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110results about How to "With heat conduction" patented technology

Continuous carbon fiber-reinforced PA6 composite with high strength, high modulus, electrical conductivity and thermal conductivity, and preparation method thereof

The invention relates to a continuous carbon fiber-reinforced PA6 composite with high strength, high modulus, electrical conductivity and thermal conductivity, and a preparation method thereof. The composite comprises, by weight, (1) 100 parts of PA6 resin, (2) 0.2 to 1 part of an anti-oxidant, (3) 0.2 to 1.2 parts of a flow promoter, (4) 2 to 10 parts of a flexibilizer and (5) 1 to 5 parts of a compatilizer. The preparation method comprises the following steps: premixing the above components according to a certain ratio, carrying out melting and mixing via a double/single-screw set and then extruding the obtained mixture into a die head for flow splitting and impregnation so as to prepare the continuous carbon fiber-reinforced PA6 composite with high strength, high modulus, electrical conductivity and thermal conductivity. Compared with conventional staple carbon fiber-reinforced PA6 composites, the continuous carbon fiber-reinforced PA6 composite prepared by using a special impregnation process in the invention has greatly improved mechanical properties since the length retention rate of carbon fibers in a PA6 carrier is high or continuous and has substantially improved electrical conductivity and thermal conductivity due to a continuous network structure, so the application range of the composite is greatly broadened.
Owner:浙江胜钢新材料有限公司

Chip resistor and manufacturing method thereof

The invention provides a chip resistor. The chip resistor comprises a resistor sheet, an inner shell which wraps the surface of the resistor sheet, a heat sink bonded to the surface of the resistor sheet through an insulating thermal conductive adhesive, an outer shell at the outermost layer and electrode pins connected with the two ends of the resistor sheet and located outside the outer shell, and the inner shell is provided with a hollowed-out part for coating the insulating thermal conductive adhesive. A manufacturing method of the chip resistor includes the steps of blanking the resistorsheet and the electrode pins, then processing and connecting the resistor sheet and the electrode pins to form a resistor body, conducting rough adjustment and fine adjustment on a resistance value ofthe resistor body, packaging for the first time to form the inner shell, blanking the heat sink, bonding the heat sink to the resistor sheet through the insulating thermal conductive adhesive, packaging for the second time, cutting and bending the electrode pins to form a side U shape, and finally conducting post-processing to obtain the chip resistor. According to the chip resistor, after roughadjustment and fine adjustment are conducted on the resistance value of the resistor body, packaging is conducted for the first time, a layer of inner shell wraps the resistor body to ensure that theheat sink is not contact with the resistor sheet, and the obtained chip resistor has high precision, fast heat dissipation, long service life, safety and reliability, and high product yield.
Owner:常德思高技术有限公司

Nano zinc oxide / polypropylene / polylactic acid composite fiber material and preparing method thereof

The invention relates to a nano zinc oxide / polypropylene / polylactic acid composite fiber material; the components thereof comprise nano zinc oxide, polypropylene and polylactic acid, with the weight percentage of 0.1 to 20: 80 to 99.9; and the preparation thereof comprises the following steps: (1) nano zinc oxide powder is arranged in a special transmission device of a plasma treatment device for carrying out modification treatment to the nano zinc oxide powder; (2) the nano zinc oxide powder prepared by plasma treatment is mixed with polypropylene / polylactic acid powder or polypropylene / polylactic acid slices according to the proportion of 0.1 to 20 percent, a double screw extruder or a single screw extruder is used for mixing the materials, and melting mixing is carried out at 180 to 260 DEG C to obtain nano zinc oxide / polypropylene / polylactic acid composite slices; and (3) the slices are treated with spinning to obtain the nano zinc oxide / polypropylene / polylactic acid composite fiber material. The composite fibers produced by the method have good spinnability and high fiber-forming strength, and is characterized by controlled conductivity, heat conduction, antistatic and biodegradation.
Owner:DONGHUA UNIV +1

Novel light energy absorption and vibration reduction imitation microstructure and preparation method thereof

The invention discloses a novel light energy absorption and vibration reduction imitation microstructure and a preparation method thereof. The novel light energy absorption and vibration reduction imitation microstructure comprises a plurality of energy absorption layers which are sequentially stacked from top to bottom, each energy absorption layer comprises a plurality of energy absorption frames, and a metal rubber ball is embedded in each energy absorption frame. According to the preparation method, by reference to the mechanism for improving elastic modulus and the strength that a diamondmicro-octahedral structure is filled with an interstitial atom, the micro-new composite structure of filling a NiTi-based octahedral interstice of 3D printing with a NiTi metal rubber ball is proposed, and the elastic modulus, the strength and energy absorption efficiency of a structural part can be improved; compared with a traditional metal rubber, the structure has the advantages of radiationresistance, corrosion resistance, high and low temperature resistance, aging resistance and the like; compared with the traditional metal rubber, the structure has the advantages of high forming precision, being capable of forming a complex structure, high energy absorption efficiency and the like; and compared with a simple NiTi metal-based octahedral lattice structure, the structure has the advantages of high strength, high modulus, high energy absorption efficiency and the like.
Owner:INST OF MACHINERY MFG TECH CHINA ACAD OF ENG PHYSICS
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