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Anode for improving electroplating uniformity

A uniformity and anode technology, applied in the field of anodes to improve the uniformity of electroplating, can solve the problems of lowering the quality of PCB boards, poor electroplating uniformity of PCB boards, etc., and achieve the effects of improving uniformity, excellent electrical conductivity and reducing energy consumption.

Inactive Publication Date: 2015-03-25
东莞市宏德电子设备有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, in the preparation process of the PCB board, the existing anode wiring method is to connect from both ends of the anode, so that there is a potential difference between the middle part of the anode and the two ends, resulting in a connection between the different positions of the anode and the cathode (PCB board) ) The voltage difference between them is not equal, resulting in low plating uniformity of the PCB board, which reduces the quality of the produced PCB board

Method used

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  • Anode for improving electroplating uniformity
  • Anode for improving electroplating uniformity
  • Anode for improving electroplating uniformity

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0030] Such as figure 2 As shown, an anode used to improve the uniformity of electroplating is provided with an access point 101 and 102 connected to the positive pole of the power supply at both ends of the sunken anode rod 1, and at the same time, in the middle of the sunken anode It also includes an access point 103 connected to the positive pole of the power supply. The direct distance between the access point 101 and the access point 103 is equal to the distance between the access point 102 and the access point 103, which is 1.7 meters. This makes the potential of the entire submerged anode rod basically at the same level, the potential difference is small, and the voltage from the anode to the cathode is basically equal, thereby improving the uniformity of electroplating.

[0031] Preferably, the anode is a titanium-clad copper anode. That is, the titanium layer is laminated on the copper surface (substrate), so that it has both the excellent electrical conductivity of...

Embodiment 2

[0033] Such as image 3 As shown, an anode used to improve the uniformity of electroplating has an access point 101 and 102 connected to the positive pole of the power supply at both ends of the anode, and at the same time, there are two connection points connected to the positive pole of the power supply in the middle of the anode. The access points are 103, 104, and 105 respectively, and the distance between adjacent access points is equal, which is 1.5 meters. This makes the potential of the entire submerged anode rod basically at the same level, the potential difference is small, and the voltage from the anode to the cathode is basically equal, thereby improving the uniformity of electroplating.

[0034] Preferably, the anode is a titanium-clad copper anode. That is, the titanium layer is laminated on the copper surface (substrate), so that it has both the excellent electrical conductivity of copper and the excellent corrosion resistance of the outer titanium layer, which...

Embodiment 3

[0036] Such as Figure 5 As shown, a submerged anode rod used to improve the uniformity of electroplating has an access point 101, 102 connected to the positive pole 501 of the rectifier 5 at both ends of the anode rod, and at the same time, there is also an access point in the middle of the anode It includes two access points connected to the positive pole of the rectifier, which are respectively 103 and 104, and the distance between adjacent access points is equal, which is 1.5 meters. When electroplating the PCB board, two submerged anode rods are arranged on both sides of the electroplating tank 3, parallel to each other; the PCB board is located in the center of the electroplating tank 3, parallel to the submerged anode rod, and the PCB board and the The cathode 502 of the machine is electrically connected; at this time, the potentials of A point 11, B point 12, C point 13, D point 14, and E point 15 of the submerged anode rod are basically at the same level as the potent...

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Abstract

The invention provides an anode for improving electroplating uniformity. Access points connected with a positive pole of a power supply are respectively arranged at two ends of the anode, and the middle of the anode also comprises an access point connected with the positive pole of the power supply. Potentials of different positions on the anode provided by the invention are basically on the same level, the potential difference is small, and voltages on different positions on the anode to a cathode are basically the same so as to improve the electroplating uniformity. In addition, the preferable anode provided by the invention has not only the excellent electrical conductivity of copper and but also the excellent corrosion resistance of an outside titanium layer and further has long service life; meanwhile, the anode can greatly lower energy consumption and avoid polluting electroplate liquid.

Description

technical field [0001] The invention relates to an anode for electroplating, in particular to an anode for improving the uniformity of electroplating. Background technique [0002] In the electroplating process, the anode is an important factor affecting the quality of the electroplating. In addition to its basic conductive function, it also affects the stability, dispersion and depth of the liquid, thereby affecting the thickness and uniformity of the coating. At present, in the preparation process of the PCB board, the existing anode wiring method is to connect from both ends of the anode, so that there is a potential difference between the middle part of the anode and the two ends, resulting in a connection between the different positions of the anode and the cathode (PCB board) ) The voltage difference between them is not equal, resulting in low plating uniformity of the PCB board, which reduces the quality of the produced PCB board. Contents of the invention [000...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C25D17/12
Inventor 马国宏
Owner 东莞市宏德电子设备有限公司
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