Manufacturing method for locally burying copper block and conducting internal-layer lead wire

Abstract

The invention discloses a manufacturing method for locally burying a copper block and conducting an internal-layer lead wire. The method comprises the following steps: 1, arranging a groove and burying copper; 2, filling; 3, pressing; 4, boring; 5, metallization; and 6, subsequent processing. By use of high pressure in a lamination process and heat curing of prepreg scaled resin flow glue, the copper block or other heat dissipation conductors are fixed in a through groove of a motherboard substrate layer, the problem of poor binding force of the copper block or the heat dissipation conductors is solved, a through hole is drilled at a junction of the copper block and a motherboard printed circuit board (PCB) by use of a drilling machine tool, the aperture size is designed according to the interval between the copper block and an internal layer of the motherboard PCB, it is ensured that the copper block is connected with an internal-layer design copper lead wire, the drilled through hole is plated with a layer of copper with a thickness of 30[mu]m by use of an electroplating flow, and the copper block and the internal-layer copper lead wire are conducted. A PCB manufactured by use of the manufacturing method solves the problem of incapability of conducting the copper block with the buried motherboard internal layer and has the advantages of good heat dissipation effect, huge market potential and wide prospect.

Description

technical field [0001] The invention belongs to the field of building materials. More specifically, the invention relates to a method for conducting conduction between a partially embedded copper block and an inner layer wire. Background technique [0002] With the development of the electronics industry, the size of electronic products is getting smaller and smaller, and the power density is getting higher and higher. How to find the best method for heat dissipation and structural design has become a huge challenge for today's electronics industry design. At present, the commonly used heat dissipation methods generally include the use of metal substrates to make circuit boards and the welding of metal substrates on circuit boards. However, both of these two processes have the disadvantages of large consumption of metal materials, complicated manufacturing processes, high cost, and bulky volume. For some occasions where the heat dissipation power requirement is relatively lo...

AI Technical Summary

Problems solved by technology

At present, the commonly used heat dissipation methods generally include making circuit boards with metal substrates and welding metal substrates on circuit boards. However, both of these two processes have the disadvantages of large consumption of metal materials, complicated manufacturing processes, high cost, and bulky volume.

For some occasions where the heat dissipation power requirement is relatively low, the high processing cost and the complicated process of welding metal substrates can no longer meet the market demand. At present, there is a relatively new method in the circuit board manufacturing industry to solve the problem of heat dissipation and cost—local embedding Copper block PCB board, but the buried copper block circuit board is insulated from the embedded copper block and the mother board by insulating resin glue, and cannot be connected to the inner layer. This method can effectively solve the bottleneck in the production of this type of circuit board