21results about How to "Improve plating uniformity" patented technology

The utility model discloses an electroplating production line for steel cords, which comprises a plurality of electroplating pools arranged in parallel, at least two anode assemblies are arranged in each electroplating pool, and the two anode assemblies are respectively arranged on two opposite sides in each electroplating pool. The anode assembly comprises a mounting unit and a plurality of anode units arranged on the mounting unit in parallel; the mounting unit comprises a mounting plate and a connecting module arranged on the mounting plate, the connecting module is used for being connected with an electroplating pool, and a plurality of mounting grooves are formed in the mounting plate; the anode unit is arranged in the mounting groove, the anode unit comprises two anode plates which are oppositely arranged, a gap is formed between the two anode plates, and a steel wire can pass through the gap. By means of the anode assemblies and the distribution positions of the anode assemblies, multiple steel wires can be electroplated at the same time, the machining efficiency is improved, and meanwhile the electroplating effect is improved.

The utility model relates to the technical field of electroplating, in particular to a barrel plating device for preventing suction of workpieces, which comprises an electroplating tank and a roller, shaft seats with upward openings are arranged on two opposite sides of the electroplating tank, short shafts are arranged at two ends of the roller, a plurality of groups of through holes are axially arranged on the roller at intervals, and each group comprises a plurality of through holes. The rollers are arranged on the same circumference at intervals; a circulating pump is arranged below the electroplating tank, an output pipe of the circulating pump extends into the electroplating tank, a plurality of vertically upward spray heads are arranged on the output pipe in the electroplating tank at intervals, and the position of each spray head corresponds to the position of each group of through holes. According to the barrel plating device capable of preventing the workpieces from being attracted, electroplating liquid is sprayed upwards from the spray head through the circulating pump and enters the barrel through the through holes of the roller, so that the mobility of the electroplating liquid in the roller is higher, and the workpieces are better separated when the workpieces roll over, so that the electroplating uniformity and the electroplating quality of the workpieces are improved.

The utility model discloses a jet flow device and electroplating equipment. The jet apparatus includes: a jet plate configured to be inserted into a plating bath and positioned between an anode and a plated object, the jet plate having a first surface for facing the anode and a second surface for facing the plated object; the nozzle is arranged on the second surface of the jet flow disc and is configured to spray electroplating liquid medicine onto a plated object; wherein the jet flow disc is provided with a through hole, and the through hole penetrates through the jet flow disc from the first surface to the second surface and is configured to limit convection of electroplating liquid medicine only from the through hole, so that electrons generated in the electroplating process only can be transmitted to a plated object from the through hole. According to the jet flow device and the electroplating equipment, the electroplating uniformity can be conveniently controlled, and particularly, the electroplating uniformity, especially the uniformity in the vertical direction, can be improved.

The utility model discloses a circuit board pattern electroplating device, which relates to the technical field of electroplating devices, and comprises a box body, a turntable is arranged above the box body, a plurality of sliding channels are arranged in the turntable, and the plurality of sliding channels are uniformly distributed around the axis of the turntable; a sliding seat is slidably connected to the interior of the sliding channel, a clamp is fixedly connected to one side of the sliding seat, an elastic telescopic rod is arranged in the sliding channel and located on the side, close to the axis of the rotary disc, of the sliding seat, one end of the elastic telescopic rod is fixedly connected to the sliding seat, and the other end of the elastic telescopic rod is fixedly connected to the rotary disc. The other end of the elastic telescopic rod is fixedly connected to the inner wall of the sliding channel, and a round rod is fixedly connected to the face, back on to the clamp, of the sliding base. According to the circuit board pattern electroplating device, the circuit board periodically moves up and down in the box body, so that the effects of improving the electroplating uniformity and improving the electroplating quality of the circuit board are achieved.

