A copper ball automatic adding device

A technology of automatic adding and copper balls, applied in the direction of cells, electrolytic components, electrolytic process, etc., can solve the problems of decreased uniformity of electroplating, rise of copper wire and copper particles, etc., and achieve the effect of ensuring quality and improving the uniformity of electroplating

Active Publication Date: 2018-09-25
HUIZHOU JUNYA DIGITAL TECH CO LTD
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  • Summary
  • Abstract
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AI Technical Summary

Problems solved by technology

[0002] The existing copper ball adding cycle is 3~4 days / time; it needs to stop frequently to add copper balls, and there is room for improvement in the utilization rate of production equipment; manually adding copper balls to the titanium blue will lead to an abnormal increase of copper wire and copper particles
At the same time, according to the inconsistency of knocking, the uniformity of plating is reduced

Method used

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  • A copper ball automatic adding device

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Embodiment Construction

[0015] The present invention will be further described in detail below in conjunction with the accompanying drawings and specific embodiments. Unless otherwise specified, the reagents, equipment and methods used in the present invention are commercially available reagents, equipment and routinely used methods in this technical field.

[0016] An automatic adding device for copper balls, which includes, from top to bottom, an adding box, an inductor and a plurality of titanium baskets, one end of the adding box is provided with a temporary storage box, and the adding box is provided with a ball entry channel corresponding to the titanium basket , one end of the adding box is provided with a lifting structure. The temporary storage box and the lifting structure are at the same end. The lifting structure can be reduced by 3~10cm. The goal channel is a big horn type.

[0017] A method for automatically adding copper balls, characterized in that a certain amount of copper balls ...

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Abstract

The invention discloses an automatic copper ball adding device. The automatic copper ball adding device sequentially comprises an adding box, inductors and a plurality of titanium basket from top to bottom. A temporary storage box is arranged at one end of the adding box. Ball feed channels corresponding to the titanium baskets are arranged on the adding box, and a lifting structure is arranged at one end of the adding box. By adoption of the automatic copper ball adding device, manual copper ball adding is changed into automatic copper ball adding, and intermittent production is changed into continuous production.

Description

technical field [0001] The invention relates to the field of PCBs, and more specifically, to an automatic copper ball adding device. Background technique [0002] The existing copper ball adding cycle is 3~4 days / time; it needs to stop frequently to add copper balls, and there is room for improvement in the utilization rate of production equipment; manually adding copper balls to the titanium blue will lead to an abnormal increase of copper wire and copper particles . At the same time, the inconsistency of beating leads to the reduction of plating uniformity. Contents of the invention [0003] One of the objectives of the present invention is to realize the automatic addition of copper balls. [0004] Firstly, an automatic copper ball adding device is disclosed, which includes, from top to bottom, an adding box, an inductor and a plurality of titanium baskets, one end of the adding box is provided with a temporary storage box, and the adding box is provided with and The...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C25D21/14C25D17/00
CPCC25D17/00C25D21/14
Inventor 李爱群黄军辉朱惠民李强
Owner HUIZHOU JUNYA DIGITAL TECH CO LTD
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