Electrochemical methods for predicting electroplating uniformity of electroplating baths, methods and applications for screening electroplating baths

Abstract

The invention relates to the field of leveling prediction of electroplating gold, and discloses an electrochemical method for predicting the electroplating uniformity of an electroplating solution, a method for screening the electroplating solution and its application. Electrochemical method comprises: apply voltage U to carry out electroplating on the electroplating pond that electroplating solution is housed; Change described voltage U, and measure corresponding electroplating current intensity I, draw the variation curve of electroplating current intensity I to described voltage U; Through the change curve, the absolute value of the potential difference between at least two current density values ​​set for the electroplating solution is calculated, which is used to predict the electroplating uniformity of the electroplating solution through electroplating. Therefore, the plating uniformity of the electroplating solution is effectively judged and the time is short, especially the electroplating uniformity of the cyanide-free gold plating solution for wafer gold plating. It is also effective for adsorbing additives that do not have strong convection dependence on the electrode surface.

Description

technical field [0001] The invention relates to the field of leveling prediction of electroplating gold, in particular to an electrochemical method for predicting the electroplating uniformity of an electroplating solution, a method for screening the electroplating solution and its application. Background technique [0002] Driven by Moore's Law, chip manufacturing continues to develop along two paths: 1) The number of transistors that can be accommodated per unit area continues to grow as the manufacturing process continues to shrink; 2) The size of silicon wafers has changed from 6 inches and 8 inches to the current mainstream 12 inches As development progresses, the more available chips can be produced on a single wafer. These two changes have brought challenges to the thickness uniformity of electroplating on the wafer. On the one hand, with the increase in the number of transistors, the distance between the wires connecting the chip needs to be reduced, and the correspo...

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Problems solved by technology

[0007] The purpose of the present invention is to overcome the problem that the existing method for screening leveling agents is affected by convection, restricts the screening object, and the existing electrochemical method for determining the electroplating uniformity of the electroplating solution is limited in application, and provides a method for predicting the electroplating uniformity of the electroplating solution. A novel electrochemical method, a method and application of screening electroplating solutions, which can be used in the field of electroplating wafers with cyanide-free gold plating solutions, are simple, fast, and not affected by convection

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