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A kind of flexible LED device and preparation method thereof

An LED device, flexible technology, applied in the direction of semiconductor devices, electrical components, circuits, etc., can solve the problems of harsh process conditions, inability to meet use requirements, brittleness of semiconductor silicon materials, etc., to achieve the effect of simple process

Active Publication Date: 2019-11-15
TCL CHINA STAR OPTOELECTRONICS TECH CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The development of LED is developing rapidly in various application fields, but it will also encounter some challenges: first, with the arrival of the era of low-carbon economy, the development of more energy-saving LED is an imperative task; second . Because LEDs are hard and cannot be bent, they cannot meet their use requirements in some specific occasions. Therefore, the development of flexible LEDs is a problem that needs to be solved at present.
[0004] At present, to achieve the flexibility of LEDs, although OLEDs can achieve flexibility very well, the process conditions are harsh, and it is difficult to produce relatively large sizes. However, a difficult problem for traditional inorganic semiconductor LEDs is the brittleness of semiconductor silicon materials when they are bent. question

Method used

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  • A kind of flexible LED device and preparation method thereof
  • A kind of flexible LED device and preparation method thereof
  • A kind of flexible LED device and preparation method thereof

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Embodiment Construction

[0031] The description of the following embodiments refers to the attached drawings to illustrate specific embodiments in which the present invention can be implemented. The directional terms mentioned in the present invention, such as [Up], [Down], [Front], [Back], [Left], [Right], [Inner], [Outer], [Side], etc., are for reference only The direction of the additional schema. Therefore, the directional terms used are used to describe and understand the present invention, rather than to limit the present invention. In the figure, units with similar structures are indicated by the same reference numerals.

[0032] reference figure 1 , Is a flow chart of the method for preparing the flexible LED device provided by the present invention. The method includes the following steps:

[0033] Step S1: A P-type silicon wafer is provided as a substrate, a layer of photoresist is spin-coated on the substrate, and a layer of patterned P-type silicon is obtained on the substrate through an expo...

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Abstract

Provided are a flexible LED device and a manufacturing method thereof. The manufacturing method comprises the following steps: taking a p-type silicon wafer as a base, and performing exposure and development processes to form a layer of p-type silicon microcolumns; filling a soft polymer resin in gaps between the p-type silicon microcolumns to form a composite film; sequentially manufacturing, over the composite film, an n-type doped metal oxide film and a first metal electrode layer; and removing the base, manufacturing a second metal electrode layer, and transferring the same to a flexible base.

Description

Technical field [0001] The invention relates to the field of display device manufacturing, in particular to a flexible LED device and a preparation method thereof. Background technique [0002] LED (Lighting Emitting Diode) is a light-emitting diode. It is a semiconductor solid light-emitting device that can convert electrical energy into light energy. Similar to ordinary diodes, LEDs are composed of a PN junction. The light-emitting mechanism is to use solid semiconductor chips as Light-emitting materials, in the semiconductor, through the holes in the P region and the electrons in the N region recombine, release excess energy and cause photon emission. According to the different width of the band gap in different semiconductor materials, the holes and electrons are located The energy state is also different, so the energy released when it recombines is different, resulting in different wavelengths of light. [0003] With the development of science and technology, the performance...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L33/00H01L33/48H01L33/52H01L33/62
CPCH01L33/005H01L33/48H01L33/52H01L33/62H01L33/007H01L33/0093H01L33/40
Inventor 查宝曾燚
Owner TCL CHINA STAR OPTOELECTRONICS TECH CO LTD