Photoelectric coupler lead frame limiting support

A technology of optocoupler and lead frame, applied in the direction of electric solid devices, circuits, electrical components, etc., can solve the problems of rust steel plate positioning dead, poor conductivity, etc., to increase conductivity, improve plating uniformity, avoid derailment or Effects of crush damage or greater friction
CN108987366AInactive Publication Date: 2018-12-11徐百灵
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
徐百灵
Publication Date
2018-12-11
Estimated Expiration
Not applicable · inactive patent

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Abstract

A photoelectric coupler lead frame limiting support comprises a positioning sliding plate arranged on one side of a lead frame of a photoelectric coupler, and an adjustable sliding mechanism arrangedon the other side of the lead frame of the photoelectric coupler, wherein the adjustable sliding mechanism comprises a fixed base; a rotating shaft arranged on the fixed base, and two positioning plates hinged to a rotating shaft and connected with each other through springs. A first rotating wheel and a second rotating wheel are symmetrically arranged on the two positioning plates respectively, positioning sliding grooves are formed in the first rotating wheel, the second rotating wheel and the positioning sliding plate. According to the photoelectric coupler lead frame limiting support, a flexible positioning conductive device is provided by the arrangement of an adjustable sliding mechanism, so that the good conductive performance is guaranteed.
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Description

technical field

[0001] The invention relates to the field of electroplating, in particular to a photocoupler lead frame limit bracket. Background technique

[0002] The photocoupler lead frame is the basic frame of the photocoupler, which is used for welding chips and other components. The traditional lead frame has insufficient flatness and brightness, poor welding performance and corrosion resistance. Therefore, electroplating is required to improve the flatness and keep the brightness. During the silver plating process of the photocoupler lead frame, it needs to be continuously transported forward, passing through multiple electroplating baths to complete the electroplating. In order to ensure electrical conductivity and tension during operation, stainless steel plates were generally used for positioning and electrical conduction. However, due to the relatively rigid positioning of rusted steel plates, and the partial deviation of the photocoupler lead frame during advan...

Claims

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