38results about How to "Improve plating uniformity" patented technology

The invention relates to a circuit board electroplating process, which comprises the following steps: step 1, taking a metal substrate; step 2, electroplating the first circuit layer on the front of the metal substrate; step 3, pressing an ABF film on the front of the metal substrate, and heat Curing operation, so that the first metal layer is coated in the cured ABF film; step 4, thinning the first metal layer to expose the ABF film; step 5, electroplating on the front of the metal substrate to form the second circuit layer, and on the back of the metal substrate Electroplating forms a compensation circuit layer; Step 7, removing the remaining photoresist film; Step 8, window etching; a circuit board electroplating process method of the present invention, which optimizes the thickness of the front electroplating by designing the compensation area on the back of the carrier board, and improves the overall layout of the circuit. Uniformity of plating.

The invention provides a method for producing a double-surface thick copper flexible working board. The invention is characterized by comprising the steps of a first step, drilling; a second step, chemical treatment; a third step, copper deposition; a fourth step, electroplating; a fifth step, pattern transferring; a sixth step, acid etching; a seventh step, covering film pressure-overlying, wherein the seventh step comprises procedures of A, treating a copper surface by means of a copper surface coarsening solution for etching the copper surface to a coarse surface and forming a honeycomb-shaped surface, B, in performing covering film pressure-overlying, utilizing silicone rubber with hardness of 45+ / -5 DEG C and temperature resistance of 250 DEG C above and below the substrate as accessories for ensuring high pressure overlaying effect of the covering film, and C, at a press jointing temperature of 190-200 DEG C and a press jointing pressure of 10-15Kg / m<2>, performing press jointing for 2-4 minutes, thereby jointing the substrate with the covering film for obtaining the working board. Because the technical solution is used, the method for producing the double-surface thick copper flexible working board has advantages of simple process, low cost, high drilling quality, and electroplating uniformity. The method further prevents the problems of bubbles on the covering film, filling glue insufficiency, thermal shock and laying in a reflow soldering test.

The present invention discloses a method for manufacturing a high-density interconnected integrated circuit board, which comprises the following steps: S1: use a UV laser drill to drill through holes in a product area on a circuit board according to design requirements, and drill through holes in a board outside the product area of ​​the board Drill test holes in the edge area; S2: Use ordinary electroplating and micro-hole electroplating technology to form a copper cladding layer on the board surface, via hole wall and test hole wall, and use resin to fill the via hole and test after copper cladding. hole; S3: copper immersion treatment is performed on the plate. S4: Use ultrasonic technology to remove glue residue on the board. The invention provides a method for manufacturing a high-density interconnected integrated circuit board with high safety, reliability and high production efficiency.

The invention provides an anode for improving electroplating uniformity. Access points connected with a positive pole of a power supply are respectively arranged at two ends of the anode, and the middle of the anode also comprises an access point connected with the positive pole of the power supply. Potentials of different positions on the anode provided by the invention are basically on the same level, the potential difference is small, and voltages on different positions on the anode to a cathode are basically the same so as to improve the electroplating uniformity. In addition, the preferable anode provided by the invention has not only the excellent electrical conductivity of copper and but also the excellent corrosion resistance of an outside titanium layer and further has long service life; meanwhile, the anode can greatly lower energy consumption and avoid polluting electroplate liquid.

A photoelectric coupler lead frame limiting support comprises a positioning sliding plate arranged on one side of a lead frame of a photoelectric coupler, and an adjustable sliding mechanism arrangedon the other side of the lead frame of the photoelectric coupler, wherein the adjustable sliding mechanism comprises a fixed base; a rotating shaft arranged on the fixed base, and two positioning plates hinged to a rotating shaft and connected with each other through springs. A first rotating wheel and a second rotating wheel are symmetrically arranged on the two positioning plates respectively, positioning sliding grooves are formed in the first rotating wheel, the second rotating wheel and the positioning sliding plate. According to the photoelectric coupler lead frame limiting support, a flexible positioning conductive device is provided by the arrangement of an adjustable sliding mechanism, so that the good conductive performance is guaranteed.

The invention discloses a high-density interconnection integrated circuit board manufacturing method which comprises the following steps that S1, a UV laser drilling machine is used to drill a via hole in the product area on a circuit board according to the design requirement, and a test hole is drilled in the board edge area outside the board product area; S2, a copper covering layer is formed on the board surface, the via hole wall and the test hole wall through a common electroplate drawing micropore electroplate technology, and the via hole and the test hole are filled with resin after copper covering is conducted; S3, electroless plating copper treatment is conducted on the board; S4, desmear treatment is conducted on the board through an ultrasonic technology. The high-density interconnection integrated circuit board manufacturing method is high in safety and reliability and high in production efficiency.

