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Method for integral micromachining multilayer composite structure

A technology of complex structure and seed layer, applied in microstructure technology, microstructure devices, manufacturing microstructure devices, etc., can solve problems such as affecting normal work, increasing the difficulty of precision assembly work, and weak mechanism integrity, and achieves widening processing. range effect

Inactive Publication Date: 2006-12-06
SHANGHAI JIAOTONG UNIV
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Problems solved by technology

This method is the usual quasi-LIGA process for processing single-layer MEMS devices, that is, the processed structure is only suitable for quasi-three-dimensional structures that are single-layer, vertically vertical, and cannot be changed. If complex three-dimensional structures are encountered, it can only be processed first. The parts are designed into multiple quasi-three-dimensional structures in layers, and then processed in layers, and finally assembled into the required parts, but this method will increase the difficulty of precision assembly work in the later stage, and the assembly error and fit error are large, and the integrity of the mechanism is not good. Strong, affect the actual normal work

Method used

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  • Method for integral micromachining multilayer composite structure

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Embodiment

[0016] Process two three-layer structures that are used in conjunction with each other. In this structure, the first and third layers of graphics are larger than the second layer of graphics. The electroforming material is Ni, and a double-sided exposure lithography machine is used. The specific processing method is as follows:

[0017] A photolithography reference pattern is first made on the bottom surface of the substrate, and subsequent photolithography processes are all based on it.

[0018] Such as figure 1 As shown in middle A, the first layer of photoresist SU-8, after photolithography and development according to the reference pattern on the bottom surface, Ni is electroformed, and the surface of the electroformed layer is planarized after electroforming.

[0019] Such as figure 1 As shown in middle B, after the second layer of glue removal, photolithography (based on the bottom surface pattern), and development, the surface of Ni is subjected to surface activation t...

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Abstract

A method for integrally microprocessing copmlex multi-layer structure features that the photoresist SU-8 and quisi-LIGA processing are used, the multiple layers are simultaneously etched to reduce the relative position error between layers, a surface activating technique is used to improve the binding force between electrocast layers, and the seed layer techinque is used for generating big electrocasting pattern.

Description

technical field [0001] The invention relates to a method for micromachining a multilayer complex structure, in particular to a method for integrating micromachining a multilayer complex structure using high aspect ratio processing technology. It is used in the technical field of microelectromechanical systems. Background technique [0002] Quasi-LIGA (ultraviolet lithography, micro-electroforming, and micro-replication high-aspect-ratio processing technology) is a commonly used technology in high-aspect-ratio processing, and is widely used in the field of micro-electromechanical system processing. It is found through literature search that Li, Bo, "Low stressed high-aspect-ratioultra-thick SU-8 UV-LIGA process for the fabrication of a micro heatexchanger", (application of quasi-LIGA technology to process micro-heat exchangers with low-stress high-aspect-ratio thick SU-8 glue) applies low-stress high-aspect-ratio thick SU-8 photoresist, and uses quasi-LIGA technology to proc...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B81C1/00C25D1/00G03F7/00
Inventor 陈文元姜勇赵小林丁桂甫张卫平
Owner SHANGHAI JIAOTONG UNIV
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