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A heat dissipation dustproof protective cover for electronic components

A technology for electronic components and dust protection, which is applied to electrical components, electrical equipment structural parts, electrical equipment casings/cabinets/drawers, etc. Simple structure, good market prospect and guaranteed cleaning effect

Inactive Publication Date: 2019-01-08
岳池县天台小学校
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] At present, with the innovation and development of science and technology, more and more electronic technologies are used. Some circuit boards are often used for heat dissipation without adding a shell, which easily causes the electronic components on the circuit board to be easily stained with dust.

Method used

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  • A heat dissipation dustproof protective cover for electronic components

Examples

Experimental program
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Embodiment Construction

[0010] The embodiments of the present invention will be further described below in conjunction with the accompanying drawings.

[0011] Such as figure 1 As shown, a heat dissipation and dustproof protective cover for electronic components provided in this embodiment includes a cover body 1, a cavity 2 is provided in the cover body 1, and a heat-absorbing material is filled in the cavity 2. The housing 1 is provided with an accommodating space 3 for shielding electronic components.

[0012] In order to improve the heat dissipation effect of the cover body 1 , a plurality of cooling strips 4 can be arranged on the cover body 1 , the cooling strips 4 are evenly spaced, and a cooling channel 5 is provided between two adjacent cooling strips 4 .

[0013] In order to make the connection between the cover body 1 and the circuit board more convenient, a plurality of fixing strips 6 can be provided on the lower end surface of the cover body 1 .

[0014] The present invention is not l...

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PUM

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Abstract

The invention particularly relates to a heat dissipation dust-proof protective cover for electronic components, comprising a cover body, wherein a cavity is arranged in the cover body, the cavity is filled with heat-absorbing material, and an accommodating space for shielding electronic components is arranged on the cover body. The device not only ensures good heat dissipation, but also ensures the cleanness of electronic components. At the same time, the device has simple structure and low cost, so it has a good market prospect.

Description

technical field [0001] The invention specifically relates to a heat dissipation and dustproof protective cover for electronic components. Background technique [0002] At present, with the innovation and development of science and technology, more and more electronic technologies are used. Some circuit boards are often used for heat dissipation without adding a casing, which easily causes the electronic components on the circuit board to be easily stained with dust. Contents of the invention [0003] In order to solve the above technical problems, the object of the present invention is to provide a heat dissipation and dustproof protective cover for electronic components. [0004] The technical solution adopted in the present invention is: a heat dissipation and dustproof protective cover for electronic components, including a cover body, a cavity is provided in the cover body, and the cavity is filled with heat-absorbing materials, and the cover body is provided with The...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K7/20H05K5/00
CPCH05K7/20436H05K5/00H05K7/2039
Inventor 范萍
Owner 岳池县天台小学校