Stimulation flower simulating whole process of flower bloom
A technology that simulates flowers and the whole process, applied in artificial flowers, clothing, applications, etc., can solve the problems of clumsy appearance, unable to reflect the agility of flowers, unable to reflect the beauty of flowers, etc.
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Embodiment 1
[0021] Such as Figure 1 to Figure 5 As shown, a simulated flower that simulates the whole blooming process of a flower has a memory metal wire 6 embedded in the simulated petal 1, which is formed by bonding two petal leaves. The memory metal wire 2 is arranged between the two petal leaves, and the petals The leaf is a layered structure. In this embodiment, the number of petal leaf layers is 5 layers, counting from the inside to the outside. The thickness of the first layer is 0.1mm, and the material is PE; the second thickness is 0.08mm, the material is PE, and the thickness of the third layer is 0.06mm, the material is PC, the fourth layer thickness is 0.04mm, the material is PC, the fifth layer thickness is 0.02mm, the material is PU, the coloring of each petal leaf is slightly different, the outer surface color is lighter, the inner layer The color is darker, which not only increases the ductility of the petals, increases the service life of the opening and closing of the ...
Embodiment 2
[0024] Such as Figure 1 to Figure 5 As shown, a simulated flower that simulates the whole blooming process of a flower has a memory metal wire 6 embedded in the simulated petal 1, which is formed by bonding two petal leaves, and the memory metal wire 2 is arranged between the two petal leaves. The state is bud-shaped, and the petal leaves are layered. In this embodiment, the number of layers of petal leaves is 5, counting from the inside to the outside. The thickness of the first layer is 0.1mm, and the material is PE. The second thickness is 0.08mm, and the material is PE, the thickness of the third layer is 0.06mm, the material is PC, the thickness of the fourth layer is 0.04mm, the material is PC, the thickness of the fifth layer is 0.02mm, the material is PU, the coloring of each petal leaf is slightly different, the outer surface The color is lighter and the color of the inner layer is darker, which not only increases the ductility of the petals, increases the service li...
Embodiment 3
[0027] Such as Figure 1 to Figure 5 As shown, a simulated flower that simulates the whole blooming process of a flower has a memory metal wire 6 embedded in the simulated petal 1, which is formed by bonding two petal leaves, and the memory metal wire 2 is arranged between the two petal leaves. The state is bud-shaped, and the petal leaves are layered. In this embodiment, the number of layers of petal leaves is 5 layers, counting from the inside to the outside. The thickness of the first layer is 0.1mm, and the material is PE. The second thickness is 0.08mm, and the material is PE, the thickness of the third layer is 0.06mm, the material is PC, the thickness of the fourth layer is 0.04mm, the material is PC, the thickness of the fifth layer is 0.02mm, the material is PU, the coloring of each petal leaf is slightly different, the outer surface The color is lighter and the color of the inner layer is darker, which not only increases the ductility of the petals, increases the ser...
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