The invention discloses copper wire tin immersion auxiliary equipment and a working method thereof, and relates to the technical field of copper wire processing.The copper wire tin immersion auxiliary equipment comprises a tin pool and a plurality of copper wire bodies, a moving plate matched with the multiple copper wire bodies is installed on the tin pool, and a mounting base is installed on the tin pool through a moving assembly; a lifting motor is fixedly mounted on the mounting seat, and the output end of the lifting motor is fixedly connected with a lifting screw rod; comprising the following steps that S1, a plurality of copper wire bodies to be subjected to tin immersion treatment are sequentially inserted into corresponding placing holes in a movable plate; the automatic cleaning device has the advantages that feeding and discharging, reciprocating vibration and automatic cleaning after tin immersion of a copper wire body in the tin immersion process can be achieved through rotation of the lifting lead screw in different states, the problem of bubble attachment in tin immersion treatment is effectively avoided, meanwhile, the copper wire body does not need to be transferred among different devices, and the production efficiency is improved. And the tin immersion effect and the overall efficiency are effectively improved.

The utility model discloses a water electroplating conductive belt type transmission mechanism, which relates to the technical field of water electroplating, and comprises a bottom plate, the top of the bottom plate is fixedly connected with a supporting rod, the top of the supporting rod is fixedly connected with a base plate, the top of the bottom plate is provided with a conveying cleaning device, the conveying cleaning device comprises a conveying belt, and the conveying belt is arranged on the base plate. The bottom of the conveying belt is arranged on the top of the base plate, the side face of the bottom plate is fixedly connected with a rectangular plate, and the top of the rectangular plate is fixedly connected with a motor. According to the electroplating device, the workpieces can be cleaned before being conveyed into the electroplating box and then conveyed into the electroplating box to be electroplated, oil stains, impurities and other pollutants on the surfaces can be removed, it is guaranteed that the surfaces of the workpieces are clean, full contact between electroplating liquid and the surfaces of the workpieces is facilitated, and the electroplating quality and uniformity are improved.

The utility model discloses a planetary running barrel plating device for axial two-pole lead devices, and belongs to the technical field of electronic component manufacturing. Comprising a clamp box, a spring clamping jaw, a left planetary gear set, a right planetary gear set, a main shaft, a left driving wheel electrode column, a right driving wheel electrode column, a device support, a hanging rod, a left driving motor and a right driving motor. The clamp box comprises an outer layer insulation shell, an inner frame conductive frame body, an inter-groove insulation isolation plate and an electrode tip, the clamp box is located between the left planetary gear set and the right planetary gear set, the left planetary gear set and the right planetary gear set are connected with the electrode tip of the clamp box through spring clamping jaws, and the left driving motor drives the clamp box to rotate through the left planetary gear set. The right driving motor drives the clamp box to revolve through the right planetary gear set, and electroplating of products in the clamp box is achieved. The problems that in the barrel plating process of an existing axial two-pole lead device, leads are prone to being bent, products are wound mutually, and the surfaces of the products are abraded by friction are solved. The lead electroplating device is widely applied to the lead electroplating technology of axial two-pole lead devices.

The utility model discloses a novel device capable of improving electroplating uniformity, which relates to the technical field of electroplating, is used for solving the problem of non-uniform electroplating of the existing electroplating equipment, and comprises a bottom plate, support rods, an electroplating pool, vertical rods, sliding blocks and bearing rods, the support rods are fixedly arranged at four corners of the bottom of the bottom plate, and the top of the bottom plate is fixedly connected with the electroplating pool; the top of the bottom plate is movably connected with a vertical rod, a sliding groove is formed in the upper portion of the vertical rod, the vertical rod is movably connected with a sliding block through the sliding groove, the front end of the sliding block is fixedly connected with a bearing rod, the bottom of the front end of the bearing rod is fixedly connected with one end of an L-shaped rod, the other end of the L-shaped rod is fixedly connected with a motor, and the output end of the motor is connected with a rotating shaft. The bottom of the rotating shaft is fixedly connected with a rectangular rod, a stirring rod is installed on the side portion of the rectangular rod, the stirring rod can stir electroplating liquid in the electroplating pool, then metal ions in the electroplating liquid can be evenly distributed, and therefore an electroplated part can be evenly electroplated.

