The invention relates to a high-elasticity epoxy resin which mainly comprises an epoxy resin and an elastic curing agent. The high-elasticity epoxy resin is characterized by comprising the following components in parts by weight: 420-480 parts of epoxy resin, 20-80 parts of flame retardant agent, 25-40 parts of quadrol, 8-47 parts of accelerant, 3-26parts of binding agent, 11-32 parts of diluent and 0-17 parts of temperature resistant toughening agent. Because the high-elasticity epoxy resin adopted as an electronic potting material has the characteristics of elasticity, vibration prevention, moisture prevention, temperature resistance, heat conduction, flame retardance, electric insulation, and the like, the high-elasticity epoxy resin can ensure the long-term reliability of electronic products. The high-elasticity epoxy resin has the advantages of silicon rubber, can maintain the characteristics of the epoxy resin, has reduced cost and widely expanded application range and adds a novel potting material for the electronic industry.