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Multi-layer board hole metallization method

A processing method and hole metallization technology, which are applied in the directions of metal pattern materials, electrical connection formation of printed components, printed circuit components, etc.

Pending Publication Date: 2021-09-10
胡磊
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Traditional black hole (carbon powder or graphite as conductive material) technology and polymer conductive film technology have been unable to meet this requirement

Method used

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  • Multi-layer board hole metallization method
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  • Multi-layer board hole metallization method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0034] Preparation of graphene slurry: 8% graphene, 0.5% tristyrene phenol polyoxyethylene ether phosphate potassium salt, 2% propylene glycol, 3.5% diethylene glycol phenyl ether, mixed with water, prepared by ball milling Slurry, solid content is 14%;

[0035] Preparation of conductive paste: adding 0.1% of palladium nanowire dispersion (such as figure 2 shown), 0.1% silver nanowire dispersion, 10% polyalkoxy modified thiophene, and 0.8% water-based polyamide wax were dispersed into a stable paste with a solid content of 25%.

Embodiment 2

[0037] Preparation of graphene slurry: 10% of graphene, 0.5% of tristyrene phenol polyoxyethylene ether phosphate potassium salt, 0.5% of tristyrene phenol polyoxyethylene ether acetate potassium salt, and 4% of diethylene glycol phenyl ether , mixed with water, and prepared into a slurry by ball milling, with a solid content of 15%;

[0038] Preparation of conductive paste: 0.05% of copper nanowire dispersion, 0.15% of silver nanowire dispersion, 6% of polyalkoxy modified thiophene, and 3% of polystyrene sulfonic acid were added to graphene slurry with a solid content of 15%. %, fumed silica 0.1%, water-based polyamide wax 0.4%, high-speed dispersion into a stable paste with a solid content of 24.7%.

Embodiment 3

[0040] Preparation of graphene slurry: 9% graphene, 0.1% potassium tristyrene phenol polyoxyethylene ether phosphate, 0.4% potassium tristyrene phenol polyoxyethylene ether acetate, 2% propylene glycol, diethylene glycol 3% phenyl ether, mixed with water, prepared into a slurry by ball milling, with a solid content of 14.5%;

[0041] Preparation of conductive paste: Add 0.1% silver nanowire dispersion liquid, 7% alkoxy modified thiophene, 2.5% polystyrene base sulfonic acid, 0.1% carbomer to the graphene slurry with a solid content of 14.5%, water-based Polyamide wax 0.4%, high-speed dispersion into a stable paste, solid content of 24.6%.

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Abstract

The invention discloses a multilayer board hole metallization method. The conductivity of graphene, a metal nanowire material and a conductive polymer material and the film-forming property of the conductive polymer material are used to perform conductive treatment on a non-metal surface, the treated non-metal surface is high in conductivity and strong in film binding force, and a traditional tin-palladium colloid treatment method can be replaced. The method provided by the invention is stable in performance, simple to operate, easy to control and low in cost, and the production process is pollution-free and more environment-friendly.

Description

technical field [0001] The invention belongs to the technical field of printed circuit boards, and in particular relates to a hole metallization method for multilayer boards. Background technique [0002] In the traditional printed circuit board processing, hole metallization is mainly done by chemical copper (PTH), and its process is cumbersome. As the price of palladium continues to rise in recent years, the price of the PTH process has become more expensive, and many companies have been unable to afford this processing, and the process will need to use EDTA, formaldehyde and other environmental pollutants. Therefore, there is an urgent need for a green Environmentally friendly process to replace the hole metallization process. [0003] Black hole technology is a new method that emerged in this environment. It uses carbon powder or graphite with strong conductivity as a conductive material (imported technology has been commercialized), and prepares its slurry to replace t...

Claims

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Application Information

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IPC IPC(8): H05K3/42H05K1/09
CPCH05K3/422H05K3/429H05K1/095
Inventor 胡磊
Owner 胡磊
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