48results about How to "Solve the bonding problem" patented technology

The invention provides a novel preparation method of a high-performance continuous ZIF-8 (zero insert force-8) film for the high-performance separation and purification of gas, and mainly aims at solving the combination problem among a continuous even growth film, a film and a carrier of the ZIF-8 film. The preparation method is mainly characterized by comprising the following steps of: previously introducing growth point and a combination point on the surface of a porous carrier to form a thin layer of zinc oxide coating layer taken as a finished film, and growing in an inducing way to form the continuous even ZIF-8 film. An active point of the film homogeneous nucleation is introduced, the combination force problem between the film and the surface of the carrier is solved, and the surface of the carrier is modified by the coating layer, so that the high-quality film can be preferably formed. Compared with the conventional preparation method of the ZIF-8 film, the novel method adopted by the invention not only is high in film-forming effective mass, simple in process, and convenient for large-scale preparation and amplification, so that the method has a potential application prospect and a wide application value.

The present invention discloses a preparation method of aqueous / solvent-free composite environmentally friendly polyurethane synthetic leather, the synthetic leather comprises an aqueous elastomer surface layer and a solvent-free foaming intermediate layer, the aqueous elastomer surface layer resin is thermosetting polyether aqueous polyurethane resin, the solvent-free foaming intermediate layer is thermosetting two-component polyether solvent-free foaming polyurethane resin, and the two-component material is polyether combination A material and polyether B material prepolymer. The preparation process does not use any organic solvent, achieves the synthetic leather production and processing, finished product zero solvent use and health and environmental friendliness; at the same time, the advantages of the aqueous polyurethane resin and the solvent-free polyurethane resin are combined, and the obtained synthetic leather products has strong pattern stereoscopic impression, soft hand feeling, superior hydrolysis resistance and other physical properties, and skin and leather feeling equivalent to natural dermis.

The invention relates to a preparation method for forming a metal organic framework ZIF-67 film. Through hydrothermal synthesis, first a cobalt nano array layer firmly combined with a carrier is introduced to the carrier, and the carrier with the cobalt nano array layer is obtained; in the aftertreatment process, the cobalt nano array layer provides a metal source for growth of the ZIF-67 film and serves as a growing point and bonding point for forming the film, the continuous and uniform ZIF-67 film is formed by growth. According to the method, the problems that the metal organic framework film has difficulty in heterogeneous nucleation, is weak in binding force with the carrier and is easily subjected to embrittlement are solved. In the cobalt nano array growth process or in the ligand growth process, only water is used as a solvent, and no other organic solvent participates. The environmental pollution is small, and the preparation method conforms to the green chemical development requirements. In the film forming process, the cobalt nano array layer has dual functions of providing a metal cobalt source and enhancing binding force between the carrier and the ZIF-67 film.

The invention discloses a manufacturing method of a zinc-nickel double-layer electroplating steel plate, which comprises the following steps: derusting a cold rolled steel plate or descaling a hot rolled steel plate, and cleaning the steel plate with water; activating the cleaned steel plate with diluted acid; electronickelling the activated steel plate, wherein a nickelling solution comprises the components of 240-280g/L of nickel sulfate, 40-65g/L of nickel chloride, 25-45g/L of boric acid and 1-3 g/L of acetic acid, and the pH value is controlled to be 4-4.5; annealing the steel plate by using hydrogen gas or nitrogen gas as a protective gas at the temperature of 550-650 DEG C, and forming a ferronickel alloy layer on the surface of the steel plate; then, electrogalvanizing the surface of the ferronickel alloy layer, wherein a galvanizing solution comprises the components of 250-300g/L of zinc sulfate, 1-2g/L of aluminum sulfate, 240-260g/L of sodium sulfate, 20-25g/L of boric acid and 2-3g/L of glucose, and the pH value is controlled to be 4.5-5.5; and washing the galvanized steel plate with water to acquire a finished product. Tests indicate that the corrosion resisting property of the acquired steel plate can be greatly improved, and a bonding force problem of a plating layer and a basal body is also solved.

The invention discloses mixed lead paste capable of improving the binding force of a positive grid of a lead-acid storage battery and lead paste and a preparation method of the mixed lead paste. The method comprises the following steps of adding lead powder which is 80-90% of total mass to a paste mixing machine, adding the following raw materials by percentages: 8-10% of sulfuric acid, 0.1-0.3% of stannous sulfate, 0.08-0.10% of conductive fiber, 0.3-0.5% of colloidal graphite, 0.05-0.15% of sodium borate and 1.0-1.2% of antimonic oxide, carrying out dry mixing for 8-10min, adding deionized water, carrying out wet mixing for 2min, adding residual paste and carrying out wet mixing for 8-10min; and dropwise adding the sulfuric acid which is 8-10% of total mass and stirring for 10-12min to obtain the lead paste of which the apparent density is 4.4+/-0.02g/cm<3>. According to the mixed lead paste, the interface problem between an existing battery grid and an active material of the lead paste can be effectively solved, the bonding force between the positive grid and the lead paste is improved, the strength of a polar plate is improved and the cycle life of the battery is prolonged.

