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Cleaning agent composition for lead-free solder flux, cleaning method for lead-free solder flux

A technology of solder and cleaning agent, which is applied in the direction of detergent composition, cleaning method using liquid, non-surface active detergent composition, etc., can solve the problems of cleaning difficult water-soluble flux residues and corroding copper plates, etc., and achieves excellent The effect of clearance cleaning

Active Publication Date: 2020-11-27
ARAKAWA CHEM IND LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, these cleaning agents have not been studied for the purpose of removing water-soluble flux residues, and water-soluble flux residues have different characteristics from rosin flux residues. Flux residues are thoroughly cleaned
In addition, the cleaning agent composition of Patent Document 3 contains alkanolamines having an alkyl group, but such amines also have the problem of corroding metal substrates such as copper plates.

Method used

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  • Cleaning agent composition for lead-free solder flux, cleaning method for lead-free solder flux
  • Cleaning agent composition for lead-free solder flux, cleaning method for lead-free solder flux
  • Cleaning agent composition for lead-free solder flux, cleaning method for lead-free solder flux

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Embodiment

[0065] Hereinafter, although an Example and a comparative example demonstrate this invention in detail, it goes without saying that the scope of this invention is not limited by these examples.

[0066] (Preparation of cleaning agent composition for lead-free solder solder)

[0067] Each component shown in Table 1 was mixed (based on weight %), and the cleaning agent composition for lead-free solder solders of Examples 1-10 and Comparative Examples 1-6 were prepared.

[0068] [Corrosion of metal substrate (check for discoloration)]

[0069] Take 150g of the cleaning agent composition for lead-free solder solder of Example 1 into a 200ml beaker, put it into an aluminum plate (aluminum plate A1050P (specified in JIS H3100), size: 70mm x 150mm x 0.8mm), at 60°C Dipping for 10 minutes. After cooling, the aluminum plate was taken out, washed with water sufficiently, and then the liquid droplets were removed by nitrogen blowing. The presence or absence of discoloration of the alu...

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Abstract

The present invention relates to a cleaning agent composition for lead-free solder flux and a cleaning method for lead-free solder flux. The main object of the present invention is to provide a solution that can clean the flux residues generated when soldering rosin flux or water-soluble flux in a short time, and is effective even when the object to be cleaned is a mounting substrate with a complicated and fine structure. Cleaning agent composition for lead-free solder with excellent gap cleaning properties. A cleaning agent composition for lead-free solder solder, which comprises at least one compound selected from the group consisting of diethylene glycol ethyl methyl ether, diethylene glycol diethyl ether and dipropylene glycol dimethyl ether. An organic solvent (A), an alkanolamine (B) represented by the following formula (1), and a hydroxycarboxylic acid (C). (n represents an integer of 1 to 3, and R represents an alkyl or hydroxyalkyl group having 1 to 4 carbon atoms).

Description

technical field [0001] The present invention relates to a cleaning agent composition for lead-free solder flux and a cleaning method for lead-free solder flux. Background technique [0002] Soldering is generally performed when surface mounting electronic components on a printed wiring board. Generally, during soldering, flux is used for the purpose of removing the oxide film on the surface of the solder and the base material, or preventing reoxidation of the surface of the solder and the base material to obtain sufficient solderability. However, flux is corrosive, and flux residues degrade the quality of printed wiring boards. Therefore, flux residues are sometimes washed away. [0003] Conventionally, rosin-based flux (rosin flux) has been widely used for soldering joints of surface mount components, and residues of the rosin flux are cleaned with halogenated hydrocarbons such as fluorocarbons. However, since halogenated hydrocarbons are extremely harmful to the environ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C11D7/60C11D7/32C11D7/26C11D11/00B08B3/08
CPCC11D7/263C11D7/265C11D7/3218C11D11/0023B08B3/08C11D11/0047C11D7/5022
Inventor 久保夏希
Owner ARAKAWA CHEM IND LTD