Electrochemical method for predicting electroplating uniformity of electroplating liquid, method for screening electroplating liquid and application

An electroplating solution and electrochemical technology, applied in the direction of material electrochemical variables, electrolytic components, electrolytic process, etc., can solve the problems of limited application of electrochemical methods and achieve good applicability

Active Publication Date: 2022-01-21
SHENZHEN UNITED BLUEOCEAN TECH DEV +1
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0007] The purpose of the present invention is to overcome the problem that the existing method for screening leveling agents is affected by convection, restricts the screening object, and the existing electrochemical method for determining the electroplating uniformity of the electroplating solution is limited in application, and provides a method for predicting the electroplating uniformity of the electroplating solution. A novel electrochemical method, a method and application of screening electroplating solutions, which can be used in the field of electroplating wafers with cyanide-free gold plating solutions, are simple, fast, and not affected by convection

Method used

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  • Electrochemical method for predicting electroplating uniformity of electroplating liquid, method for screening electroplating liquid and application
  • Electrochemical method for predicting electroplating uniformity of electroplating liquid, method for screening electroplating liquid and application
  • Electrochemical method for predicting electroplating uniformity of electroplating liquid, method for screening electroplating liquid and application

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Embodiment 1

[0048] Prepare two kinds of cyanide-free gold plating solutions A containing different additives (the composition includes: sodium gold sulfite with a gold content of 12g / L, ethylenediamine 10g / L, sodium sulfite 60g / L, sodium ethylenediaminetetraacetate 10g / L, Sodium arsenite 10mg / L, the rest is water, pH8.0) and cyanide-free gold plating solution B (composition includes: gold sodium sulfite with a gold content of 12g / L, ethylenediamine 10g / L, sodium sulfite 60g / L, Sodium edetate 10g / L, thiourea derivative 5mg / L, the rest is water, pH 8.0).

[0049] Inject cyanide-free gold-plating solution A or cyanide-free gold-plating solution B into the electroplating pool, then apply voltage, the initial potential is 0V, the rate of voltage change is 5mV / s, and the termination potential is-0.8V, respectively measure the cyanide-free gold-plating solution A, The electroplating current intensity of cyanide-free gold plating solution B, and drawing, such as figure 1 shown. The electroplati...

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Abstract

The invention relates to the field of gold electroplating levelness prediction, and discloses an electrochemical method for predicting electroplating uniformity of electroplating liquid, a method for screening the electroplating liquid and application. The electrochemical method comprises the following steps: applying voltage U to an electroplating pool filled with electroplating liquid for electroplating; changing the voltage U, measuring the corresponding electroplating current intensity I, and drawing a changing curve of the electroplating current intensity I to the voltage U; and according to the change curve, calculating an absolute value of a potential difference between at least two current density values set for the electroplating liquid, and using the absolute value to predict the electroplating uniformity of the electroplating liquid for electroplating. Therefore, the electroplating uniformity of the electroplating liquid is effectively judged, and the time is short, especially the electroplating uniformity of the cyanide-free gold plating liquid for wafer gold plating. And the method is also effective for adsorbing an additive which does not have strong convection dependence on the surface of the electrode.

Description

technical field [0001] The invention relates to the field of prediction of the leveling property of electroplating gold, in particular to an electrochemical method for predicting the electroplating uniformity of an electroplating solution, a method for screening the electroplating solution and its application. Background technique [0002] Driven by Moore's Law, chip manufacturing continues to develop along two paths: 1) The number of transistors that can be accommodated per unit area continues to increase with the continuous shrinking of the manufacturing process; 2) The size of silicon wafers has changed from 6 inches and 8 inches to the current mainstream 12 inches As development progresses, the greater the number of available chips that can be produced on a single wafer. The changes in these two aspects have brought challenges to the thickness uniformity of electroplating on the wafer. On the one hand, as the number of transistors increases, the distance between the wire...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01N27/48C25D21/00
CPCG01N27/48C25D21/00
Inventor 王彤任长友邓川刘鹏
Owner SHENZHEN UNITED BLUEOCEAN TECH DEV
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