Method for optimizing laminated structure printed board expanding and shrinking matching and laminated structure printed board

A laminated structure and printed board technology, applied in multilayer circuit manufacturing, printed circuit manufacturing, printed circuit, etc., can solve the problems of limited product processing range, plate utilization, production efficiency, and process capability improvement limitations, etc. Achieve the effect of improving the alignment between lamination layers and ensuring quality

Pending Publication Date: 2017-02-15
珠海杰赛科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The disadvantages of the above two solutions are that the plate utilization rate, production efficiency and process capability improvement will be greatly restricted, resulting in limited product processing range

Method used

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  • Method for optimizing laminated structure printed board expanding and shrinking matching and laminated structure printed board
  • Method for optimizing laminated structure printed board expanding and shrinking matching and laminated structure printed board
  • Method for optimizing laminated structure printed board expanding and shrinking matching and laminated structure printed board

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Embodiment 1

[0031] Such as figure 1 As shown, the method for optimizing the expansion and shrinkage matching of a laminated structure printed board in this embodiment includes the following steps:

[0032] S1. Cut the material and provide at least two core boards. According to the design requirements, the substrate core board is cut and cut, and the warp and weft directions of the board must be consistent. One of the two core boards is used as the outer core board, and the other is used as the inner core board.

[0033] S2. Acid etching, the auxiliary surface of the core board is made by chemical etching method, the auxiliary surface of the outer core board is the large copper surface, and the auxiliary surface of the inner core board is the circuit surface. Acid etching is carried out on the substrate core board. The copper foil on the surface of the outer core board is etched with an acid etching liquid to form a large copper surface. The copper foil on the surface of the inner core bo...

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PUM

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Abstract

The invention provides a method for optimizing laminated structure printed board expanding and shrinking matching and a laminated structure printed board. The method comprises the following steps of material cutting: at least two core boards are provided; acid etching: a core board auxiliary surface is manufactured by using a chemical etching method; hole drilling: riveting holes are drilled at the side of the board; internal optical imaging: internal and external layer core board graphic pre-compensation values are given according to the graphic film pre-compensation requirements; laminating and riveting: riveting is performed with the riveting holes of each layer after stacking of the internal and external layer core boards acting as basic points, and pre-arrangement of the internal and external layer core boards is performed; and laminating and pressing: the pre-arranged internal and external layer core boards are pressed. The core board graphic pre-compensation values are optimized based on statistical analysis of a large volume of expanding and shrinking data, and the expanding and shrinking difference generated in pressing of the internal and external layer core boards is controlled so that the alignment of the pressing layers of the laminated structure core board can be effectively enhanced, the quality of the printed board can be ensured, and the processing technical capacity of the printed board can be enhanced and the processing range can be expanded.

Description

[0001] 【Technical field】 [0002] The invention belongs to the technical field of circuit boards, and in particular relates to a method for optimizing the expansion and contraction matching of a laminated structure printed board and a laminated structure printed board. [0003] 【Background technique】 [0004] Due to the difference in the design of the auxiliary surface of the inner and outer core boards of the printed board with laminated structure (the outer core board is a large copper surface, and the inner core board is a circuit surface), it is easy to cause a certain swelling of the inner and outer core boards during lamination. The shrinkage difference will lead to poor alignment between layers, and there is a risk of inner layer short circuit and scrapping. In the existing technology, for the core+core structure, the pre-compensation value of the inner and outer core board graphics is generally designed as a consistent fixed value; some circuit board customers avoid or ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/46H05K1/02
CPCH05K1/0266H05K3/4638H05K2203/068
Inventor 彭劼刘永峰
Owner 珠海杰赛科技有限公司
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