Silicon wafer cutting system

Abstract

The invention relates to a silicon wafer cutting system. The silicon wafer cutting system comprises a wire feeding wheel, a plurality of wire feeding end slide wheels, a main roller, a plurality of wire receiving end slide wheels, a wire receiving wheel, a diamond wire and marking strips, wherein the wire feeding wheel, the wire feeding end slide wheels, the main roller, the wire receiving end slide wheels and the wire receiving wheel are sequentially arranged, the diamond wire winds the wire feeding wheel, the diamond wire sequentially pass the slide rails of the wire feeding end slide wheels, the main roller and the slide rails of the wire receiving end slide wheels to reach the wire receiving wheel, the marking strips attach to the diamond wire among the wire feeding end slide wheels, and the marking strips rotate when the diamond wire deviates the slide rails of the wire feeding end slide wheels. The silicon wafer cutting system can pre-judge diamond wire breaking to avoid wire breaking.

Description

technical field [0001] The invention relates to the field of silicon wafer cutting, in particular to a silicon wafer cutting system. Background technique [0002] At present, in the field of silicon wafer cutting, diamond wire silicon wafer cutting technology has many advantages, but the diamond wire of the traditional diamond wire cutting silicon wafer device often breaks, which not only increases the cost of raw materials, but also reduces production efficiency. Contents of the invention [0003] Based on this, it is necessary to provide a silicon wafer cutting system that can predict wire breakage in advance to solve the problem that the diamond wire of the traditional silicon wafer cutting device often breaks. [0004] A silicon wafer cutting system, comprising a wire feeding wheel, several wire feeding end pulleys, a main roller, several wire receiving end pulleys, and a wire receiving wheel arranged in sequence, [0005] The system also includes a diamond wire wound...

AI Technical Summary

Problems solved by technology

[0003] Based on this, it is necessary to provide a silicon wafer cutting system that can predict wire breakage in advance for the problem that the diamond wire of the traditional silicon wafer cutting device often breaks.

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