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Method for preparing silicon-free thermal conductive adhesive

A technology of thermally conductive adhesive and thermally conductive filler, which is applied in the field of thermally conductive adhesives, can solve problems such as surface cracking, large thermal impedance, and high hardness of silicon-free thermally conductive adhesives, and achieve the effects of preventing surface cracking, reducing hardness and thermal impedance

Active Publication Date: 2018-12-18
东莞市兆科电子材料科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0005] The purpose of the present invention is to provide a method for preparing a silicon-free thermally conductive adhesive, which can efficiently mix and fully react each component of the silicon-free thermally conductive adhesive to make a high-performance silicon-free thermally conductive adhesive to solve the problem of non-silicon thermally conductive adhesive. Silicone thermally conductive adhesive has problems such as high hardness, surface cracking, and large thermal impedance

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  • Method for preparing silicon-free thermal conductive adhesive
  • Method for preparing silicon-free thermal conductive adhesive
  • Method for preparing silicon-free thermal conductive adhesive

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[0013] A method for preparing a silicon-free thermally conductive adhesive, comprising the following steps in sequence:

[0014] (1) Stir and mix the thermally conductive filler, part of the acrylic resin and some of the additives;

[0015] (2) Carrying out the first heating and curing treatment to obtain solid B;

[0016] (3) Add remaining acrylic resin and auxiliary agent in solid B and carry out banburying treatment;

[0017] (4) Carry out the second heat curing treatment.

[0018] Preferably, the step (1) is to stir and mix the formulated amount of 90-98% acrylic resin and 90-98% of the formulated amount of additives, and then add the formulated amount of heat-conducting filler for stirring and mixed treatment. Stir and mix the liquid acrylic resin and additives evenly, and then add the solid heat-conducting filler, which is more conducive to the uniform dispersion of the heat-conducting filler.

[0019] Preferably, the heating temperature of the first heat curing treat...

Embodiment 1

[0034] A method for preparing a silicon-free thermally conductive adhesive, comprising the following steps in sequence:

[0035] (1) Stir and mix the thermally conductive filler, part of the acrylic resin and some of the additives;

[0036] (2) Carrying out the first heating and curing treatment to obtain solid B;

[0037] (3) Add remaining acrylic resin and auxiliary agent in solid B and carry out banburying treatment;

[0038] (4) Carry out the second heat curing treatment.

[0039] Wherein, the kind and weight parts of acrylic resin, auxiliary agent and heat-conducting filler select any component in Table 1, and in step (1), part of acrylic resin accounts for 90% of the total number of acrylic resin, and part of auxiliary agent accounts for 90% of the total number of additives.

Embodiment 2

[0052] A method for preparing a silicon-free thermally conductive adhesive, comprising the following steps in sequence:

[0053] (1) Stir and mix the thermally conductive filler, part of the acrylic resin and some of the additives;

[0054] (2) Carrying out the first heat curing treatment at 110° C. for 4 hours to obtain solid B;

[0055] (3) Add the remaining acrylic resin and additives to solid B and carry out banburying treatment at 75°C for 30 minutes;

[0056] (4) Carry out the second heat curing treatment at 110° C. for 4 hours.

[0057] Wherein, the type of acrylic resin, additives and thermally conductive fillers and the parts by weight thereof are selected from component 3 in Table 1. In step (1), part of the acrylic resin accounts for 95% of the total number of acrylic resins, and part of the auxiliary agent accounts for 95% of the total parts of the acrylic resin. 95% of the total number of doses.

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Abstract

The invention provides a method for preparing a silicon-free thermal conductive adhesive, and the method comprises the following steps in sequence: (1) stirring and mixing a heat conductive filler, apart of acrylic resin and a part of an auxiliary agent; (2) performing first heating curing treatment to obtain a solid B; (3) adding the remaining acrylic resin and the remaining auxiliary agent to the solid B for mixing treatment; and (4) performing second heating curing treatment. By adding the remaining acrylic resin and auxiliary agent to the solid B and performing the mixing treatment, a joint structure among the internal components of the solid B is destroyed, and the remaining acrylic resin and auxiliary agent are infiltrated inside the dispersed solid B during the mixing process to improves the bonding force between the components, and after the second heating curing treatment, another better connection structure is reestablished to prevent the surface of the silicon-free thermalconductive rubber from cracking and reduce the hardness and thermal impedance of the silicon-free thermal conductive adhesive.

Description

technical field [0001] The invention relates to the technical field of thermally conductive adhesives, in particular to a preparation method of a silicon-free thermally conductive adhesive. Background technique [0002] With the rapid development of automobiles, electronics, computers and other fields, automobiles, electronic devices, computers, etc. are developing in the direction of miniaturization, precision, and high power. A large amount of heat is generated, and the generated heat must be transferred to the outside, otherwise it will affect its working performance or cause internal damage, and miniaturization, precision, and high-power automobiles, electronic devices, computers, etc. have requirements for the dissipation efficiency of internal heat higher. Part of the heat generated inside is transferred by the air in the inner space, but the heat transfer efficiency of the air is low, and most of the heat is transferred from the inside to the outside through the comp...

Claims

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Application Information

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IPC IPC(8): C09J133/00C09J11/04
CPCC08K2003/2227C09J11/04C09J133/00C08K3/22C08K3/04C08K3/042
Inventor 廖志盛
Owner 东莞市兆科电子材料科技有限公司