Electroplating apparatus and electroplating method thereof
A technology of electroplating device and electroplating tank, which is applied in the direction of electrolysis process, electrolysis components, cells, etc., can solve the problems of low current density, uneven current density, high current density, etc.
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[0041] The electroplating device and electroplating method provided by the technical solution will be described in detail below with reference to the accompanying drawings and a number of embodiments.
[0042] Please refer to figure 1 with figure 2 The first embodiment of the present technical solution provides an electroplating device 10 for electroplating a plurality of electrically insulated regions to be plated on a substrate. The electroplating device 10 includes an electroplating tank 11, a cathode fixing structure 12, a plurality of anodes 13, a voltage controller 14 and a driver 15.
[0043] The electroplating tank 11 may be a rectangular parallelepiped tank. The electroplating tank 11 includes a first side plate 111, a second side plate 112, a third side plate 113, and a fourth side plate 114 that are connected end to end, wherein the first side plate 111 is opposite to the third side plate 113 , The second side plate 112 is opposite to the fourth side plate 114. The el...
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