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Copper plating additive suitable for printed circuit board and copper electroplating solution

A technology for printed circuit boards and additives, used in printed circuits, printed circuit manufacturing, electrical components, etc., can solve the problems of poor deep plating ability of electroplating solution, and achieve strong deep plating ability, reduce difficulty, and uniform distribution of ions in the coating layer. Effect

Pending Publication Date: 2021-09-28
珠海松柏科技有限公司 +2
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] In order to improve the problem of poor deep plating ability of the electroplating solution, the application provides a copper plating additive and an electroplating copper plating solution suitable for printed circuit boards

Method used

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  • Copper plating additive suitable for printed circuit board and copper electroplating solution
  • Copper plating additive suitable for printed circuit board and copper electroplating solution
  • Copper plating additive suitable for printed circuit board and copper electroplating solution

Examples

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Effect test

Embodiment 1

[0055] The application discloses an electroplating copper plating solution suitable for encapsulating carrier boards and printed circuit boards. The electroplating copper plating solution consists of the following components in a concentration ratio:

[0056] Sulfuric acid 200g / L;

[0057] Copper sulfate pentahydrate 70g / L;

[0058] Chloride ion 70ppm;

[0059] Copper plating additive 50ml / L;

[0060] The balance is pure water, wherein the chloride ions are derived from hydrochloric acid.

[0061] Copper plating additives consist of the following components in concentration ratio:

[0062] Brightener 30mg / L;

[0063] Leveling agent 50mg / L;

[0064] Wetting agent 20g / L;

[0065] The balance is pure water.

[0066] Wherein the brightener is sodium polydithiodipropane sulfonate, the leveling agent is polyethylene oxide polypropylene oxide monobutyl ether, and the wetting agent is polyethylene glycol 6000.

Embodiment 2

[0068] The difference from Example 1 is that the concentration ratio of the brightener in Example 2 is 1 mg / L.

Embodiment 3

[0070] The difference from Example 1 is that the concentration ratio of the brightener in Example 3 is 25mg / L.

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Abstract

The invention relates to the field of copper plating additives, and particularly discloses a copper plating additive suitable for a printed circuit board and a copper electroplating solution. The copper plating additive comprises the following components according to the concentration ratio: 1-50 mg / L of brightening agent, 1-100 mg / L of leveling agent, 0.5-50 g / L of wetting agent and the balance pure water. The copper electroplating solution comprises the following components according to the concentration ratio: 180-250g / L of sulfuric acid, 50-80g / L of copper sulfate pentahydrate, 40-120ppm of chloride ions, 10-50ml / L of coppering additive and the balance pure water. According to the copper plating additive, the uniformity of a plating layer and the deep plating capacity of a plating solution can be effectively improved, the deep plating capacity TP of a through hole with the aspect ratio being 8 can reach 92.4%, the deep plating capacity TP of a through hole with the aspect ratio being 12 can reach 83.3%, and the electroplating uniformity COV of the printed circuit board can reach 9.5%.

Description

technical field [0001] The application relates to the field of copper plating additives, more specifically, it relates to a copper plating additive and electroplating copper plating solution suitable for printed circuit boards. Background technique [0002] With the development trend of small size and high precision of electronic products, the development of microelectronics technology has attracted much attention. Integrated circuit technology, especially printed circuits, is gradually developing towards smaller, denser packaging and more interconnection points. , as a rapidly developing technology, high-density interconnection is increasingly becoming the mainstream of standard printed circuit design, production and assembly factors. As the size of electronic components continues to shrink, components must be interconnected with high performance, high reliability, high density, and low cost to build an electronic product with extensive functions and practical value. [00...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25D3/38C25D7/00H05K3/18
CPCC25D3/38C25D7/00H05K3/188
Inventor 饶猛莫庆生
Owner 珠海松柏科技有限公司
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