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334results about How to "Increase transmission speed" patented technology

Solid waste combustion system

The invention provides a solid waste combustion system. The solid waste combustion system comprises a squeezing and water removing device, a screening device, a crushing device, a drying device, a combustion device and a smoke treating device, wherein the squeezing and water removing device comprises a waste feeding hopper; the feeding hopper is connected with a roller by a pressure conveying belt; the crushing device comprises a crusher and a shaking type screening net located on the bottom of the crusher; the combustion device comprises a hearth; the outer part of the hearth is connected with the feeding hopper and dried wastes are conveyed to the feeding hopper by a drying device conveying belt; a spiral conveying impeller is mounted on the connection part of the feeding hopper and the hearth; the hearth is internally provided with an agitation device; the smoke treating device is connected with the hearth; an opening is formed in the connection part of the hearth and the smoke treating device; the smoke treating device comprises a dust removing device and a desulfuration and deodorization device. The solid waste combustion system provided by the invention is high in combustion efficiency; the treated wastes can be utilized sufficiently so that the resource utilization rate is improved and a working process is environment-friendly and pollution-free.
Owner:黎汉东

PCB circuit manufacturing method and PCB

The invention discloses a PCB circuit manufacturing method and a PCB. The method comprises the following steps: using a thin copper foil with the diameter of 10 to 13 microns as the outermost layer ofcopper foil of a type setting PCB, then laminating, reducing the copper on the outer layer to be 7 to 9 microns after laminating, then carrying out hole drilling and low-speed chemical adhesive cleaning, using vertically continuous electroplating manufacturing in later electroplating working procedure, controlling the thickness of copper on the inner wall of the hole to be 15 to 20 microns and the thickness of copper on the surface to be 24 to 30 microns, then carrying out surface roughening in a cinerite spraying mode for turning off a polishing brush, then using a laser direct imaging exposure machine for exposure in the manufacturing process of an outer circuit, carrying out developing and etching by using a low-pressure and high-speed mode, and presetting 10% to 20% of a circuit compensating value in advance. The problems, such as a great number of too thin and too wide lines, excessive etching, under developing, short circuits and open circuits existing in the circuit manufacturing process, of the PCB product with fine circuits (for example, the ratio of line width to line gap is smaller than or equal to 2 mil/2 mill) can be solved.
Owner:深圳市鼎盛电路技术有限公司

Automatic single-color mosaic-particle lay-up device and lay-up method thereof

The invention provides an automatic single-color mosaic-particle lay-up device and a lay-up method of the automatic single-color mosaic-particle lay-up device. The automatic single-color mosaic-particle lay-up device comprises a stander, a mosaic forming die which is arranged on the stander, at least one automatic mosaic-particle single-track lay-up unit, a loading device and a controller, wherein each automatic mosaic-particle single-track lay-up unit is used for gradually collecting mosaic particles one by one after transporting the mosaic particles one by one, arranging the mosaic particles into rows/columns according to a preset rule and then driving the entire row/column of mosaic particles to enter a loading procedure; the loading device is connected with the stander and used for sequentially transporting and loading the well-arranged entire row/column of mosaic particles in each automatic mosaic-particle single-track lay-up unit into the mosaic forming die; the controller is respectively connected with each automatic mosaic-particle single-track lay-up unit and the feeding device by signals. The automatic single-color mosaic-particle lay-up device is high in lay-up stability, high in lay-up speed and capable of effectively improving the lay-up efficiency and lay-up accuracy of the mosaic particles. The automatic lay-up method is used for substituting the traditional manual lay-up process, so that the problems that the current mosaic industry is low in automation degree and low in production efficiency can be solved.
Owner:FOSHAN UNIVERSITY

An upper and lower hot air drying oven for single-sided printing or coating

The invention discloses an upper and lower hot air type drying box used for single-sided printing or coating. The invention aims to solve the defects in the prior art that the drying time is long when single-sided air supply is carried out on the base material oil ink or coating layer top surface to affect the drying efficiency and transmission speed, or a drying oven is long, and an operation field is big. The technical scheme has the key point that the upper and lower hot air type drying box is composed of a box shell, a plurality of parallel base material backup rolls in the box shell, a plurality of upper hot air supply pipes above the base material backup rolls, an upper hot air equalizing chamber, an upper hot air transmission path and an upper air return chamber, wherein the slice base material enters from a feed port, is supported on the base material backup rolls to operate and is discharged from a discharge hole; and each upper hot air supply pipe is provided with an air supply outlet parallel to the top surface of the slice base material, wherein the top surface is provided with a printing or coating layer. The upper and lower hot air type drying box is characterized inthat a plurality of lower hot air supply pipes, a lower hot air equalizing chamber, a lower hot wind transmission path and a lower air return chamber are arranged below the base material backup rollsby the box shell; and each lower hot air supply pipe is provided with an air supply outlet parallel to the back surface of the slice base material, and the back surface is provided with a printing orcoating layer.
Owner:SHANTOU OLGER PACKING MACHINERY
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