Technological method for electro-coppering of PCB (printed circuit board)

Abstract

The invention provides a technological method for electro-coppering of a PCB (printed circuit board). The technological method mainly comprises the following steps: (1) deburring: PCB feeding, PCB grinding, high-pressure washing, oven-drying and then PCB discharging are performed; (2) copper deposition: PCB loading, swelling, first washing, desmear, second washing, pre-neutralization, third washing, neutralization, ultrasonic washing, deoiling, post-deoiling, fourth washing, mild etching, fifth washing, pre-impregnation, activation, acceleration, sixth washing, chemical copper deposition, acid pickling and seventh washing are performed; and (3), copper intensification: PCB loading, deoiling, washing, acid leaching, plating thickening, high-position washing and PCB discharging. According to the technological method provided by the invention, a vibrating device is added to the copper deposition process, so that the circumstance of no copper in holes can be obviously improved; through the special design for a plating tank in the cooper intensification process, not only can the activity of a plating solution be guaranteed, but also the plating uniformity can be facilitated; and meanwhile, through synergistic action between the plating solution and the plating tank, the highest plating uniformity and plating efficiency can be achieved.

Description

technical field [0001] The invention relates to an electroplating link in a PCB board manufacturing process, in particular to a process method for electroplating copper on a PCB board. Background technique [0002] PCB (Printed Circuit Board), the Chinese name is a printed circuit board, which is used in electronic components to form a predetermined circuit connection between electronic components and plays the role of relay transmission. It is a key electronic interconnection of electronic products. With the rapid development of high-tech industries, the world's printed circuit board (PCB) industry has also developed rapidly. In 2011, the growth rate of China's PCB output value was 9.2%, accounting for 39.8% of the world's total output value, reaching 23 billion US dollars. Therefore, China's PCB boards still have a lot of room for development. [0003] In the manufacturing process of PCB boards, there are many processes that involve electroplating, such as chemical coppe...

AI Technical Summary

Problems solved by technology

As far as the current electroplating tank body is concerned, since the size of the plated part is sometimes smaller than the size of the anode plate, it may cause uneven electric field action, resulting in uneven thickness of the coating on the upper and lower parts of the plated part, especially at the upper and lower ends of the workpiece. Inconsistency with the thickness in the middle will lead to quality problems in the electroplated parts; sometimes due to the different electroplating positions in the electric field, the effect of the electric field is also different, which may lead to uneven electroplating, resulting in uneven thickness of the electroplating layer