Copper plating additive suitable for printed circuit board and copper electroplating solution

Abstract

The invention relates to the field of copper plating additives, and particularly discloses a copper plating additive suitable for a printed circuit board and a copper electroplating solution. The copper plating additive comprises the following components according to the concentration ratio: 1-50 mg/L of brightening agent, 1-100 mg/L of leveling agent, 0.5-50 g/L of wetting agent and the balance pure water. The copper electroplating solution comprises the following components according to the concentration ratio: 180-250g/L of sulfuric acid, 50-80g/L of copper sulfate pentahydrate, 40-120ppm of chloride ions, 10-50ml/L of coppering additive and the balance pure water. According to the copper plating additive, the uniformity of a plating layer and the deep plating capacity of a plating solution can be effectively improved, the deep plating capacity TP of a through hole with the aspect ratio being 8 can reach 92.4%, the deep plating capacity TP of a through hole with the aspect ratio being 12 can reach 83.3%, and the electroplating uniformity COV of the printed circuit board can reach 9.5%.

Description

technical field [0001] The application relates to the field of copper plating additives, more specifically, it relates to a copper plating additive and electroplating copper plating solution suitable for printed circuit boards. Background technique [0002] With the development trend of small size and high precision of electronic products, the development of microelectronics technology has attracted much attention. Integrated circuit technology, especially printed circuits, is gradually developing towards smaller, denser packaging and more interconnection points. , as a rapidly developing technology, high-density interconnection is increasingly becoming the mainstream of standard printed circuit design, production and assembly factors. As the size of electronic components continues to shrink, components must be interconnected with high performance, high reliability, high density, and low cost to build an electronic product with extensive functions and practical value. [00...

AI Technical Summary

Problems solved by technology

[0006] In order to improve the problem of poor deep plating ability of the electroplating solution, the application provides a copper plating additive and an electroplating copper plating solution suitable for printed circuit boards

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