A method for integrally microprocessing copmlex multi-layer structure features that the photoresist SU-8 and quisi-LIGA processing are used, the multiple layers are simultaneously etched to reduce the relative position error between layers, a surface activating technique is used to improve the binding force between electrocast layers, and the seed layer techinque is used for generating big electrocasting pattern.

The invention discloses a manufacturing method for locally burying a copper block and conducting an internal-layer lead wire. The method comprises the following steps: 1, arranging a groove and burying copper; 2, filling; 3, pressing; 4, boring; 5, metallization; and 6, subsequent processing. By use of high pressure in a lamination process and heat curing of prepreg scaled resin flow glue, the copper block or other heat dissipation conductors are fixed in a through groove of a motherboard substrate layer, the problem of poor binding force of the copper block or the heat dissipation conductors is solved, a through hole is drilled at a junction of the copper block and a motherboard printed circuit board (PCB) by use of a drilling machine tool, the aperture size is designed according to the interval between the copper block and an internal layer of the motherboard PCB, it is ensured that the copper block is connected with an internal-layer design copper lead wire, the drilled through hole is plated with a layer of copper with a thickness of 30[mu]m by use of an electroplating flow, and the copper block and the internal-layer copper lead wire are conducted. A PCB manufactured by use of the manufacturing method solves the problem of incapability of conducting the copper block with the buried motherboard internal layer and has the advantages of good heat dissipation effect, huge market potential and wide prospect.

The invention refers to a manufacturing method for a kind of dual-layer alloy coating layer metal film resistance. The character lies in: a layer of Ni-Cr alloy is splattered onto the at least a layer of insulating base, the proportion is: Ni: Cr (w/w) =75:25-85:15, then a layer of Cu-Ni alloy coating film is coated on the coating layer, the proportion is: Cu: Ni (w/w) =60:40-40:60; the steps are: with the normal spattering method, a layer of Ni-Cr alloy is splattered on the base, then with following steps: the normal temperature activating of acid liquid; rinsing with water; suspending coating or rolling coating the Cu-Ni layer; rinsing with water; drying. The invention solves the bonding force problem between the metal film and the insulating base, overcomes the deficiency that the coating layer is fracture when using laser to process, the temperature coefficient of the resistance film can maintain at í‚2%-í‚0.5%.

The invention discloses a dense PCB (printed circuit board) circuit and a manufacturing method. The manufacturing method comprises the following steps of A, performing micro-etching treatment on an inner layer of a PCB, and roughening the PCB; B, pressing and drying a film on the PCB; C, standing for a period of time, and exposing; sequentially developing and etching. The manufacturing method has the advantages that the surface of the PCB is roughened, so as to solve the problem of bonding force of the dry film, avoid the open-loop notch, and improve the product quality and precision of a product.

The invention discloses a rhodium plating technology of an electric contact made of a molybdenum copper composite material, and the technology is used for rhodium plating on the surface of the electric contact made of a molybdenum copper composite material. The electric contact is put into a plating basket to carry out the following steps in order: 1. chemical degreasing; 2. scale removal treatment; 3. activation treatment; 4. chemical flash plating of nickel; and 5. chemical plating of rhodium. The rhodium plating layer is uniformly distributed on the surface of the electric contact made of the molybdenum copper composite material and is well combined.

The invention provides a packaging carrier tape base material and a preparation method thereof. The packaging carrier tape substrate sequentially comprises a curing sheet, a glue film and metal foil which are laminated together from top to bottom, wherein the roughness of the side, away from the glue film, of the curing sheet is 3-10 [mu]m. By utilizing the packaging carrier tape base material, the height of UV glue is within the range of 500-580 [mu]m, application requirements can be well met, finally, binding force of a module and a card is 90 N or above, and the binding requirements of themodule and the card can also be met.

The invention discloses a multilayer board hole metallization method. The conductivity of graphene, a metal nanowire material and a conductive polymer material and the film-forming property of the conductive polymer material are used to perform conductive treatment on a non-metal surface, the treated non-metal surface is high in conductivity and strong in film binding force, and a traditional tin-palladium colloid treatment method can be replaced. The method provided by the invention is stable in performance, simple to operate, easy to control and low in cost, and the production process is pollution-free and more environment-friendly.

