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A technology of epoxy resin and high elasticity, applied in other chemical processes, chemical instruments and methods, etc., can solve problems such as changes in electrical performance indicators, insufficient elasticity, etc., and achieve a wide range of applications
Inactive Publication Date: 2010-10-27
舒城金泽信环保材料有限公司
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[0004] The invention aims to solve the deficiencies in the existing electronic product potting materials such as elasticity, toughness, low temperature resistance, and hi...
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Embodiment 1
[0029] Epoxy resin E44: 450 parts; flame retardant: 50 parts as component A
[0031] The finished product can have the following technical indicators:
[0032] Viscosity: 3000-4000cps / 25℃
[0033] Volume resistance: 2.0×1014Ω·cm
[0034] Compressive strength: 18-20kg / mm2
[0035] Temperature resistance: -40-120℃
[0036] Flame retardant: uL94vo
[0037] Proportion: A component: B component = 100:20
[0038] Curing process: curing at room temperature for 24 hours, operating time 1-2 hours.
Embodiment 2
[0040] Epoxy resin E44: 450 parts; flame retardant: 50 parts; as A component ethylenediamine 27 parts; phenol 25 parts; cyclohexanone 15 parts; acrylic acid 5 parts; B component.
[0041] The finished product can have the following technical indicators:
[0042] Viscosity: 4000-5000cps / 25℃
[0043] Volume resistance: 2.0×1014Ω·cm
[0044] Compressive strength: 18-20kg / mm2
[0045] Temperature resistance: -40-120℃
[0046] Flame retardant: uL94vo
[0047] Proportion: A component: B component = 100:20
[0048] Curing process: curing at room temperature for 24 hours, operating time is 2 to 4 hours.
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Abstract
The invention relates to a high-elasticity epoxy resin which mainly comprises an epoxy resin and an elastic curing agent. The high-elasticity epoxy resin is characterized by comprising the following components in parts by weight: 420-480 parts of epoxy resin, 20-80 parts of flame retardant agent, 25-40 parts of quadrol, 8-47 parts of accelerant, 3-26parts of binding agent, 11-32 parts of diluent and 0-17 parts of temperature resistant toughening agent. Because the high-elasticity epoxy resin adopted as an electronic potting material has the characteristics of elasticity, vibration prevention, moisture prevention, temperature resistance, heat conduction, flame retardance, electric insulation, and the like, the high-elasticity epoxy resin can ensure the long-term reliability of electronic products. The high-elasticity epoxy resin has the advantages of silicon rubber, can maintain the characteristics of the epoxy resin, has reduced cost and widely expanded application range and adds a novel potting material for the electronic industry.
Description
Technical field: [0001] A high-elastic epoxy resin relates to elastic materials, in particular to an elastic material suitable for potting electronic components. Background technique: [0002] At present, the potting materials used in the existing electronic components products have defects such as lack of rubber elasticity, insufficient toughness, and insufficient high and low temperature impact resistance, which cause internal stress concentration, which is likely to cause internal lead wire breakage of the electronic component potting compound, resulting in irreparable damage. [0003] However, after the common epoxy resin composition is used for potting electronic components, its electrical performance indicators have changed, and some circuits have been scrapped due to the breaking of the metal wires connecting the components. Such as filters, tantalum capacitors, polypropylene capacitors, metal resistors, temperature sensors... DC DC products, LED electronic products,...
Claims
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