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Peeling device

A peeling device and wafer technology, which is applied in the manufacture of electrical components, electrical solid devices, semiconductor/solid devices, etc., can solve the problems of unprotected parts peeling, uneven thickness of the outer peripheral part, etc.

Pending Publication Date: 2019-01-01
DISCO CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] However, even with the peeling device described in Patent Document 1, resin remains on the outer peripheral portion of the wafer, and the protective member cannot be properly peeled off.
In this case, in the subsequent grinding process, the thickness of the outer peripheral part may become uneven

Method used

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Examples

Experimental program
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Embodiment Construction

[0028] Hereinafter, the peeling apparatus of this embodiment is demonstrated with reference to drawings. figure 1 It is an overall perspective view of the peeling device of this embodiment. In addition, the peeling device of this embodiment is not limited to figure 1 The shown device structure for peeling can also be incorporated into a fully automatic type processing device that automatically performs a series of operations such as grinding, grinding, and cleaning, for example. In addition, in figure 1 Among them, the front side in the X-axis direction is taken as the front side of the peeling device, the rear side in the X-axis direction is taken as the back side of the peeling device, the front side in the Y-axis direction is taken as the left side of the peeling device, and the back side in the Y-axis direction is taken as the peeling device to the right of the . Also, for the sake of illustration, figure 1 The wafers shown are exaggerated to show size.

[0029] Such ...

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PUM

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Abstract

A peeling device is provided, for exfoliating a protect member appropriately from a wafer, without leaving resin to the peripheral part of a wafer. A peeling device (1) exfoliates from a wafer a protect member (P) which fixed a film to one surface of a wafer (W) via resin (R). A peeling device is provided with the following. A periphery stripping means (4) which leaves a part of periphery of a protect member, and exfoliates a protect member from a wafer. A whole stripping means (5) which exfoliates the whole protect member from a wafer. A whole stripping means is provided with a hold part (50)which holds a part of periphery which remained without exfoliating in a periphery stripping means, and a roller part (52b) which presses a lower surface center portion of a protect member. A whole stripping means exfoliates all protect members, pressing a center portion of a protect member in a roller part toward a wafer.

Description

technical field [0001] The present invention relates to a peeling device for peeling off a film attached to the front surface of a wafer. Background technique [0002] Undulations are formed on the front surface of a wafer cut out from an ingot such as silicon and sliced. In order to remove waviness, a sheet (referred to as a film in the present invention) is attached as a protective member to the front surface of the wafer via a liquid resin. After the shape of the front side of the wafer is transferred to the liquid resin and the liquid resin is cured, grinding is performed on the opposite side of the wafer to remove undulations. After grinding, the hardened resin and sheet are peeled off from the wafer. [0003] However, when the liquid resin is supplied to the front surface of the wafer and the sheet is pasted, the liquid resin spreads, and the liquid resin protrudes from the outer periphery (edge) of the wafer. The liquid resin is hardened by irradiation with ultravi...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/683
CPCH01L21/6836H01L2221/68386
Inventor 清原恒成广内大资
Owner DISCO CORP