Copper electroplating formula for pulse through hole filling and electroplating process thereof

An electroplating process, a technology of electroplating copper, applied in the direction of the formation of electrical connections of printed components, etc., can solve the problems of low pulse electroplating process time, short plating ability and performance requirements, and many foams in surfactant components, so as to promote filling Hole and deep plating ability, reduced concentration polarization, excellent uniformity effect

Inactive Publication Date: 2022-04-15
SHENZHEN CHENGGONG CHEM
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  • Abstract
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  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] The pulse electroplating process has the advantages of low time length, deep plating ability, and good dispersion ability. At present, there are many methods of cycle-changing pulse electroplating technology used in PCB circuits, and whether the product can achieve the required performance and requirements often depends on the quality of the electroplating solution. At present, with regard to pulse electroplating potions, MacDermid has always been the only one, and domestic similar products cannot compete with it. The important reason is that the deep plating ability and performance requirements of high thickness-to-diameter ratio have always been the shortcomings of domestic potions.
[0003] Yan Dehao and others disclosed a through-hole pulse electroplating solution and a through-hole pulse electroplating coating method in the patent CN113881983A. The electroplating coating method uses air stirring, which will make oxygen easily enter the solution and cause an chemical copper layer in the hole copper. Oxidation corrosion, especially thin lines such as IC substrates will cause problems such as circuit disconnection
[0004] In addition, Cai Fangxian and others disclosed the application of a pulse electroplating additive electroplating solution and electroplating in the patent CN113373482A. Due to the lack of an accelerator, the production cost is increased, and the contained surfactant component has a lot of foam, which is not conducive to operations such as pumping.
[0005] Therefore, there is an urgent need in the market for a copper electroplating solution that can achieve a high aspect ratio (greater than 15:1) and will not achieve nearly 95% deep plating and hole filling plating on boards with thin lines (lines less than 50 microns). Satisfy production needs and lift foreign technology blockade

Method used

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  • Copper electroplating formula for pulse through hole filling and electroplating process thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0070] A formula for electroplating copper for pulse through-hole filling, calculated per liter of bath solution:

[0071] Copper sulfate 60g / L, concentrated sulfuric acid 150g / L, 2-butyl-1-octanol polyoxyethylene ether 30mg / L, thiodiglycol polyoxyethylene ether 10mg / L, sodium methylenedinesulfonate 1g / L, 1,4-dioxane 20mg / L, ethylene glycol tert-butyl ether 10mg / L, glyoxylic acid 10mg / L, polyethyleneimine 15mg / L, purple phenazine liquid polymer 15mg / L, The balance is pure water, the pH is 0.2, the operating temperature is 30°C, and the forward current density is 0.5A / dm 2 , reverse current density 2.0A / dm 2 , positive and negative pulse time ratio 10:1ms, time 50min.

[0072] In Example 1, by figure 1 According to the evaluation criteria, the test results are as follows: the average deep plating ability is 95.8%, the average hole filling ability is 96%, the hole is excellent, the hole is not broken, the hole is bright, there is no pothole, and there is no copper tumor.

Embodiment 2

[0074] A formula for electroplating copper for pulse through-hole filling, calculated per liter of bath solution:

[0075] Copper sulfate 75g / L, concentrated sulfuric acid 175g / L, 2-butyl-1-octanol polyoxyethylene ether 60mg / L, thiodiglycol polyoxyethylene ether 20mg / L, sodium methylene di-naphthalene sulfonate 4.5 g / L, 1,4-dioxane 10mg / L, ethylene glycol tert-butyl ether 5mg / L, glyoxylic acid 5mg / L, polyethyleneimine 30mg / L, purple phenazine liquid polymer 30mg / L , the balance is pure water, the pH is 0.2, the operating temperature is 30°C, and the forward current density is 0.5A / dm 2 , reverse current density 2.0A / dm 2 , positive and negative pulse time ratio 10:1ms, time 50min.

[0076] In Example 2, by figure 1 According to the evaluation criteria, the test results are as follows: the average deep plating ability is 95.8%, the average hole filling ability is 96%, the hole is excellent, the hole is not broken, the hole is bright, there is no pothole, and there is no copp...

Embodiment 3

[0078] A formula for electroplating copper for pulse through-hole filling, calculated per liter of bath solution:

[0079] Copper sulfate 90g / L, concentrated sulfuric acid 200g / L, 2-butyl-1-octanol polyoxyethylene ether 90mg / L, thiodiglycol polyoxyethylene ether 30mg / L, sodium methylenedinesulfonate 8g / L, 1,4-dioxane 30mg / L, ethylene glycol tert-butyl ether 15mg / L, glyoxylic acid 15mg / L, polyethyleneimine 45mg / L, purple phenazine liquid polymer 45mg / L, The balance is pure water, the pH is 0.2, the operating temperature is 30°C, and the forward current density is 0.5A / dm 2 , reverse current density 2.0A / dm 2 , positive and negative pulse time ratio 10:1ms, time 50min.

[0080] In Example 3, by figure 1 According to the evaluation criteria, the test results are as follows: the average deep plating ability is 95.8%, the average hole filling ability is 96%, the hole is excellent, the hole is not broken, the hole is bright, there is no pothole, and there is no copper tumor.

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Abstract

The invention discloses an electrocoppering formula for pulse through hole filling and an electroplating process thereof. The electrocoppering formula comprises, by mass concentration, 60-90 g/L of copper salt, 150-200 g/L of concentrated sulfuric acid, 30-90 mg/L of an inhibitor, 10-30 mg/L of a leveling auxiliary agent, 1-8 g/L of an accelerator, 20-60 mg/L of a positioning agent, 15-45 mg/L of a dispersing agent and 15-45 mg/L of a brightening agent. The solution provided by the invention ensures that the orifice of the through hole is not broken, for a plate with the thickness-diameter ratio of more than 15: 1, the deep plating capacity is more than 95%, the thickest thickness of the hole filling plate can be more than 3.5 mm, and the hole filling rate is kept more than 95%.

Description

technical field [0001] The invention relates to the technical field of copper electroplating, in particular to a formula for electroplating copper for pulse through-hole filling and an electroplating process thereof. Background technique [0002] The pulse electroplating process has the advantages of low time length, deep plating ability, and good dispersion ability. At present, there are many methods of cycle-changing pulse electroplating technology used in PCB circuits, and whether the product can achieve the required performance and requirements often depends on the quality of the electroplating solution. At present, with regard to pulse electroplating potions, MacDermid has always been the only one, and domestic similar products cannot compete with it. The important reason is that the deep plating ability and performance requirements of high thickness-to-diameter ratio have always been the shortcomings of domestic potions. . [0003] Yan Dehao and others disclosed a thr...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25D3/38C25D5/34C25D7/00H05K3/42
Inventor 王江锋姚吉豪李云华
Owner SHENZHEN CHENGGONG CHEM
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