The invention provides a cathode conductive brush and a horizontal electroplating device, the cathode conductive brush comprises a conductive fixing part and a conductive contact part, the conductive contact part comprises a conductive wire and an insulating wire which are mixed, the second end of the conductive contact part is a circular arc tip, and enough yield strength can be provided through the mixed conductive wire and the insulating wire, so that the cathode conductive brush can be applied to the horizontal electroplating device. Therefore, the cathode conductive brush can be in good contact with the battery piece, the electroplating uniformity is improved, the installation is convenient, the time efficiency can be saved, and the damage to the battery piece can be effectively avoided by the arc tip. Furthermore, when electroplating is carried out through the contact area, the probability that the cathode conductive brush is electroplated by electroplating liquid can be further reduced, the service life is prolonged, and the cost is reduced. Furthermore, the horizontal electroplating device can effectively remove residual electroplating liquid on the surface of the battery piece through the arrangement of an adsorption transmission roller, and the probability that a cathode conductive brush located on the screwing-out side of the adsorption transmission roller is electroplated is further reduced.

The invention relates to a composite aluminum foil, a method for preparing the composite aluminum foil and electroplating liquid. The electroplating liquid for preparing the composite aluminum foil comprises ionic liquid and an additive, wherein the additive is selected from one or more of nicotinic acid, methyl nicotinate, 3-methylpyridine, benzoic acid and ethylene glycol. The method for preparing the composite aluminum foil comprises the step of preparing the composite aluminum foil by adopting the electroplating liquid. By means of the electroplating liquid and the method, the composite aluminum foil with the improved electroplating uniformity can be prepared.

This utility model discloses a novel copper cylinder for TGV and ceramic filling electroplating, relating to the field of copper cylinder technology. It includes a copper cylinder body, with a left-right oscillating motor on one side and an eccentric wheel assembly at the output end of the oscillating motor. Two rows of side spray pipes are symmetrically arranged within the copper cylinder body, with the nozzles of the two rows of side spray pipes installed alternately. A hanger for suspending workpieces is provided between the two rows of side spray pipes. The two ends of the hanger are fixed to the middle position of the copper cylinder body via hanger guide grooves. This utility model, based on a traditional copper cylinder, changes the original left-right oscillating cathode flat plate and hanger to a fixed installation, and changes the side spray pipes to left-right oscillation, keeping the relative position of the hanger and anode unchanged, thereby forming a more uniform electroplating layer and improving electroplating uniformity.

The invention provides a printed circuit board and a design method for resistance balance between electroplated PADs on the printed circuit board, and particularly, all the electroplated PADs on the board surface of the printed circuit board are grouped according to the areas of the electroplated PADs on the board surface, in any electroplating PAD group, the electroplating PAD group is connected to a first guide wire adjacent to the electroplating PAD group through a second guide wire, and the electroplating PAD group is connected to a second guide wire through a third guide wire. And each electroplating PAD in the group is connected to one end of the second guide wire through the corresponding branch lead, so that the resistance of all the electroplating PAD on the printed circuit board is the same as the resistance of the conducting metal frame. According to the invention, the inter-group design and the intra-group design are carried out on the leads of the electroplated metal PAD, so that the arrangement mode and size of the leads are simplified while the resistance balance among all the electroplated PAD on the printed circuit board is effectively realized; the electroplating uniformity of all electroplated PADs on the surface of the printed circuit board is improved, meanwhile, the metal layer design of the board surface of the printed circuit board is simplified, the utilization rate of the board surface is improved, and the production cost is saved.

