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Solder composition alloy and solder ball

A technology of alloy and solder, which is applied in the field of solder composition alloy and tin ball, can solve the problems of interface strength drop, failure, brittle fracture of the boundary metal layer, etc., and achieve the effect of cost increase, high pass rate and improved pass rate

Active Publication Date: 2021-03-19
SHANGHAI PHICHEM MATERIAL CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Generally speaking, the solder joints formed by the aforementioned SACN alloy and SACNB alloy after multiple reflows, when the ball pushing speed is When the temperature is above 400μm / s, the interface strength of the solder joint is often reduced due to multiple reflows, and the brittle fracture of the boundary metal layer is prone to occur or the temperature cycle test at level 1 (-50°C to +150°C, 1000 cycles) In the process of failure, the welding strength cannot meet the standard required by AEC-Q100

Method used

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  • Solder composition alloy and solder ball
  • Solder composition alloy and solder ball
  • Solder composition alloy and solder ball

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1～9

[0046]

[0047] Rhodium-containing solder composition alloy and solder ball formed from the solder composition alloy

[0048] The solder composition alloys of Examples 1-9 and Comparative Examples 2-3, 5-6, 8-9 contain tin, silver, copper and rhodium, and the chemical composition and content (wt%) in these solder composition alloys are arranged respectively In Tables 1-3 below.

[0049] Table 1

[0050]

[0051]

[0052] Table 2

[0053]

[0054] table 3

[0055]

Embodiment 10～29

[0059]

[0060] Solder composition alloy containing rhodium and nickel and solder ball formed from the solder composition alloy

[0061] The solder composition alloys of Examples 10-29 and Comparative Examples 11-12, 14-15, 17-18, 20-21 contain tin, silver, copper, rhodium and nickel, and the chemical composition and content of these solder composition alloys (wt%) are respectively arranged in the following Tables 4-7.

[0062] Table 4

[0063]

[0064] table 5

[0065]

[0066] Table 6

[0067]

[0068]

[0069] Table 7

[0070]

Embodiment 30～38

[0074]

[0075] Solder composition alloy containing rhodium, nickel and bismuth and solder ball formed from the solder composition alloy

[0076] The solder composition alloys of Examples 30-38 and Comparative Examples 23-24, 26-27, 29-30 include tin, silver, copper, rhodium, nickel and bismuth, and the chemical composition and content (wt% ) are respectively arranged in Tables 8-10 below.

[0077] Table 8

[0078]

[0079]

[0080] Table 9

[0081]

[0082] Table 10

[0083]

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Abstract

The invention discloses a solder composition alloy and tin balls, and belongs to the field of solder composition alloys and tin balls with an appropriate amount of rhodium (Rh) added. Based on the total weight of the solder composition alloy as 100wt%, the solder composition alloy contains 0.9-4.1wt% silver, 0.3-1wt% copper, 0.02-0.085wt% rhodium, and the rest tin. Using the solder composition alloy of the present invention as solder, after multiple reflows, the residual tin of the solder joints can reach at least 95% by ball push test, and the residual tin meets the push ball standard required by AEC-Q100.

Description

[0001] This application claims the priority of the Taiwan Province of China patent application filed on February 07, 2018 with the application number 107104271 and the title of the invention "Solder Composition Alloy and Tin Ball", the entire contents of which are incorporated in this application by reference middle. technical field [0002] The invention relates to the field of solder composition alloys and tin balls added with an appropriate amount of rhodium (Rh), in particular to a solder composition alloy and tin balls. Background technique [0003] In recent years, with the improvement of environmental protection awareness, lead-free lead-free solders have been widely used in different fields, among which tin-silver-copper alloy (Sn-Ag-Cu, SAC) is the alloy most commonly used as lead-free solder . In addition, there are currently two other alloy combinations, one is the SACN (tin-silver-copper-nickel alloy, Sn-Ag-Cu-Ni) alloy in which nickel (Ni) is added to the SAC a...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B23K35/26B23K35/362B23K35/02
CPCB23K35/0244B23K35/262B23K35/362C22C13/00
Inventor 周永昌
Owner SHANGHAI PHICHEM MATERIAL CO LTD