Low-density and high-strength heat-conducting silica gel gasket

A thermally conductive silica gel, high-strength technology, applied in the field of thermally conductive materials, can solve the problems of limited application fields, difficult processing, high brittleness, etc., and achieve the effects of low density, simple and easy preparation, and high tensile strength

Inactive Publication Date: 2017-04-26
昆山裕凌电子科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

As traditional thermal conductive materials such as metals and inorganic materials, although the thermal conductivity is good, its application fields are limited due to factors such as high brittleness, difficult processing, and electrical conductivity.

Method used

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  • Low-density and high-strength heat-conducting silica gel gasket
  • Low-density and high-strength heat-conducting silica gel gasket

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0014] 1. Raw materials are prepared as follows:

[0015] a. Silicone polymer

[0016] a1. Mixture of vinyl silicone oil (vinyl content 0.18%) and hydrogen silicone oil (hydrogen content 0.22%)

[0017] a2. Vinyl silicone oil (vinyl content 0.18%), vinyl silicone resin (vinyl content 2%)

[0018] b. Thermally conductive powder

[0019] b1. Alumina powder (D50=0.5~70μm) b2. Alumina aluminosilicate powder (D50=35~70μm)

[0020] b3. Boron nitride powder (D50=0.5~10μm) b4. Silicon dioxide powder (D50=8~40μm)

[0021] C. Auxiliary

[0022] C1 Coupling agent, catalyst C2. Combustion aid

[0023] After the above-mentioned heat-conducting powder is dried, the proportioning is carried out according to the ratio shown in the following table 1, and the surface treatment of the proportioned powder is carried out by a wet method, so that the surface of the powder is coated with a layer of coupling agent, and the silicone polymer is mixed separately. The material is put into a planeta...

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PUM

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Abstract

The invention discloses a low-density and high-strength heat-conducting silica gel gasket. The low-density and high-strength heat-conducting silica gel gasket comprises the following components in percent by weight: 5-25% of an organosilicon polymer, 50-85% of heat-conducting powder and 10-25% of an auxiliary agent. The low-density and high-strength heat-conducting silica gel gasket, as a filling material product, has the characteristics of heat conductivity, low density and high tensile strength at the same time, so that the problem that some terminals need these unique compatible characteristics on special occasions is solved; the low-density and high-strength heat-conducting silica gel gasket has all general characteristics of ordinary heat-conducting gaskets, and is simple and easy to prepare, safe and reliable.

Description

technical field [0001] The invention relates to the field of heat-conducting materials, in particular to a low-density, high-strength heat-conducting silicone gasket. Background technique [0002] In recent years, with the development of science and the rapid development of microelectronic devices, the degree of integration has become higher and higher. While the working efficiency of components has improved, heat has also accumulated rapidly. Therefore, high thermal conductivity materials are urgently needed to solve this problem. As traditional thermal conductive materials such as metals and inorganic materials, although thermal conductivity is good, its application fields are limited due to factors such as high brittleness, difficult processing, and electrical conductivity. Silicone polymer heat-conducting composite materials are considered to be ideal materials that can replace traditional heat-conducting materials in the field of heat control because of their light weig...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09K5/14
CPCC09K5/14
Inventor 代树高
Owner 昆山裕凌电子科技有限公司
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