Method for manufacturing circuit board

Abstract

The invention discloses a method for manufacturing a circuit board. The method includes the steps that S1, a first base material layer and a second base material layer are bonded together through a prepreg; S2, a first opening is formed in the second base material layer, and the first opening penetrates through the second base material layer; S3, second openings, corresponding to the first opening in position, are formed in the first base material layer and the prepreg, and the second openings penetrate through the first base material layer and the prepreg; S4, a radiating conductor and glue blocking materials are provided; S5, laminating pretreatment is carried out on the first base material layer, the second base material layer and the radiating conductor; S6, the radiating conductor is placed into the first opening, the glue blocking materials are placed into the second openings, and lamination is conducted on the entire circuit board; S7, the glue blocking materials are taken out, and the surface of the second base material layer and the surface of the radiating conductor are ground. By means of the method for manufacturing the circuit board, the radiating problem of the circuit board can be solved, the manufacturing method of the circuit board is simple, and the embedded effect of the radiating conductor is good.

Description

Technical field [0001] The invention relates to the technical field of circuit board manufacturing technology, in particular to a manufacturing method of a circuit board. Background technique [0002] With the development of the electronics industry, the volume of electronic products is getting smaller and smaller, and the power density is getting higher and higher. How to find the best method for circuit board heat dissipation and structural design has become a huge challenge in today's electronics industry design. At present, the commonly used circuit board heat dissipation methods include two methods: using a metal substrate to make a circuit board and welding a metal substrate on the circuit board. However, these two processes have the disadvantages of large consumption of metal materials, complex manufacturing processes, high costs, and bulky volume. Especially for some products with relatively low heat dissipation power requirements, higher processing costs and complex proc...

AI Technical Summary

Problems solved by technology

[0005] But, there is following shortcoming in the circuit board that above-mentioned method makes: the radiating conductor 4 that embeds is fixed in the through groove completely by the thermal curing of the resin flow glue of prepreg 3, and resin flow glue does not pass through high-pressure curing process, makes embedding The heat dissipation conductor 4 has poor bonding force; the height difference between the embedded heat dissipation conductor 4 and the circuit board is affected by the height tolerance of the heat dissipation conductor 4 and the height tolerance of the circuit board, especially the height of the prepreg 3 cannot be determined after lamination, making the circuit The surface of the board is easy to form depressions or protrusions, which will affect the welding effect of heating components in the later stage

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