Accompany-plating edge strip for improving electroplating uniformity

Abstract

The invention belongs to the technical field of electroplating, and relates to an accompany-plating edge strip for improving electroplating uniformity. The accompany-plating edge strip is characterized by comprising a main edge strip body and an auxiliary edge strip body. A hook is arranged at the upper end of the main edge strip body. A first fixed rotary knob is installed on the hook. A sliding sleeve is arranged at the upper end of the auxiliary edge strip body. The sliding sleeve is arranged on the main edge strip in a sleeving mode and can move along the main edge strip. The sliding sleeve is provided with a second fixed rotary knob. The hook is provided with a convoluted portion. The convoluted portion is provided with a first fixed rotary knob and further connected with a leaf spring which is bent in the convoluted portion. The threaded end of the first fixed rotary knob abuts against the leaf spring. The accompany-plating edge strip can be rapidly fixed to electroplating equipment, the electroplating current densities of all areas are improved, and electroplating uniformity is improved.

Description

technical field [0001] The invention relates to an accompanying plating edge strip for improving the uniformity of electroplating, and belongs to the technical field of electroplating equipment. Background technique [0002] Electroplating is the process of plating a thin layer of other metals or alloys on the surface of certain metals using the principle of electrolysis. It is a process of using electrolysis to attach a layer of metal film to the surface of metal or other material parts to prevent metal oxidation ( Such as rust), improve wear resistance, electrical conductivity, reflective properties, corrosion resistance (copper sulfate, etc.) and enhance the appearance. The outer layer of many coins is also electroplated. [0003] The coating is mostly a single metal or alloy, such as titanium palladium, zinc, cadmium, gold or brass, bronze, etc.; there are also diffused layers, such as nickel-silicon carbide, nickel-fluorinated graphite, etc.; there are cladding layers,...

AI Technical Summary

Problems solved by technology

[0005] During the electroplating process, the current density of each area in the electroplating tank will vary due to the distance between the cathode plate and the anode plate or the number and position of the workpieces placed. Different current densities will lead to uneven plating

[0006] The electroplating uniformity of the existing electroplating equipment is poor, and the results of the electroplating uniformity show that the copper thickness out-of-tolerance areas are mainly distributed at both ends of the flying bar, which is the main reason for the low overall uniformity; if the electroplating uniformity is poor, the It will affect the quality problems such as line etching, finished product aperture, film clamping, etc., and will increase the cost of copper plating and tin

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