A kind of flexible LED device and preparation method thereof
An LED device, flexible technology, applied in the direction of semiconductor devices, electrical components, circuits, etc., can solve the problems of harsh process conditions, inability to meet use requirements, brittleness of semiconductor silicon materials, etc., to achieve the effect of simple process
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[0031] The description of the following embodiments refers to the attached drawings to illustrate specific embodiments in which the present invention can be implemented. The directional terms mentioned in the present invention, such as [Up], [Down], [Front], [Back], [Left], [Right], [Inner], [Outer], [Side], etc., are for reference only The direction of the additional schema. Therefore, the directional terms used are used to describe and understand the present invention, rather than to limit the present invention. In the figure, units with similar structures are indicated by the same reference numerals.
[0032] reference figure 1 , Is a flow chart of the method for preparing the flexible LED device provided by the present invention. The method includes the following steps:
[0033] Step S1: A P-type silicon wafer is provided as a substrate, a layer of photoresist is spin-coated on the substrate, and a layer of patterned P-type silicon is obtained on the substrate through an expo...
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