Electronic components and electronic equipment
A technology for electronic components and heat dissipation components, applied in the field of electronic equipment, can solve the problems of unfavorable mobile phone appearance design, complex position relationship and other problems
Active Publication Date: 2020-07-07
GUANGDONG OPPO MOBILE TELECOMM CORP LTD
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- Abstract
- Description
- Claims
- Application Information
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Problems solved by technology
In the prior art, in order to realize more and more functions in electronic devices such as mobile phones, more and more devices are integrated inside the mobile phone, and the positional relationship between each device is becoming more and more complicated. Getting bigger is not conducive to the design of the phone
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[0028] The following will clearly and completely describe the technical solutions in the embodiments of the present application with reference to the accompanying drawings in the embodiments of the present application.
[0029] In order to more clearly understand the above objects, features and advantages of the present application, the present application will be described in detail below in conjunction with the accompanying drawings and specific embodiments. It should be noted that, in the case of no conflict, the embodiments of the present application and the features in the embodiments can be combined with each other.
[0030] A lot of specific details are set forth in the following description to facilitate a full understanding of the application, and the described implementations are only a part of the implementations of the application, but not all of the implementations. Based on the implementation manners in this application, all other implementation manners obtained ...
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The embodiment of the invention provides an electronic subassembly comprising a sensor, a flexible circuit board, a sealing piece, a receiver and a heat dissipation subassembly, wherein the flexible circuit board comprises a first surface and a second surface arranged oppositely, the sensor is arranged on the first surface of the flexible circuit board, the receiver is arranged on the second surface of the flexible circuit board via the sealing piece, the sealing piece is provided with an inner cavity communicating with a vibration part of the receiver, the flexible circuit board is provided with a receiving hole, a channel between the vibration part of the receiver and the receiving hole of the flexible circuit board is formed into a sound channel for outputting sound signals of the receiver, and the heat dissipation subassembly is annularly arranged around the sealing piece. According to the electronic subassembly provided by the embodiment of the invention, the heat dissipation subassembly is annularly arranged around the sealing piece, so that heat in stacked subassemblies can be effectively radiated outwards, and the reliability is relatively good. In addition, the embodimentof the invention also provides electronic equipment.
Description
technical field [0001] The present application relates to the field of electronic equipment, in particular to an electronic component and electronic equipment. Background technique [0002] With the development of electronic equipment technology, the demand for thinner and lighter mobile phones is getting higher and higher. In the prior art, in order to realize more and more functions in electronic devices such as mobile phones, more and more devices are integrated inside the mobile phone, and the positional relationship between each device is becoming more and more complicated. Getting bigger is not conducive to the design of the phone. Contents of the invention [0003] The present application provides an electronic component and electronic equipment. [0004] An embodiment of the present application provides an electronic assembly, including a sensor, a flexible circuit board, a seal, a receiver, and a heat dissipation assembly. The flexible circuit board includes a f...
Claims
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IPC IPC(8): H04M1/02H05K7/20
CPCH04M1/026H04M1/0277H05K7/20436
Inventor 王世超
Owner GUANGDONG OPPO MOBILE TELECOMM CORP LTD