3results about How to "Improve plating uniformity" patented technology

This utility model discloses a novel copper cylinder for TGV and ceramic filling electroplating, relating to the field of copper cylinder technology. It includes a copper cylinder body, with a left-right oscillating motor on one side and an eccentric wheel assembly at the output end of the oscillating motor. Two rows of side spray pipes are symmetrically arranged within the copper cylinder body, with the nozzles of the two rows of side spray pipes installed alternately. A hanger for suspending workpieces is provided between the two rows of side spray pipes. The two ends of the hanger are fixed to the middle position of the copper cylinder body via hanger guide grooves. This utility model, based on a traditional copper cylinder, changes the original left-right oscillating cathode flat plate and hanger to a fixed installation, and changes the side spray pipes to left-right oscillation, keeping the relative position of the hanger and anode unchanged, thereby forming a more uniform electroplating layer and improving electroplating uniformity.

This invention discloses a method for screening electroplating conditions for nickel-phosphorus-graphene. The method provides formulas for calculating the difference in coating thickness; formulas for linearly fitting the coating thickness to temperature at different temperatures; formulas for linearly fitting the coating thickness to current density at different current densities; and formulas for linearly fitting the coating thickness to graphene concentration at different graphene concentrations. Therefore, given values ​​for graphene concentration, current density, and temperature, these are calculated using the corresponding formulas. Based on the criterion that the sum of the variance of the results and the difference in coating thickness is as close to zero as possible, the optimal conditions for preparing nickel-phosphorus-graphene coatings can be screened. Therefore, this invention has the technical effect of screening the optimal conditions required for electroplating to improve electroplating uniformity.

The double-sided multi-layer PCB electroplating equipment comprises two side strip frames which are parallel to each other, and further comprises a plurality of electrolytic bath structures and a plurality of non-electrified liquid tanks, the angle of the PCB can be changed through the air cylinder, when the PCB is lifted to leave liquid, the PCB is inclined, so that the liquid starts to flow down from one corner, then the PCB is changed into a vertical state, the amount of the liquid stained on the surface of the PCB is reduced, the liquid can be emptied more orderly through the path, on the basis, the two sides of the PCB can be shielded by the fixed flow guide baffle and the movable flow guide baffle, and under the action of gravity, the PCB can be separated from the liquid. Liquid flows downwards, the downward flowing path of the liquid is optimized by changing the inclined mode into the vertical mode, and due to the fact that the liquid can be preferentially attached to the continuous solid surface which is firstly in contact with the liquid and reaches the surfaces of the adjacent fixed flow guide baffle and the movable flow guide baffle under the capillary action, the flowing displacement of the liquid on the PCB is improved, and the flowing speed of the PCB is increased. Therefore, the influence of the downward flowing liquid on the surface of the PCB is relieved, and the electroplating uniformity is improved.