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Apparatuses and methods for internal heat spreading for packaged semiconductor die

A thermal diffusion, bare chip technology, applied in the direction of semiconductor/solid-state device components, semiconductor devices, electric solid-state devices, etc., can solve the problem of increased internal heat generation

Active Publication Date: 2018-10-23
MICRON TECH INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Combination of smaller size and improved operating goals can result in increased internal heat generation

Method used

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  • Apparatuses and methods for internal heat spreading for packaged semiconductor die
  • Apparatuses and methods for internal heat spreading for packaged semiconductor die
  • Apparatuses and methods for internal heat spreading for packaged semiconductor die

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Embodiment Construction

[0010] Disclosed herein are devices and methods for internal thermal diffusion of packaged semiconductor dies. Specific details are set forth below to provide a thorough understanding of embodiments of the present invention. However, it will be clear to those skilled in the art that the embodiments of the present invention can be practiced without these specific details. Furthermore, the specific embodiments of the present invention described herein are provided by examples and should not be used to limit the scope of the present invention to these specific embodiments. In other examples, well-known circuits, control signals, timing protocols, and software operations are not shown in detail in order to avoid unnecessarily obscuring the present invention.

[0011] The thermal management of semiconductor devices is becoming more and more of a concern and is due in part to the combination of device size and power consumption. Other factors can also contribute to thermal concerns, ...

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PUM

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Abstract

Apparatuses and methods for internal heat spreading for packaged semiconductor die are disclosed herein. An example apparatus may include a plurality of die in a stack, a bottom die supporting the plurality of die, a barrier and a heat spreader. A portion of the bottom die may extend beyond the plurality of die and a top surface of the bottom die extending beyond the plurality of die may be exposed. The barrier may be disposed alongside the plurality of die and the bottom die, and the heat spreader may be disposed over the exposed top surface of the bottom die and alongside the plurality of die.

Description

Background technique [0001] The evolution of electronic devices has forced component manufacturers to develop smaller devices while providing greater functionality and speed. The combination of smaller size and improved operating targets can result in increased internal heat generation. The increase in heat generation can be attributed to various factors, such as higher operating power, an increase in the number of dies in a single package, and crowded host devices with minimal heat dissipation. In order for the component to continue to provide the desired performance, the additional heat dissipation must pass through multiple layers at a faster rate. When the component (and the system containing the component) is larger, it may be easier to achieve additional heat dissipation due to the heat-dissipating bulk material and / or the air flow around the component. However, currently, small, high-speed devices and components containing multiple dies can benefit from packaging that p...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/367H01L23/40
CPCH01L2225/06568H01L23/42H01L23/053H01L23/3675H01L23/3677H01L25/0657H01L25/18H01L2225/06582H01L2225/06589H01L23/4012H01L2023/4068H01L2023/405H01L23/3107
Inventor D·R·亨布里
Owner MICRON TECH INC