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Silicon substrate having recess for receiving element and method of producing such recess

A technology for accommodating components and silicon substrates, which is applied in the coupling of optical components, optical waveguides, and optical guides, etc., and can solve problems such as the inability to determine the position of optical fibers.

Inactive Publication Date: 2002-04-17
TELEFON AB LM ERICSSON (PUBL)
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, when installing optical fibers in such grooves, it is difficult to keep the optical fibers in each groove in place throughout the installation process.
[0004] When sticking the optical fiber on the groove, it can be observed that due to the thickness of the glue layer, the optical fiber will rise to a certain extent in the groove, so it will not be possible to determine the vertical and horizontal directions of each optical fiber. s position

Method used

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  • Silicon substrate having recess for receiving element and method of producing such recess
  • Silicon substrate having recess for receiving element and method of producing such recess
  • Silicon substrate having recess for receiving element and method of producing such recess

Examples

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Embodiment Construction

[0013] figure 1 is a perspective view of a silicon substrate 1 with a V-shaped groove 2 for accommodating a component (not shown), for example one optical fiber aligned with respect to another component (not shown), two optical fibers to be spliced, A rotary shaft that will rotate, a piston that will reciprocate within a groove, and so on. It should be understood that a plurality of such grooves may be formed on one and the same substrate.

[0014] The manufacturing method of this groove 2 is, doping the dopant of the second doping type ( respectively p-type and n-type), the intended grooves 2 are then etched in a known manner.

[0015] In this regard, it should be pointed out that the groove does not have to be V-shaped, it may be of any shape in order to be able to accommodate an electronic component, for example in the form of a semiconductor chip.

[0016] In the present invention figure 1 In the embodiment of the present invention, two fixing members 3 integral with t...

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Abstract

In a silicon substrate (1) having a recess (2) for receiving an element, at least one holding element (3), integral with the substrate, extends, at least partly, over the recess (2) to hold an element received in the recess (2) in place.

Description

technical field [0001] The present invention relates to a silicon substrate having a component-receiving recess and a method of manufacturing a component-receiving recess in such a silicon substrate, comprising forming a mask area on either side of a planned recess in the silicon substrate , and then etch out the grooves. Background of the invention [0002] Generally, in the field of optoelectronics, it is common knowledge to use recesses etched in silicon substrates, so-called V-grooves, to accommodate optical fibers for high-precision alignment. [0003] However, when installing optical fibers in such grooves, it is difficult to keep the optical fibers in each groove in place throughout the installation process. [0004] When sticking the optical fiber on the groove, it can be observed that due to the thickness of the adhesive layer, the optical fiber will rise to a certain extent in the groove, so it will not be possible to determine the vertical and horizontal directio...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G02B6/24G02B6/36
CPCG02B6/3692G02B6/255G02B6/3636G02B6/3652G02B6/3801G02B6/36
Inventor Y·贝克隆德
Owner TELEFON AB LM ERICSSON (PUBL)