The present invention discloses a copper wire tinning auxiliary equipment and a working method thereof, and relates to the technical field of copper wire processing. The present invention comprises a tin pool and a plurality of copper wire bodies, wherein a movable plate matching with the plurality of copper wire bodies is installed on the tin pool, a mounting seat is installed on the tin pool through a movable assembly, and a lifting motor is fixedly installed on the mounting seat, and a lifting screw is fixedly connected to the output end of the lifting motor; the following steps are included: S1: inserting a plurality of copper wire bodies to be tinned into corresponding placement holes on the moving plate in sequence. The advantage is that the present invention utilizes the rotation of the lifting screw in different states to respectively realize the loading and unloading, reciprocating vibration and automatic cleaning of the copper wire body during the tinning process, effectively avoiding the problem of bubble adhesion during the tinning process, and at the same time, there is no need to transfer the copper wire body between different devices, which effectively improves the tinning effect and overall efficiency.

This invention discloses a method for screening electroplating conditions for nickel-phosphorus-graphene. The method provides formulas for calculating the difference in coating thickness; formulas for linearly fitting the coating thickness to temperature at different temperatures; formulas for linearly fitting the coating thickness to current density at different current densities; and formulas for linearly fitting the coating thickness to graphene concentration at different graphene concentrations. Therefore, given values ​​for graphene concentration, current density, and temperature, these are calculated using the corresponding formulas. Based on the criterion that the sum of the variance of the results and the difference in coating thickness is as close to zero as possible, the optimal conditions for preparing nickel-phosphorus-graphene coatings can be screened. Therefore, this invention has the technical effect of screening the optimal conditions required for electroplating to improve electroplating uniformity.

The utility model discloses a conveying device which is used for conveying a workpiece to be electroplated into an electroplating pool, the conveying device comprises a rack, a plurality of hanging racks and a clamping assembly, the plurality of hanging racks are respectively connected to the rack, the plurality of hanging racks are respectively arranged at intervals along a first direction, and each hanging rack comprises a hanging rack; the clamping assembly comprises a clamping piece and a clamping piece, the clamping piece and the clamping piece are arranged on the two adjacent hanging frames respectively, and the clamping piece is clamped to the clamping piece, so that the distance between the two adjacent hanging frames is within a preset range. According to the utility model, the clamping assembly comprises the clamping piece and the clamping connection piece, and the clamping connection between the clamping piece and the clamping connection piece is simple and stable, so that the distance between two adjacent hanging pieces is within a preset range value, and the electroplating uniformity is improved.

The utility model discloses a device for improving electroplating uniformity of an integrated circuit (IC) carrier plate, which comprises a first hanging rack part and a second hanging rack part, and a third hanging rack part and a fourth hanging rack part are positioned at the bottoms of the first hanging rack part and the second hanging rack part. Butterfly head screws are positioned between the first hanging frame part and the second hanging frame part and between the third hanging frame part and the fourth hanging frame part, the first hanging frame part and the second hanging frame part are each provided with a long hanging frame advancing driving foot and a short hanging frame advancing driving foot, and hanging frames are installed on the third hanging frame part and the fourth hanging frame part. A hanger chuck is positioned at the bottom of the hanger, and a thin plate frame is positioned and mounted at the bottom of the hanger chuck. According to the device for improving the electroplating uniformity of the IC support plate, current can be controlled to flow into each hanger and four chucks and can be equally distributed to each chuck according to the plating thickness, the R value of a single chip is smaller than or equal to 2 microns, and the R value between the chips is smaller than or equal to 4 microns.

The double-sided multi-layer PCB electroplating equipment comprises two side strip frames which are parallel to each other, and further comprises a plurality of electrolytic bath structures and a plurality of non-electrified liquid tanks, the angle of the PCB can be changed through the air cylinder, when the PCB is lifted to leave liquid, the PCB is inclined, so that the liquid starts to flow down from one corner, then the PCB is changed into a vertical state, the amount of the liquid stained on the surface of the PCB is reduced, the liquid can be emptied more orderly through the path, on the basis, the two sides of the PCB can be shielded by the fixed flow guide baffle and the movable flow guide baffle, and under the action of gravity, the PCB can be separated from the liquid. Liquid flows downwards, the downward flowing path of the liquid is optimized by changing the inclined mode into the vertical mode, and due to the fact that the liquid can be preferentially attached to the continuous solid surface which is firstly in contact with the liquid and reaches the surfaces of the adjacent fixed flow guide baffle and the movable flow guide baffle under the capillary action, the flowing displacement of the liquid on the PCB is improved, and the flowing speed of the PCB is increased. Therefore, the influence of the downward flowing liquid on the surface of the PCB is relieved, and the electroplating uniformity is improved.