The invention discloses an electron beam surface alloying method for 45# steel. The electron beam surface alloying method comprises the steps of preset coating on the surface of the 45# steel and scanning through continuous electron beams, wherein the preset coating comprises the step that tungsten powder is sprayed on the surface of the 45# steel by plasma thermal spraying to form a spraying bonding layer; and scanning through continuous electron beams comprises the step that electron beam scanning is carried out on the surface of the 45# steel so as to obtain a surface alloying modification layer on the surface of the 45# steel. According to the electron beam surface alloying method, the continuous electron beam scanning technology is combined with the plasma thermal spraying, the novel medium-carbon steel-based composite material which takes a high-performance alloying element as a reinforced phase is prepared by adopting the unique advantages of the continuous surface treatment, so that the procedures are greatly simplified, the cost is reduced, the turnover time is shortened, and the surface performance of the 45# steel is improved and the service life of the 45# steel is prolonged by preparing the alloy layer with high hardness, high abrasion resistance and high corrosion resistance.

The invention discloses a thin film solar cell electrode. The thin film solar cell electrode comprises a glass base plate and molybdenum thin film, wherein the molybdenum thin film is laid on the glass base plate. The molybdenum thin film is formed by two layers of molybdenum crystal grains, wherein the two layers of molybdenum crystal grains respectively are a layer of coarse molybdenum crystal grains with grain diameters between 12nm and 16nm and a layer of fine molybdenum crystal grains with grain diameters between 2nm and 6nm, and the coarse molybdenum crystal grain layer is contacted with the glass base plate. The invention further discloses a preparation method of the electrode. A molybdenum metal film layer in a traditional thin film solar cell electrode structure is divided into two layers, wherein the base layer is a coarse crystal grain layer, and the top layer is a fine crystal grain layer, so that not only a function of working as a back electrode is achieved, problems about percolation of sodium atoms and binding force of glass are solved, and resistance of working as the back electrode is reduced, but also switching efficiency of a copper indium gallium selenide (GIGS) thin film cell is improved greatly.

The invention discloses a method for manufacturing a circuit board. The method includes the steps that S1, a first base material layer and a second base material layer are bonded together through a prepreg; S2, a first opening is formed in the second base material layer, and the first opening penetrates through the second base material layer; S3, second openings, corresponding to the first opening in position, are formed in the first base material layer and the prepreg, and the second openings penetrate through the first base material layer and the prepreg; S4, a radiating conductor and glue blocking materials are provided; S5, laminating pretreatment is carried out on the first base material layer, the second base material layer and the radiating conductor; S6, the radiating conductor is placed into the first opening, the glue blocking materials are placed into the second openings, and lamination is conducted on the entire circuit board; S7, the glue blocking materials are taken out, and the surface of the second base material layer and the surface of the radiating conductor are ground. By means of the method for manufacturing the circuit board, the radiating problem of the circuit board can be solved, the manufacturing method of the circuit board is simple, and the embedded effect of the radiating conductor is good.

The invention discloses a method for repairing titanium alloy damaged parts by electroless nickel plating, comprising the steps of degreasing→protection→blowing abrasives→white ash degreasing→activation treatment→hydrogenation treatment→electroless nickel plating→heat treatment. The invention is a new process method for repairing the dimensions of titanium alloy damaged parts by chemical nickel plating, which solves the problem of repairing the bonding force of damaged parts, and is a key technology for repairing the size of damaged titanium alloy parts of Su-27 and Su-30 aircraft by electroless nickel plating According to the invention, the electroless nickel plating of damaged titanium alloy parts can be completed to meet the needs of guaranteeing the repair of damaged titanium alloy parts of Su-27 and Su-30 aircrafts, and has great popularization value.

The present invention relates to a condensed polyvinyl alcohol medium main agent, its preparation process and application of its product. Its formula includes water and polyvinyl alcohol. It is characterized by that its formula also contains isopropanol, water is deionized water and polyvinyl alcohol is its power material. Its formula ratio of deionized water 800 kg, isopropanol 300 kg and polyvinyl alcohol powder 200 kg. Its preparation process includes the following steps: according to the formula ratio stirring and mixing them above-mentioned materials at normal temp., taking 1/3 quantity of the above-mentioned mixture and heating other portion, adding polyvinyl alcohol powder, constant-temp. dissolving, forced cooling, adding the above-mentioned 1/3 liquid mixture, mixing so as to obtain the invented product. It possesses extensive application range.