FPC bending forming process
A bending forming and crafting technology, which is applied in the direction of electrical components, laminated printed circuit boards, printed circuit manufacturing, etc., can solve the problems that it is difficult to ensure the printing accuracy of the secondary printing pressure-sensitive adhesive, the fluctuation of the pressure-sensitive potential difference, etc.
Active Publication Date: 2018-07-06
SHENZHEN XINYU TENGYUE ELECTRONICS
View PDF11 Cites 5 Cited by
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
[0002] The current flexible printed circuit board FPC (Flexible Printed Circuit board) is generally processed by single-sided substrate or double-sided substrate (FCCL) to form single-sided, double-sided and multi-layer boards. The existing FPC processing process is as follows: : cutting-drilling-black hole-electroplating-exposure and development-exposure and development-printing pressure adhesive-attached thermosetting adhesive film-punching full groove-laminating steel sheet-FPC bending, produced according to the existing FPC processing technology FPC, it is difficult to guarantee the overall printing accuracy of the secondary printing pressure-sensitive adhesive and the fluctuation of the pressure-sensitive potential difference
Method used
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View moreImage
Smart Image Click on the blue labels to locate them in the text.
Smart ImageViewing Examples
Examples
Experimental program
Comparison scheme
Effect test
Embodiment Construction
[0017] The idea, specific structure and technical effects of the present invention will be clearly and completely described below in conjunction with the embodiments and accompanying drawings, so as to fully understand the purpose, features and effects of the present invention. Apparently, the described embodiments are only some of the embodiments of the present invention, rather than all of them. Based on the embodiments of the present invention, other embodiments obtained by those skilled in the art without creative efforts belong to The protection scope of the present invention. In addition, all the connection / connection relationships involved in the patent do not simply refer to the direct connection of components, but mean that a better connection structure can be formed by adding or reducing connection accessories according to specific implementation conditions. The various technical features in the present invention can be combined interactively on the premise of not co...
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More PUM
Login to View More Abstract
The invention discloses an FPC bending forming process, which belongs to the technical field of FPC circuit boards. The FPC bending forming process disclosed by the invention comprises the steps of: step 1, selecting a substrate material, wherein the substrate comprises an intermediate base layer and outer side layers arranged on both sides of the intermediate base layer, and performing wiring onthe substrate; step 2, adhering a cover film on the wired substrate; step 3, printing a pressure sensitive adhesive on the substrate attached with the cover film; step 4, attaching a thermosetting adhesive film; step 5, performing notching processing on the substrate, and adhering a steel plate onto the substrate; step 6, bending the substrate by using a bending fixture; step 7, and subjecting a bent product to press-fit processing so as to obtain a formed FPC. The FPC bending forming process disclosed by the invention designs a process flow of FPC bending forming, and controls the material selection of the substrate and the pressing parameters, thereby controlling the overall printing precision of the formed FPC and the fluctuations of pressure sensing potential differences caused by secondary printing.
Description
technical field [0001] The invention belongs to the technical field of FPC circuit board processing, and in particular relates to an FPC bending forming process. Background technique [0002] The current flexible printed circuit board FPC (Flexible Printed Circuit board) is generally processed by single-sided substrate or double-sided substrate (FCCL) to form single-sided, double-sided and multi-layer boards. The existing FPC processing process is as follows: : cutting-drilling-black hole-electroplating-exposure and development-exposure and development-printing pressure adhesive-attached thermosetting adhesive film-punching full groove-laminating steel sheet-FPC bending, produced according to the existing FPC processing technology For FPC, it is difficult to guarantee the overall printing accuracy of the secondary printing pressure-sensitive adhesive and the fluctuation of the pressure-sensitive potential difference. Contents of the invention [0003] The technical proble...
Claims
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More Application Information
Patent Timeline
Login to View More Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/00
CPCH05K3/0014H05K3/0044H05K3/0058H05K3/0061H05K2203/0214H05K2203/0271H05K2203/0278
Inventor 肖建海吕剑胥海兵郑意夏鹏新张扬
Owner SHENZHEN XINYU TENGYUE ELECTRONICS