The invention discloses an automatic layering electroplating bath for surface treatment of metal parts, and relates to the field of metal electroplating, the automatic layering electroplating bath comprises a base body, a mounting block and hanging racks, the mounting block is arranged above the base body, the hanging racks for hanging the metal parts are uniformly distributed below the mounting block, a first electroplating chamber is arranged in the base body, and a second electroplating chamber is arranged in the first electroplating chamber; and the second electroplating chamber is arranged on the right side of the first electroplating chamber, the first electroplating chamber and the second electroplating chamber are connected with each other to form a left-right sliding structure with the base body, and an opening is formed in the upper middle portion of the base body to expose the interior of the first electroplating chamber. According to the automatic layered electroplating bath for surface treatment of the metal piece, electroplating treatment of different electroplated layers of a product can be achieved through the arrangement of the first electroplating chamber and the second electroplating chamber, the first electroplating chamber and the second electroplating chamber can move in the base body, switching of use of the electroplating chambers is achieved, the subsequent electroplating efficiency is improved, and dripping of electroplating liquid is also avoided.

The utility model discloses a conveying device which comprises a machine frame, an elastic clamping assembly and a plurality of hanging frames, and the hanging frames are connected to the machine frame and arranged at intervals in the first direction. Every two adjacent hanging frames are connected through an elastic clamping assembly, so that the distance between every two adjacent hanging frames is within a preset range. According to the utility model, the elastic clamping component is arranged, the structure is simple, the component has elasticity, and the clamping stability of the component cannot be influenced by collision of the internal structure of the component, so that the distance between two adjacent hanging pieces can be within a preset range value, and the electroplating uniformity is improved.

The invention relates to the technical field of lithium ion batteries, in particular to a current collector and a preparation method thereof. Comprising the following steps that S1, aluminum foil with natural aluminum oxide layers on the two sides is taken for standby application; wherein the area of the non-natural aluminum oxide layer in the aluminum foil is an aluminum layer; s2, taking the natural aluminum oxide layer on one side of the aluminum foil as a first aluminum oxide layer; thinning the natural aluminum oxide layer on the other side of the aluminum foil in a vacuum environment or under the protection of inert gas to obtain a second aluminum oxide layer; taking the aluminum foil as pretreated aluminum foil; s3, performing magnetron sputtering copper plating on the surface of the second aluminum oxide layer of the pretreated aluminum foil in a vacuum environment or under the protection of inert gas to obtain a first copper layer; electroplating copper on the surface of the first copper layer by using electrolyte to obtain a second copper layer; and obtaining the current collector. The current collector has high mechanical strength, flow capacity and structural stability.

The utility model relates to the technical field of electroplating processing, in particular to a hanger for improving electroplating uniformity. The hanging rack comprises a hanging rack body and a plurality of clamps arranged on the hanging rack body, conducting strips are arranged on the two sides of the hanging rack body, gaskets are arranged between the conducting strips and the hanging rack body, and a base plate is arranged in the middle of the hanging rack body; the hanger body comprises a fixing rod and a connecting rod, a conducting strip is arranged on the connecting rod, and a clamp is fixed on the fixing rod; the upper and lower ends of the conducting strip are provided with through holes, and the conducting strip and the connecting rod are fixedly connected through screws. According to the invention, the distribution of current in the hanger can be optimized, the problem of non-uniform current distribution is reduced, and the electroplating uniformity is improved.