Circuit board electroplating method

Abstract

The invention discloses a circuit board electroplating method. The circuit board electroplating method comprises steps that a front selective plating region and a back selective plating region of a single product are separately obtained; when the areas of the front selective plating region and the back selective plating region are different, a raw material for making the single product is subjected to selective plating region arrangement, the front selective plating regions of adjacent two single products located in the same row are respectively located on two sides of the raw material, and the total areas of the selective plating regions of the two sides of the raw material are the same, and the raw material is electroplated according to selective plating region arrangement. The circuit board electroplating method is advantaged in that the area of non-selective plating regions of the raw material is not needed, plating parameters on the two sides of the raw material are the same, plating uniformity is good, and plating cost can be saved.

Description

technical field [0001] The invention relates to the technical field of electroplating, in particular to a circuit board electroplating method. Background technique [0002] With the development of electronic products, the requirements for the electrical performance and folding resistance of circuit boards are getting higher and higher. Therefore, circuit boards are mostly electroplated by selective plating, such as figure 1 and figure 2 Shown, when selecting plating, usually front side and back side select plating area to be different, there is following shortcoming: 1, by adjusting the area of ​​non-select plating area, make the select plating area of ​​two sides equal (as image 3 shown), which will lead to uneven copper plating on the surface copper and hole copper (such as Figure 4 As shown), the post-process (etching) is very difficult; 2. By reducing the area of ​​the non-selective plating area on the front, the area of ​​the selective plating area on both sides is...

AI Technical Summary

Problems solved by technology

[0002] With the development of electronic products, the requirements for the electrical performance and folding resistance of circuit boards are getting higher and higher. Therefore, circuit boards are mostly electroplated by selective plating, such as figure 1 and figure 2 Shown, when selecting plating, usually front side and back side select plating area to be different, there is following shortcoming: 1, by adjusting the area of ​​non-select plating area, make the select plating area of ​​two sides equal (as image 3 shown), which will lead to uneven copper plating on the surface copper and hole copper (such as Figure 4 As shown), the post-process (etching) is very difficult; 2. By reducing the area of ​​the non-selective plating area on the front, the area of ​​the selective plating area on both sides is equal, which will increase the production cost; 3. Adjust the current density of the front and back through the equipment, the current When the density is different, the copper ions are affected by different currents in the copper plating tank, which will lead to differences in the copper deposition rate, resulting in uneven copper plating.

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