, the semiconductor component chip 100 is connected to the heat sink 13 . The copper layer 16 is used to electrically contact the semiconductor device chip 100 . The second contacts of the semiconductor component chip 100 are not shown in this figure for the sake of simplicity. In this case, the copper layer 16 is applied on a substrate 18 , which is also referred to as carrier layer. The copper layer forms the switching element 10 . A non-detachable connection to heat sink 13 is produced by means of a connecting layer, for example solder or an adhesive layer.

[0048] The phase module 1 shown here comprises exactly one semiconductor component chip 100 in the simple embodiment shown here. The semiconductor component chip 100 can include the function of a semiconductor switch 11 and the function of a diode 12 . Alternatively, it is possible for the two functions to be implemented by a separa...

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PUM

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Abstract

The invention relates to a phase module (1) for a power converter (2) comprising at least one switching element (10) and a heatsink (13). In order to improve the cooling properties of a phase module (1), it is proposed that the switching element (10) is connected to the heatsink (13), wherein the connection between switching element (10) and heatsink (13) is a non-detachable connection. The invention further relates to a power converter (2) comprising at least one phase module (1) of this type and a method for producing a phase module (1) of this type, wherein in order to produce a connectionbetween the switching element (10) and the heatsink (13), the switching element (10) is soldered, sintered or glued onto the heatsink (13).

Description

technical field [0001] The invention relates to a phase module for a converter having at least one switching element and a heat sink. The invention also relates to a converter having at least one such phase module and to a method for producing such a phase module. Background technique [0002] Converters are used to: supply electrical energy to motors or to the grid. The machine can be controlled and regulated by means of the converter. In addition, converters are used to transmit energy with low losses. Another field of application for converters is compensators. With the aid of the compensator, reactive power and / or circuit harmonic oscillations can be compensated, that is to say eliminated, or fed in a targeted manner into the network. [0003] To form the converter, the required switching elements with semiconductors are mounted on the heat sink. In this case, the switching elements are marketed as modules of different active powers. For good heat transfer, ie for ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H02M7/00H05K7/20H01L23/36H01L23/373
CPCH01L23/36H01L23/3735H02M7/003H05K7/209H02M7/493H01L2224/32225H01L2224/49175H01L2224/8384H01L24/32H01L24/83H01L2224/48137H01L2224/48227H01L2224/291H01L2224/2919H02M1/0009H02M1/327H05K7/14329H01L2924/00014H01L2924/014H01L27/02
Inventor 罗兰·洛尔茨赖纳·索默
Owner SIEMENS AG