Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

A kind of high-density interconnection integrated circuit board manufacturing method

An integrated circuit board, high-density interconnection technology, applied in the directions of printed circuit manufacturing, printed circuit, printed circuit secondary processing, etc., can solve the problems of many production process links, insufficient safety and reliability, and low production efficiency, etc. Achieve the effect of improving production efficiency and production quality, improving reliability and safety, and enhancing electroplating uniformity

Active Publication Date: 2018-02-27
四川深北电路科技有限公司
View PDF9 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] There are many deficiencies in the current production of high-density interconnected integrated circuit boards, such as low production efficiency, insufficient safety and reliability, too many production process links, long processing cycle, and high production costs, etc.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • A kind of high-density interconnection integrated circuit board manufacturing method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0018] Further describe the technical scheme of the present invention in detail below in conjunction with accompanying drawing:

[0019] Such as figure 1 Shown, a kind of high-density interconnection integrated circuit board fabrication method, it comprises the following steps:

[0020] S1: Use a UV laser drill to drill through holes in the product area on the circuit board according to the design requirements, and drill test holes in the edge area of ​​the board outside the product area;

[0021] S2: Use ordinary electroplating and micro-hole electroplating technology to form a copper clad layer on the plate surface, the wall of the via hole and the wall of the test hole, and fill the via hole and the test hole with resin after copper cladding;

[0022] S3: Carry out sinking copper treatment to plate;

[0023] S4: Use ultrasonic technology to remove slag from the board.

[0024] The stated test hole diameter is the same as the smallest via hole diameter in the product area...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The present invention discloses a method for manufacturing a high-density interconnected integrated circuit board, which comprises the following steps: S1: use a UV laser drill to drill through holes in a product area on a circuit board according to design requirements, and drill through holes in a board outside the product area of ​​the board Drill test holes in the edge area; S2: Use ordinary electroplating and micro-hole electroplating technology to form a copper cladding layer on the board surface, via hole wall and test hole wall, and use resin to fill the via hole and test after copper cladding. hole; S3: copper immersion treatment is performed on the plate. S4: Use ultrasonic technology to remove glue residue on the board. The invention provides a method for manufacturing a high-density interconnected integrated circuit board with high safety, reliability and high production efficiency.

Description

technical field [0001] The invention relates to a method for manufacturing a high-density interconnection integrated circuit board. Background technique [0002] A high-density printed circuit board is a structural component formed of insulating materials supplemented by conductor wiring. When the final product is made, integrated circuits, transistors, diodes, passive components (such as: resistors, capacitors, connectors, etc.) and various other electronic components will be installed on it. Through the connection of wires, electronic signal connection and corresponding functions can be formed. Therefore, the printed circuit board is a platform that provides component connections and is used to undertake the basis for connecting parts. [0003] In order to avoid confusion, the IPC Circuit Board Association of the United States proposed to call this type of product the general name of HDI (High Density Intrerconnection Technology). If it is directly translated, it will be...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/00H05K3/42H05K3/26
Inventor 黄国建
Owner 四川深北电路科技有限公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com