Packaging carrier tape base material and preparation method thereof

A tape-based, together technology, applied in the field of packaging carrier tape base material and its preparation, can solve the problem of module height exceeding the standard, achieve the effect of improving the bonding force, solving the problem of module height exceeding the standard, and meeting the application requirements

Active Publication Date: 2019-03-12
GUANGDONG SHENGYI SCI TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The object of the present invention is to provide a packaging carrier tape base material and its preparation method. The packaging carrier tape base material provided by the invention can effectively solve the problem that the module height exceeds the standard in the UV glue packaging process, and at the same time can improve the distance between the module and the card. Binding force

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0040] An encapsulation carrier tape base material, the preparation method is as follows:

[0041] (1) First use the epoxy resin composition to impregnate the 106 type glass fiber cloth on the gluing machine, and then pass through the oven of the gluing machine to obtain a semi-cured adhesive sheet, and then bake the semi-cured adhesive sheet at 190 ° C for 1.5 h Obtain the cured sheet, then carry out sandblasting and roughening treatment to the cured sheet, and control the roughness Rz value on both sides of it to be 3 μm;

[0042] (2) After coating the adhesive on one side of the curing sheet, hot press (50°C / 1MPa) the release film, then punch holes, remove the release film and then set it by hot pressing (150°C / 0.01MPa) The metal foil is used to obtain the base material of the package carrier tape.

Embodiment 2

[0044] An encapsulation carrier tape base material, the preparation method is as follows:

[0045] (1) First use the epoxy resin composition to impregnate the 1080 type glass fiber cloth on the gluing machine, then pass through the oven of the gluing machine to obtain a prepreg adhesive sheet, and then bake the prepreg adhesive sheet at 200°C for 1h Obtain the cured sheet, and then carry out sandblasting and roughening treatment on the cured sheet, and control the roughness Rz value of both sides to be 6.5 μm;

[0046](2) Hot press (100°C / 0.3MPa) release film after coating adhesive on one side of the cured sheet, then punch holes, remove the release film and then heat press (150°C / 0.01MPa) A metal foil is installed to obtain a sealing tape substrate.

Embodiment 3

[0048] An encapsulation carrier tape base material, the preparation method is as follows:

[0049] (1) First use the epoxy resin composition to impregnate the 2116 type glass fiber cloth on the gluing machine, then pass through the oven of the gluing machine to obtain a prepreg adhesive sheet, and then bake the prepreg adhesive sheet at 100°C for 2.5 h Obtain the cured sheet, then carry out sandblasting roughening treatment to the cured sheet, and control the roughness Rz value of one side of it to be 10 μ m;

[0050] (2) After coating the adhesive on the other side of the cured sheet, hot press (80°C / 0.5MPa) release film, then punch holes, remove the release film and then pass hot press (90°C / 0.4MPa) The metal foil is arranged in a manner to obtain the base material of the packaging tape.

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Abstract

The invention provides a packaging carrier tape base material and a preparation method thereof. The packaging carrier tape substrate sequentially comprises a curing sheet, a glue film and metal foil which are laminated together from top to bottom, wherein the roughness of the side, away from the glue film, of the curing sheet is 3-10 [mu]m. By utilizing the packaging carrier tape base material, the height of UV glue is within the range of 500-580 [mu]m, application requirements can be well met, finally, binding force of a module and a card is 90 N or above, and the binding requirements of themodule and the card can also be met.

Description

technical field [0001] The invention belongs to the technical field of encapsulation base materials, and relates to an encapsulation carrier tape base material and a preparation method thereof. Background technique [0002] Smart card package carrier tape base material is the key special basic material for smart card module package, its function is to protect the chip, and as an interface between the integrated circuit chip and the outside world. Widely used in finance, mobile payment, social security, telecommunications, health, education, transportation, public safety and other fields. With the vigorous promotion of bank chip cards around the world and the gradual replacement of traditional magnetic cards, the popularization of social security cards with financial functions, and the popularization of mobile payment functions, the application of smart cards is becoming more and more extensive. [0003] In the smart card manufacturing process, there is a UV glue packaging p...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B32B17/02B32B27/04B32B27/38B32B15/20B32B17/06B32B37/06B32B37/10B32B38/00B32B38/04
CPCB32B5/02B32B15/14B32B15/20B32B37/06B32B37/10B32B38/0012B32B38/04B32B2038/0076B32B2038/002B32B2038/042B32B2260/046B32B2260/021B32B2262/101B32B2311/12B32B2425/00B32B37/1207B32B2037/1253B32B2038/0016B32B2310/14B32B7/12B32B3/266B32B2250/02B32B2307/538B32B2553/00H01L23/4828B32B17/04B32B17/061B32B37/12B32B2037/268
Inventor 汪青刘东亮刘潜发
Owner GUANGDONG SHENGYI SCI TECH
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