The invention discloses an electric-corrosion-resisting compound electroplating liquid for a scaffold. The compound electroplating liquid is prepared from, by weight, 6.8-9 parts of aniline, 0.1-0.2 part of ammonium persulfate, 50-60 parts of boric acid, 1.5-2 parts of EDTA, 220-250 parts of nickel sulfate, 40-50 parts of nickel chloride, 0.2-0.3 part of polyethylene glycol 8000, 50-60 parts of teflon emulsion, 3-4 parts of a cationic surfactant FC134, 2.5-3 parts of lanthanum nitrate, 2.3-2.6 parts of cerium nitrate, 4-5 parts of barium sulfate, 2.8-3.5 parts of bentonite, a proper amount of ethyl alcohol and a proper amount of deionized water. According to the prepared electroplating liquid, the preparation method is simple, the electroplating process is easy to implement, the electroplating uniformity is good, an electroplating layer is smooth and uniform, stability and density are high, corrosion resistance, rust resistance and other properties are improved, and the electroplating liquid is worthy of popularization.

The invention discloses a fixture for photovoltaic cell electroplating, which includes a flower basket and a motor. The peripheral side of the motor is fixedly connected to a fixing seat, the output shaft of the motor is fixedly connected to one end of a rotating shaft, and the end of the rotating shaft away from the motor is fixedly connected to a limiting disk. , the rotating shaft is provided with an external thread on the peripheral side near the end, and is screwed to the inside of the first fixed block, the first fixed block is fixedly installed on one side of the movable plate, and the other side of the movable plate is fixedly connected to the second fixed block. block, the inside of the second fixed block is slidably connected with a slide bar, and the middle part of the rotating shaft and the slide bar is connected to the limit seat, and the limit seat is fixedly installed on the outside of the flower basket. The chute, the inner side of the chute is slidably connected to the slider, and the clamping block is used to clamp and fix the surface, which is conducive to improving the uniformity of electroplating, so that the clamping force is evenly distributed on the surface of the silicon wafer, and the silicon wafer is prevented from being damaged by the clamp. Fragments, hidden cracks.

The invention discloses an automatic copper ball adding device. The automatic copper ball adding device sequentially comprises an adding box, inductors and a plurality of titanium basket from top to bottom. A temporary storage box is arranged at one end of the adding box. Ball feed channels corresponding to the titanium baskets are arranged on the adding box, and a lifting structure is arranged at one end of the adding box. By adoption of the automatic copper ball adding device, manual copper ball adding is changed into automatic copper ball adding, and intermittent production is changed into continuous production.

The invention discloses a cathode device for batch plating of metal heat sink components. The cathode device comprises a loading cover and a loading tray. The loading cover is in a circular truncatedcone shape. A conducting plate is arranged on the top face of the loading cover. A conducting ring is arranged on the bottom edge of the loading cover. The cover wall of the loading cover is providedwith an electroplating solution through hole array. A set wire leads are inlaid in the cover wall of the loading cover. The top ends of the metal leads are connected with the conducting plate, and thebottom end of the metal leads are connected with the conducting ring. The loading tray is connected with the bottom of the loading cover in a screw-thread fit mode to form a loading cavity used for containing the metal heat sink components. The loading tray is provided with a set of electroplating solution flow holes. A screw hole is formed in the center of the conducting plate. The top of the loading cover is provided with a mounting hole concentric with the screw hole. A conducting post is arranged in the mounting hole in a penetration mode and used for being in threaded connection with a cathode connector of electroplating equipment. Through the cathode device, there is no need to clamp the metal heat sink components, and an electroplating solution flows into and out of the loading cavity to achieve electroplating. The cathode device is simple in structure, convenient to install, good in stability, high in electroplating uniformity and capable of meeting the requirements for electroplating of the metal heat sink components.

The invention relates to the field of leveling prediction of electroplating gold, and discloses an electrochemical method for predicting the electroplating uniformity of an electroplating solution, a method for screening the electroplating solution and its application. Electrochemical method comprises: apply voltage U to carry out electroplating on the electroplating pond that electroplating solution is housed; Change described voltage U, and measure corresponding electroplating current intensity I, draw the variation curve of electroplating current intensity I to described voltage U; Through the change curve, the absolute value of the potential difference between at least two current density values ​​set for the electroplating solution is calculated, which is used to predict the electroplating uniformity of the electroplating solution through electroplating. Therefore, the plating uniformity of the electroplating solution is effectively judged and the time is short, especially the electroplating uniformity of the cyanide-free gold plating solution for wafer gold plating. It is also effective for adsorbing additives that do not have strong convection dependence on the electrode surface.

The invention discloses a clamping device suitable for multi-substrate high precision electroplating, relates to a device for clamping a plurality of different substrates for high precision electroplating, and aims to improve the problems that an existing device is complicated in structure, relatively high in cost, low in universality, low in work efficiency, relatively poor in electroplating uniformity of a product and the like. The technical key point is follows: the clamping device comprises a substrate cover (1-3-1), a substrate bottom plate (1-3-2), an anode positioning plate (1-6) and anauxiliary anode probe (1-5); a plurality of rectangular slots (1-2) are formed in the substrate bottom plate (1-3-2); rectangular through holes are formed in positions, corresponding to the rectangular slots (1-2), of the substrate cover (1-3-1); the anode positioning plate (1-6), the substrate cover (1-3-1) and the substrate bottom plate (1-3-2) are fixedly connected through fixed bolts (1-1); screw holes (1-4) are distributed in an array in the anode positioning plate (1-6); and the auxiliary anode probe (1-5) is arranged in a screw position in the anode positioning plate (1-6).