Processing method of ultra-small welding-proof spacing circuit board

Abstract

The invention provides a processing method of ultra-small solder-proof distance circuit board, which comprises the following steps: firstly, surface activation treatment is carried out on the printedcircuit board, and screen printing of solder-resist ink spacing lines is carried out within 4 hours after the treatment; After screen printing of the solder resist ink spacer, the solder resist ink spacer is subjected to exposure, development and curing in sequence, the curing temperature is controlled at 150 DEG C and the curing time is controlled at 30 min. The solidified printed circuit board is treated by surface activation and the whole board is electrostatically sprayed with solder resist ink within 4 hours after the treatment. Pre-drying the printed circuit board, the temperature is controlled at 80 DEG C, the time is controlled at 40-50 minute to initially cure that ink for exposure; The pre-baked PCB is subjected to exposure, development and curing in sequence, the curing temperature is controlled at 150 DEG C, and the curing time is controlled at 60 minutes. The invention thoroughly solves the bonding force problem between the separating ink and the substrate of the printed circuit board, thereby ensuring that the separating line of the solder resist ink is prevented from falling off in the subsequent processing process.

Description

technical field [0001] The invention relates to the field of circuit board manufacturing, in particular to a processing method for a circuit board made of ultra-small solder-proof spacing. Background technique [0002] With the development of electronic information technology, electronic products are developing in the direction of lightweight, miniaturization and high speed, which puts forward higher requirements for printed boards. In the era of high-density connection (HDI) technology, line width and line distance will be There is an inevitable trend towards smaller and denser. [0003] In order to adapt to this development trend, printed circuit board designers and manufacturers are constantly updating design concepts and manufacturing methods. As the design density of printed circuit boards increases, the accuracy requirements for the solder resist ink layer are also increasing. For printed circuit boards that require ultra-small solder mask spacing, the traditional sc...

AI Technical Summary

Problems solved by technology

[0004] In order to overcome the deficiencies in the above-mentioned prior art, the object of the present invention is to provide a processing method for printed circuit boards with ultra-small solder mask spacing, which solves the problem of line drop-off that cannot be solved by traditional screen printing technology

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