A kind of high-density interconnection integrated circuit board manufacturing method

An integrated circuit board, high-density interconnection technology, applied in the directions of printed circuit manufacturing, printed circuit, printed circuit secondary processing, etc., can solve the problems of many production process links, insufficient safety and reliability, and low production efficiency, etc. Achieve the effect of improving production efficiency and production quality, improving reliability and safety, and enhancing electroplating uniformity
CN104144571BActive Publication Date: 2018-02-27四川深北电路科技有限公司
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
四川深北电路科技有限公司
Publication Date
2018-02-27

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Abstract

The present invention discloses a method for manufacturing a high-density interconnected integrated circuit board, which comprises the following steps: S1: use a UV laser drill to drill through holes in a product area on a circuit board according to design requirements, and drill through holes in a board outside the product area of ​​the board Drill test holes in the edge area; S2: Use ordinary electroplating and micro-hole electroplating technology to form a copper cladding layer on the board surface, via hole wall and test hole wall, and use resin to fill the via hole and test after copper cladding. hole; S3: copper immersion treatment is performed on the plate. S4: Use ultrasonic technology to remove glue residue on the board. The invention provides a method for manufacturing a high-density interconnected integrated circuit board with high safety, reliability and high production efficiency.
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Description

technical field

[0001] The invention relates to a method for manufacturing a high-density interconnection integrated circuit board. Background technique

[0002] A high-density printed circuit board is a structural component formed of insulating materials supplemented by conductor wiring. When the final product is made, integrated circuits, transistors, diodes, passive components (such as: resistors, capacitors, connectors, etc.) and various other electronic components will be installed on it. Through the connection of wires, electronic signal connection and corresponding functions can be formed. Therefore, the printed circuit board is a platform that provides component connections and is used to undertake the basis for connecting parts.

[0003] In order to avoid confusion, the IPC Circuit Board Association of the United States proposed to call this type of product the general name of HDI (High Density Intrerconnection Technology). If it is directly translated, it will be...

Claims

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